JP6632685B2 - 貼合体 - Google Patents
貼合体 Download PDFInfo
- Publication number
- JP6632685B2 JP6632685B2 JP2018198628A JP2018198628A JP6632685B2 JP 6632685 B2 JP6632685 B2 JP 6632685B2 JP 2018198628 A JP2018198628 A JP 2018198628A JP 2018198628 A JP2018198628 A JP 2018198628A JP 6632685 B2 JP6632685 B2 JP 6632685B2
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- JP
- Japan
- Prior art keywords
- film
- bonding
- organic solvent
- fine particles
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B27/00—Layered products comprising a layer of synthetic resin
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- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Description
接合フィルム13は、半導体ウエハ1が貼り合わされてダイシングされた後、個片化された半導体素子2をピックアップする際に、粘着フィルム12から剥離して半導体素子2に付着してピックアップされ、半導体素子2を基板40に固定する際の接合材として使用されるものである。従って、接合フィルム13は、ピックアップ工程において、個片化された半導体素子2に付着したままの状態で、粘着フィルム12から剥離することができる粘着性と剥離性を有し、さらに、半導体素子2と基板40とを接合して、十分な接合信頼性を有するものである。ピックアップ工程については図5を参照して後述する。
なお、本発明においてタック性とは、接着性を意味し、具体的には、導電性接合層13aを半導体ウエハ1や半導体素子2に保持させることのできる接着性を意味する。
導電性ペーストは、金属微粒子(P)を含む他、有機分散媒(D)を含むことが好ましい。
タック層13bは、導電性接合層13aを半導体ウエハ1や半導体素子2に保持させるためのものであり、タック性を有している。また、タック層13bは、半導体素子2と基板40とを接合する際の加熱により熱分解される。タック層13bは、このような性質を有するものであれば、特に限定されるものではなくどのようなもので構成されていてもよい。
粘着フィルム12は、半導体ウエハ1をダイシングする際には接合フィルム13に保持された半導体ウエハ1が剥離しないように十分な粘着力を有し、ダイシング後に個片化された半導体素子2をピックアップする際には容易に接合フィルム13から剥離できるような低い粘着力を有するものである。本参考形態において、粘着フィルム12は、図1に示すように、基材フィルム12aに粘着剤層12bを設けたものを例示したが、これに限定されるものではなく、ダイシングテープとして使用される公知の粘着フィルムを用いることができる。
半導体装置100(図6参照)の製造工程の中で、ウエハ加工用テープ10は、以下のように使用される。図2においては、ウエハ加工用テープ10に、半導体ウエハ1とリングフレーム20とが貼り合わされた様子が示されている。
まず、図2に示すように、粘着フィルム12の粘着剤層12bをリングフレーム20に貼り付け、半導体ウエハ1を接合フィルム13のタック層13bに貼り合わせる。これらの貼り付け順序に制限はなく、半導体ウエハ1を接合フィルム13に貼り合わせた後に粘着フィルム12の粘着剤層12bをリングフレーム20に貼り付けても良い。また、粘着フィルム12のリングフレーム20への貼り付けと、半導体ウエハ1の接合フィルム13への貼り合わせとを、同時に行っても良い。
金属微粒子を走査型電子顕微鏡(SEM)によって、無作為に10個選択された粒子の断面を観察し、その断面の二次元形状に対する最大内接円の直径を測定し、その平均値を求める。尚、電子顕微鏡の断面写真において、二次元形状が略円形状である場合はその円の直径、略楕円形状である場合はその楕円の短径、略正方形状である場合はその正方形の辺の長さ、略長方形状である場合はその長方形の短辺の長さを測定する。
(2)平均空孔径の測定方法
「平均空孔径」は、走査型電子顕微鏡(SEM)を用いて無作為に選択された10〜20の空孔径の断面形状を観察して計測し、その平均値とする。
