JP6625872B2 - 配線基板及び配線基板の製造方法 - Google Patents

配線基板及び配線基板の製造方法 Download PDF

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Publication number
JP6625872B2
JP6625872B2 JP2015229511A JP2015229511A JP6625872B2 JP 6625872 B2 JP6625872 B2 JP 6625872B2 JP 2015229511 A JP2015229511 A JP 2015229511A JP 2015229511 A JP2015229511 A JP 2015229511A JP 6625872 B2 JP6625872 B2 JP 6625872B2
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Japan
Prior art keywords
layer
wiring
seed layer
plating
pattern
Prior art date
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Active
Application number
JP2015229511A
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English (en)
Japanese (ja)
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JP2017098422A (ja
JP2017098422A5 (enExample
Inventor
京太 山村
京太 山村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2015229511A priority Critical patent/JP6625872B2/ja
Priority to US15/355,757 priority patent/US9814138B2/en
Publication of JP2017098422A publication Critical patent/JP2017098422A/ja
Publication of JP2017098422A5 publication Critical patent/JP2017098422A5/ja
Application granted granted Critical
Publication of JP6625872B2 publication Critical patent/JP6625872B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2015229511A 2015-11-25 2015-11-25 配線基板及び配線基板の製造方法 Active JP6625872B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015229511A JP6625872B2 (ja) 2015-11-25 2015-11-25 配線基板及び配線基板の製造方法
US15/355,757 US9814138B2 (en) 2015-11-25 2016-11-18 Wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015229511A JP6625872B2 (ja) 2015-11-25 2015-11-25 配線基板及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2017098422A JP2017098422A (ja) 2017-06-01
JP2017098422A5 JP2017098422A5 (enExample) 2018-10-11
JP6625872B2 true JP6625872B2 (ja) 2019-12-25

Family

ID=58719738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015229511A Active JP6625872B2 (ja) 2015-11-25 2015-11-25 配線基板及び配線基板の製造方法

Country Status (2)

Country Link
US (1) US9814138B2 (enExample)
JP (1) JP6625872B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3979774A4 (en) * 2019-05-31 2022-07-27 Toppan Inc. Multilayer circuit board and method for manufacturing same
DE102020130962A1 (de) 2020-05-29 2021-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Halbleitervorrichtung und herstellungsverfahren
US11894318B2 (en) 2020-05-29 2024-02-06 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and method of manufacture
KR20220135442A (ko) 2021-03-30 2022-10-07 삼성전기주식회사 연결구조체 내장기판 및 이를 포함하는 기판구조체
JP2023031643A (ja) * 2021-08-25 2023-03-09 アオイ電子株式会社 配線基板およびその製造方法
CN118056476A (zh) * 2022-03-29 2024-05-17 住友电气工业株式会社 印刷布线板用基板以及印刷布线板
JP2024093387A (ja) * 2022-12-27 2024-07-09 新光電気工業株式会社 配線基板及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5897368A (en) * 1997-11-10 1999-04-27 General Electric Company Method of fabricating metallized vias with steep walls
JP3594894B2 (ja) 2000-02-01 2004-12-02 新光電気工業株式会社 ビアフィリングめっき方法
JP2007173683A (ja) * 2005-12-26 2007-07-05 Nec Toppan Circuit Solutions Inc プリント配線板の製造方法及びプリント配線板並びにめっき・エッチング・研磨処理装置
JP5623030B2 (ja) * 2009-06-15 2014-11-12 上村工業株式会社 プリント配線基板の製造方法
CN103635035B (zh) * 2012-08-29 2016-11-09 宏启胜精密电子(秦皇岛)有限公司 电路板及其制作方法
JP6009300B2 (ja) * 2012-09-27 2016-10-19 新光電気工業株式会社 配線基板及びその製造方法
US20140151095A1 (en) * 2012-12-05 2014-06-05 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same
JP2016032066A (ja) * 2014-07-30 2016-03-07 イビデン株式会社 プリント配線基板

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Publication number Publication date
US9814138B2 (en) 2017-11-07
US20170150603A1 (en) 2017-05-25
JP2017098422A (ja) 2017-06-01

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