KR102561433B1 - 평면 연마 장치 - Google Patents

평면 연마 장치 Download PDF

Info

Publication number
KR102561433B1
KR102561433B1 KR1020170013504A KR20170013504A KR102561433B1 KR 102561433 B1 KR102561433 B1 KR 102561433B1 KR 1020170013504 A KR1020170013504 A KR 1020170013504A KR 20170013504 A KR20170013504 A KR 20170013504A KR 102561433 B1 KR102561433 B1 KR 102561433B1
Authority
KR
South Korea
Prior art keywords
cable
surface plate
stationary
rotary joint
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020170013504A
Other languages
English (en)
Korean (ko)
Other versions
KR20170094490A (ko
Inventor
시게루 오다기리
유스케 이노우에
요시오 코이케
히데아키 요시하라
Original Assignee
스피드팸 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스피드팸 가부시키가이샤 filed Critical 스피드팸 가부시키가이샤
Publication of KR20170094490A publication Critical patent/KR20170094490A/ko
Application granted granted Critical
Publication of KR102561433B1 publication Critical patent/KR102561433B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • H01L21/30625—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H01L21/304—
    • H01L21/67092—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020170013504A 2016-02-10 2017-01-31 평면 연마 장치 Active KR102561433B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016023536A JP6622105B2 (ja) 2016-02-10 2016-02-10 平面研磨装置
JPJP-P-2016-023536 2016-02-10

Publications (2)

Publication Number Publication Date
KR20170094490A KR20170094490A (ko) 2017-08-18
KR102561433B1 true KR102561433B1 (ko) 2023-07-31

Family

ID=59599179

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170013504A Active KR102561433B1 (ko) 2016-02-10 2017-01-31 평면 연마 장치

Country Status (4)

Country Link
JP (1) JP6622105B2 (https=)
KR (1) KR102561433B1 (https=)
CN (1) CN107052985B (https=)
TW (1) TWI709458B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102037749B1 (ko) * 2018-03-16 2019-10-29 에스케이실트론 주식회사 웨이퍼 랩핑 장치
JP7035748B2 (ja) * 2018-04-11 2022-03-15 株式会社Sumco ワークの両面研磨装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100352542B1 (ko) * 1994-02-14 2002-10-31 메소드 일렉트로닉스 인코포레이티드 로크및와이어하니스조립체를구비한투피스클럭스프링인터커넥터
JP2004342602A (ja) * 2003-04-16 2004-12-02 Furukawa Electric Co Ltd:The 確認可能な中立位置を有するロータリコネクタ
JP2009184089A (ja) 2008-02-08 2009-08-20 Tsudakoma Corp 工作機械用スピンドルヘッド

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0547350Y2 (https=) * 1988-05-18 1993-12-13
JPH10202514A (ja) * 1997-01-20 1998-08-04 Speedfam Co Ltd 自動定寸装置
CN2574263Y (zh) * 2002-10-24 2003-09-17 王军珲 一种滑动式轴装导电旋转接头
JP2008227393A (ja) 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
JP6101621B2 (ja) * 2013-11-28 2017-03-22 株式会社荏原製作所 研磨装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100352542B1 (ko) * 1994-02-14 2002-10-31 메소드 일렉트로닉스 인코포레이티드 로크및와이어하니스조립체를구비한투피스클럭스프링인터커넥터
JP2004342602A (ja) * 2003-04-16 2004-12-02 Furukawa Electric Co Ltd:The 確認可能な中立位置を有するロータリコネクタ
JP2009184089A (ja) 2008-02-08 2009-08-20 Tsudakoma Corp 工作機械用スピンドルヘッド

Also Published As

Publication number Publication date
CN107052985B (zh) 2020-09-04
CN107052985A (zh) 2017-08-18
TW201728410A (zh) 2017-08-16
TWI709458B (zh) 2020-11-11
JP6622105B2 (ja) 2019-12-18
JP2017140671A (ja) 2017-08-17
KR20170094490A (ko) 2017-08-18

Similar Documents

Publication Publication Date Title
CN108700405B (zh) 晶圆载体厚度测量装置
KR102315142B1 (ko) 평면 연마 장치
CN101264585B (zh) 双面研磨装置
TWI709457B (zh) 平面研磨裝置及載具
KR102561433B1 (ko) 평면 연마 장치
CN102481690B (zh) 工业用机器人
CN107664478A (zh) 一种立式非接触回转体高精度测量装置及其测量方法
KR101020122B1 (ko) 다중의 연마패드를 구비한 폴리싱 장치
JP2011017651A (ja) 回転確認機構
US7137867B2 (en) Thickness control method and double side polisher
CN213517184U (zh) 一种新型的晶圆转速测量装置
CN111721519A (zh) 内窥镜插入部测试装置
CN101793504B (zh) 带有激光测距探头的物体三维轮廓测量仪
CN215296216U (zh) 一种光学镜片直观偏心检测装置
US8251775B2 (en) Mechanism and method for detecting the motion of a shaft
CN101793505B (zh) 物体三维轮廓测量仪
CN201561741U (zh) 带有激光测距探头的物体三维轮廓测量仪
CN213004602U (zh) 研磨装置
CN219320134U (zh) 一种检测平台及镜片检测装置
US20040198186A1 (en) Polishing apparatus
JP2008036802A (ja) 両面研磨装置および両面研磨装置におけるワークとキャリアとの重なり検知方法
JPH10244463A (ja) 研磨装置の研磨熱測定方法および研磨熱測定装置付き研磨装置
CN218524769U (zh) 一种机电监测用电压传感器
CN220625173U (zh) 变形测量装置
CN202794220U (zh) 发动机传感器测试设备

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000