JP6622105B2 - 平面研磨装置 - Google Patents

平面研磨装置 Download PDF

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Publication number
JP6622105B2
JP6622105B2 JP2016023536A JP2016023536A JP6622105B2 JP 6622105 B2 JP6622105 B2 JP 6622105B2 JP 2016023536 A JP2016023536 A JP 2016023536A JP 2016023536 A JP2016023536 A JP 2016023536A JP 6622105 B2 JP6622105 B2 JP 6622105B2
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JP
Japan
Prior art keywords
cable
surface plate
rotary joint
stationary
polishing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016023536A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017140671A5 (https=
JP2017140671A (ja
Inventor
茂 小田桐
茂 小田桐
井上　裕介
裕介 井上
喜雄 小池
喜雄 小池
秀明 吉原
秀明 吉原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Priority to JP2016023536A priority Critical patent/JP6622105B2/ja
Priority to KR1020170013504A priority patent/KR102561433B1/ko
Priority to CN201710067615.XA priority patent/CN107052985B/zh
Priority to TW106104278A priority patent/TWI709458B/zh
Publication of JP2017140671A publication Critical patent/JP2017140671A/ja
Publication of JP2017140671A5 publication Critical patent/JP2017140671A5/ja
Application granted granted Critical
Publication of JP6622105B2 publication Critical patent/JP6622105B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2016023536A 2016-02-10 2016-02-10 平面研磨装置 Active JP6622105B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016023536A JP6622105B2 (ja) 2016-02-10 2016-02-10 平面研磨装置
KR1020170013504A KR102561433B1 (ko) 2016-02-10 2017-01-31 평면 연마 장치
CN201710067615.XA CN107052985B (zh) 2016-02-10 2017-02-07 平面研磨装置
TW106104278A TWI709458B (zh) 2016-02-10 2017-02-09 平面研磨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016023536A JP6622105B2 (ja) 2016-02-10 2016-02-10 平面研磨装置

Publications (3)

Publication Number Publication Date
JP2017140671A JP2017140671A (ja) 2017-08-17
JP2017140671A5 JP2017140671A5 (https=) 2018-11-15
JP6622105B2 true JP6622105B2 (ja) 2019-12-18

Family

ID=59599179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016023536A Active JP6622105B2 (ja) 2016-02-10 2016-02-10 平面研磨装置

Country Status (4)

Country Link
JP (1) JP6622105B2 (https=)
KR (1) KR102561433B1 (https=)
CN (1) CN107052985B (https=)
TW (1) TWI709458B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102037749B1 (ko) * 2018-03-16 2019-10-29 에스케이실트론 주식회사 웨이퍼 랩핑 장치
JP7035748B2 (ja) * 2018-04-11 2022-03-15 株式会社Sumco ワークの両面研磨装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0547350Y2 (https=) * 1988-05-18 1993-12-13
US5429517A (en) * 1994-02-14 1995-07-04 Methode Electronics, Inc. Two-piece clockspring with lock and wire harness assembly
JPH10202514A (ja) * 1997-01-20 1998-08-04 Speedfam Co Ltd 自動定寸装置
CN2574263Y (zh) * 2002-10-24 2003-09-17 王军珲 一种滑动式轴装导电旋转接头
US6962497B2 (en) * 2003-04-16 2005-11-08 The Furukawa Electric Co., Ltd. Rotary connector having an identifiable neutral position
JP2008227393A (ja) 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
JP5246847B2 (ja) * 2008-02-08 2013-07-24 津田駒工業株式会社 工作機械用スピンドルヘッド
JP6101621B2 (ja) * 2013-11-28 2017-03-22 株式会社荏原製作所 研磨装置

Also Published As

Publication number Publication date
CN107052985B (zh) 2020-09-04
TW201728410A (zh) 2017-08-16
JP2017140671A (ja) 2017-08-17
CN107052985A (zh) 2017-08-18
TWI709458B (zh) 2020-11-11
KR102561433B1 (ko) 2023-07-31
KR20170094490A (ko) 2017-08-18

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