(3)空隙率の測定方法
空隙率の測定は、透過型電子顕微鏡(TEM)により、電子顕微鏡写真を撮り、その断面像の解析で決定することができる。また、空孔サイズが100nmより小さい場合の空隙率はウルトラミクロトーム法により薄片化することで、透過型電子顕微鏡(TEM)で観察して測定する。
水溶液中で銅イオンからの無電解還元により調製された、平均一次粒子径150nmの銅微粒子70質量%と、有機溶剤としてグリセロール40体積%、N−メチルアセトアミド55体積%、及びトリエチルアミン5体積%からなる混合溶剤(有機溶剤(S1)に相当する)95質量%と有機バインダーとしてエチルセルロース(平均分子量1000,000)5質量%からなる有機分散媒30質量%とを混錬して、導電性ペーストを調製した。
平均一次粒径100nmの銀微粒子(シグマ アルドリッチ ジャパン合同会社製、型番:730777)70質量%と、有機溶剤としてグリセロール40体積%、N−メチルアセトアミド55体積%、及びトリエチルアミン5体積%からなる混合溶剤(有機溶剤(S1)に相当する)95質量%と有機バインダーとしてエチルセルロース(平均分子量1000,000)5質量%からなる有機分散媒30質量%とを混錬して、導電性ペーストを調製した。
なお、ポリプロピレン(PP)は、日本ポリケム株式会社製のノバテックFG4を用い、水添スチレンブタジエン(HSBR)はJSR株式会社製のダイナロン1320Pを用いた。また、塗工用フィルムはシリコーン離型処理されたPETフィルム(帝人:ヒューピレックスS−314、厚み25μm)を用いた。
10:ウエハ加工用テープ
11:離型フィルム
12:粘着フィルム
12a:基材フィルム
12b:粘着剤層
13:接合フィルム
13a:導電性接合層
13b:タック層
40:基板
Claims (8)
- 基材フィルムと該基材フィルム上に設けられた粘着剤層とを有する粘着フィルムと、
半導体素子と基板とを接合するための接合フィルムと、
半導体ウエハとが貼合された貼合体であって、
前記接合フィルムは、金属微粒子(P)を含む導電性ペーストがフィルム状に成形された導電性接合層と、タック性を有し、前記導電性接合層に積層されたタック層とを有し、
前記導電性接合層が前記粘着剤層に貼合され、前記半導体ウエハは前記タック層に貼合されており、
前記タック層は、熱分解可能であり、かつ前記金属微粒子(P)を還元させる物質を含み、接合時の加熱により、前記タック層が熱分解され、前記導電性接合層の前記金属微粒子(P)が焼結することによって、前記半導体素子と前記基板とが接合されることを特徴とする貼合体。 - 前記半導体ウエハおよび前記接合フィルムは、半導体素子単位に切断され個片化されていることを特徴とする請求項1に記載の貼合体。
- 前記金属微粒子(P)は、平均一次粒径が10〜500nmであり、前記導電性ペーストは、有機溶剤(S)を含むことを特徴とする請求項1または請求項2に記載の貼合体。
- 前記金属微粒子(P)は、銅または銀からなることを特徴とする請求項1から請求項3に記載の貼合体。
- 前記導電性ペーストは、有機バインダー(R)を含むことを特徴とする請求項1から請求項4に記載の貼合体。
- 前記タック層は、ポリグリセリン、グリセリン脂肪酸エステル、ポリグリセリン脂肪酸エステル、ホスフィン類、ホスファイト類、スルフィド類、ジスルフィド類、トリスルフィド類、およびスルホキシド類の中から選択される1種もしくは2種以上からなることを特徴とする請求項1から請求項5のいずれか一項に記載の貼合体。
- 前記有機溶剤(S)は、常圧における沸点が100℃以上でかつ分子中に1または2以上のヒドロキシル基を有するアルコールおよび/もしくは多価アルコールからなる有機溶剤(SC)を含むことを特徴とする請求項3から請求項6のいずれか一項に記載の貼合体。
- 前記有機バインダー(R)は、セルロース樹脂系バインダー、アセテート樹脂系バインダー、アクリル樹脂系バインダー、ウレタン樹脂系バインダー、ポリビニルピロリドン樹脂系バインダー、ポリアミド樹脂系バインダー、ブチラール樹脂系バインダー、およびテルペン系バインダーの中から選択される1種または2種以上であることを特徴とする請求項4から請求項7のいずれか一項に記載の貼合体。
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US20210348038A1 (en) | 2021-11-11 |
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US20190264072A1 (en) | 2019-08-29 |
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