JP6624599B2 - 基板処理装置および処理液吐出方法 - Google Patents
基板処理装置および処理液吐出方法 Download PDFInfo
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- JP6624599B2 JP6624599B2 JP2015155199A JP2015155199A JP6624599B2 JP 6624599 B2 JP6624599 B2 JP 6624599B2 JP 2015155199 A JP2015155199 A JP 2015155199A JP 2015155199 A JP2015155199 A JP 2015155199A JP 6624599 B2 JP6624599 B2 JP 6624599B2
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- processing liquid
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- 239000007788 liquid Substances 0.000 title claims description 413
- 238000012545 processing Methods 0.000 title claims description 351
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- 238000000034 method Methods 0.000 title claims description 21
- 238000007599 discharging Methods 0.000 claims description 55
- 238000011144 upstream manufacturing Methods 0.000 claims description 28
- 230000008569 process Effects 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 6
- 239000000126 substance Substances 0.000 description 221
- 239000002245 particle Substances 0.000 description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 238000010586 diagram Methods 0.000 description 12
- 239000002585 base Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
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- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
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- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
- DKAGJZJALZXOOV-UHFFFAOYSA-N hydrate;hydrochloride Chemical compound O.Cl DKAGJZJALZXOOV-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
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- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015155199A JP6624599B2 (ja) | 2015-08-05 | 2015-08-05 | 基板処理装置および処理液吐出方法 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015155199A JP6624599B2 (ja) | 2015-08-05 | 2015-08-05 | 基板処理装置および処理液吐出方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017034188A JP2017034188A (ja) | 2017-02-09 |
| JP2017034188A5 JP2017034188A5 (ko) | 2018-09-13 |
| JP6624599B2 true JP6624599B2 (ja) | 2019-12-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015155199A Active JP6624599B2 (ja) | 2015-08-05 | 2015-08-05 | 基板処理装置および処理液吐出方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6624599B2 (ko) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6959743B2 (ja) * | 2017-02-22 | 2021-11-05 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| JP6975018B2 (ja) * | 2017-02-22 | 2021-12-01 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| WO2018155054A1 (ja) * | 2017-02-27 | 2018-08-30 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP6975630B2 (ja) * | 2017-02-27 | 2021-12-01 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP6986933B2 (ja) * | 2017-11-08 | 2021-12-22 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11147067A (ja) * | 1997-11-17 | 1999-06-02 | Dainippon Screen Mfg Co Ltd | 基板処理液供給機構 |
| JP5030767B2 (ja) * | 2007-12-25 | 2012-09-19 | 大日本スクリーン製造株式会社 | 基板処理装置、および基板処理装置の異常処理方法 |
| JP5319942B2 (ja) * | 2008-03-18 | 2013-10-16 | 大日本スクリーン製造株式会社 | ダイヤフラムバルブおよびこれを備えた基板処理装置 |
| JP5753352B2 (ja) * | 2010-07-20 | 2015-07-22 | 株式会社Ｓｃｒｅｅｎホールディングス | ダイヤフラムバルブおよびこれを備えた基板処理装置 |
| JP5887089B2 (ja) * | 2011-09-14 | 2016-03-16 | アドバンス電気工業株式会社 | 液体供給装置 |
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- 2015-08-05 JP JP2015155199A patent/JP6624599B2/ja active Active
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| Publication number | Publication date |
|---|---|
| JP2017034188A (ja) | 2017-02-09 |
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