JP6624351B2 - モジュール部品 - Google Patents
モジュール部品 Download PDFInfo
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- JP6624351B2 JP6624351B2 JP2019534984A JP2019534984A JP6624351B2 JP 6624351 B2 JP6624351 B2 JP 6624351B2 JP 2019534984 A JP2019534984 A JP 2019534984A JP 2019534984 A JP2019534984 A JP 2019534984A JP 6624351 B2 JP6624351 B2 JP 6624351B2
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- resin
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- 239000000758 substrate Substances 0.000 claims description 30
- 239000000696 magnetic material Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 description 81
- 239000011347 resin Substances 0.000 description 81
- 239000003990 capacitor Substances 0.000 description 15
- 238000005192 partition Methods 0.000 description 10
- 229910000859 α-Fe Inorganic materials 0.000 description 10
- 230000005855 radiation Effects 0.000 description 7
- 239000000843 powder Substances 0.000 description 6
- 238000004382 potting Methods 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 230000001902 propagating effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
基板と、
前記基板の一方主面に実装された複数の実装部品と、
前記複数の実装部品それぞれのグランド電極と異なる電極の少なくとも一部を覆う非磁性体と、
前記基板の一方主面、前記複数の実装部品、および、前記非磁性体を覆う磁性体と、
を備え、
前記複数の実装部品それぞれのグランド電極は、前記磁性体と接した状態で前記磁性体によって覆われていることを特徴とする。
前記磁性体を覆う金属層をさらに備え、
前記金属層はグランドと接続されていてもよい。
前記グランド電極は前記磁性体によって覆われ、前記グランド電極とは異なる1つの電極は前記非磁性体によって覆われていてもよい。
図1は、第1の実施形態におけるモジュール部品100の上面模式図である。図2は、モジュール部品100を、図1のII−II線で切断した場合の断面図である。また、図3は、図1および図2に示すモジュール部品100の等価回路図である。
図5は、第2の実施形態におけるモジュール部品100Aの断面図である。第2の実施形態におけるモジュール部品100Aは、第1の実施形態におけるモジュール部品100の構成に加えて、磁性樹脂40を覆う金属層50をさらに備える。金属層50は、モジュール部品の外側を覆う金属シールドとして機能する。
図6を参照しながら、第2の実施形態におけるモジュール部品100Aの製造方法について説明する。
20 実装部品
21 IC
21a 第1の端子電極(グランド電極)
21b 第2の端子電極
21c 第3の端子電極
22 入力側コンデンサ
22a 第1の外部電極(グランド電極)
22b 第2の外部電極
23 出力側コンデンサ
23a 第3の外部電極(グランド電極)
23b 第4の外部電極
24 インダクタ
24a 第5の外部電極
24b 第6の外部電極
30 非磁性樹脂
40 磁性樹脂
50 金属層
61 全体仕切り
62 部分仕切り
100 第1の実施形態におけるモジュール部品
100A 第2の実施形態におけるモジュール部品
Claims (6)
- 基板と、
前記基板の一方主面に実装された複数の実装部品と、
前記複数の実装部品それぞれのグランド電極と異なる電極の少なくとも一部を覆う非磁性体と、
前記基板の一方主面、前記複数の実装部品、および、前記非磁性体を覆う磁性体と、
を備え、
前記複数の実装部品それぞれの前記グランド電極は、前記磁性体と接した状態で前記磁性体によって覆われていることを特徴とするモジュール部品。 - 前記非磁性体は、前記複数の実装部品を個別に覆うように設けられていることを特徴とする請求項1に記載のモジュール部品。
- 前記磁性体を覆う金属層をさらに備え、
前記金属層はグランドと接続されていることを特徴とする請求項1または2に記載のモジュール部品。 - 前記非磁性体は、グランドと接続されている配線以外の配線も覆うように構成されていることを特徴とする請求項1〜3のいずれかに記載のモジュール部品。
- 前記複数の実装部品には、前記グランド電極を含む複数の電極を有するICが含まれていることを特徴とする請求項1〜4のいずれかに記載のモジュール部品。
- 前記複数の実装部品には、1つの前記グランド電極と、前記グランド電極とは異なる1つの電極とを有する電子部品が含まれており、
前記グランド電極は前記磁性体によって覆われ、前記グランド電極とは異なる1つの電極は前記非磁性体によって覆われていることを特徴とする請求項1〜5のいずれかに記載のモジュール部品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017171824 | 2017-09-07 | ||
JP2017171824 | 2017-09-07 | ||
PCT/JP2018/025242 WO2019049493A1 (ja) | 2017-09-07 | 2018-07-03 | モジュール部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019049493A1 JPWO2019049493A1 (ja) | 2019-11-07 |
JP6624351B2 true JP6624351B2 (ja) | 2019-12-25 |
Family
ID=65635353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019534984A Active JP6624351B2 (ja) | 2017-09-07 | 2018-07-03 | モジュール部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20190363031A1 (ja) |
JP (1) | JP6624351B2 (ja) |
WO (1) | WO2019049493A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022065246A1 (ja) * | 2020-09-24 | 2022-03-31 | 株式会社村田製作所 | 電子部品モジュール、および、電子部品モジュールの製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6218739A (ja) * | 1985-07-18 | 1987-01-27 | Sumitomo Electric Ind Ltd | 混成集積回路 |
JPH0543567U (ja) * | 1991-02-26 | 1993-06-11 | 富士電気化学株式会社 | 電磁波シールドプリント配線板 |
US10157855B2 (en) * | 2015-06-03 | 2018-12-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor device including electric and magnetic field shielding |
JP6617497B2 (ja) * | 2015-09-25 | 2019-12-11 | Tdk株式会社 | 半導体パッケージの製造方法 |
JP5988003B1 (ja) * | 2016-03-23 | 2016-09-07 | Tdk株式会社 | 電子回路パッケージ |
-
2018
- 2018-07-03 WO PCT/JP2018/025242 patent/WO2019049493A1/ja active Application Filing
- 2018-07-03 JP JP2019534984A patent/JP6624351B2/ja active Active
-
2019
- 2019-08-07 US US16/533,824 patent/US20190363031A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20190363031A1 (en) | 2019-11-28 |
JPWO2019049493A1 (ja) | 2019-11-07 |
WO2019049493A1 (ja) | 2019-03-14 |
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