JP6622105B2 - 平面研磨装置 - Google Patents

平面研磨装置 Download PDF

Info

Publication number
JP6622105B2
JP6622105B2 JP2016023536A JP2016023536A JP6622105B2 JP 6622105 B2 JP6622105 B2 JP 6622105B2 JP 2016023536 A JP2016023536 A JP 2016023536A JP 2016023536 A JP2016023536 A JP 2016023536A JP 6622105 B2 JP6622105 B2 JP 6622105B2
Authority
JP
Japan
Prior art keywords
cable
surface plate
rotary joint
stationary
polishing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016023536A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017140671A5 (enExample
JP2017140671A (ja
Inventor
茂 小田桐
茂 小田桐
井上　裕介
裕介 井上
喜雄 小池
喜雄 小池
秀明 吉原
秀明 吉原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Priority to JP2016023536A priority Critical patent/JP6622105B2/ja
Priority to KR1020170013504A priority patent/KR102561433B1/ko
Priority to CN201710067615.XA priority patent/CN107052985B/zh
Priority to TW106104278A priority patent/TWI709458B/zh
Publication of JP2017140671A publication Critical patent/JP2017140671A/ja
Publication of JP2017140671A5 publication Critical patent/JP2017140671A5/ja
Application granted granted Critical
Publication of JP6622105B2 publication Critical patent/JP6622105B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2016023536A 2016-02-10 2016-02-10 平面研磨装置 Active JP6622105B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016023536A JP6622105B2 (ja) 2016-02-10 2016-02-10 平面研磨装置
KR1020170013504A KR102561433B1 (ko) 2016-02-10 2017-01-31 평면 연마 장치
CN201710067615.XA CN107052985B (zh) 2016-02-10 2017-02-07 平面研磨装置
TW106104278A TWI709458B (zh) 2016-02-10 2017-02-09 平面研磨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016023536A JP6622105B2 (ja) 2016-02-10 2016-02-10 平面研磨装置

Publications (3)

Publication Number Publication Date
JP2017140671A JP2017140671A (ja) 2017-08-17
JP2017140671A5 JP2017140671A5 (enExample) 2018-11-15
JP6622105B2 true JP6622105B2 (ja) 2019-12-18

Family

ID=59599179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016023536A Active JP6622105B2 (ja) 2016-02-10 2016-02-10 平面研磨装置

Country Status (4)

Country Link
JP (1) JP6622105B2 (enExample)
KR (1) KR102561433B1 (enExample)
CN (1) CN107052985B (enExample)
TW (1) TWI709458B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102037749B1 (ko) * 2018-03-16 2019-10-29 에스케이실트론 주식회사 웨이퍼 랩핑 장치
JP7035748B2 (ja) * 2018-04-11 2022-03-15 株式会社Sumco ワークの両面研磨装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0547350Y2 (enExample) * 1988-05-18 1993-12-13
US5429517A (en) * 1994-02-14 1995-07-04 Methode Electronics, Inc. Two-piece clockspring with lock and wire harness assembly
JPH10202514A (ja) * 1997-01-20 1998-08-04 Speedfam Co Ltd 自動定寸装置
CN2574263Y (zh) * 2002-10-24 2003-09-17 王军珲 一种滑动式轴装导电旋转接头
US6962497B2 (en) * 2003-04-16 2005-11-08 The Furukawa Electric Co., Ltd. Rotary connector having an identifiable neutral position
JP2008227393A (ja) * 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
JP5246847B2 (ja) * 2008-02-08 2013-07-24 津田駒工業株式会社 工作機械用スピンドルヘッド
JP6101621B2 (ja) * 2013-11-28 2017-03-22 株式会社荏原製作所 研磨装置

Also Published As

Publication number Publication date
JP2017140671A (ja) 2017-08-17
KR102561433B1 (ko) 2023-07-31
CN107052985A (zh) 2017-08-18
TWI709458B (zh) 2020-11-11
TW201728410A (zh) 2017-08-16
KR20170094490A (ko) 2017-08-18
CN107052985B (zh) 2020-09-04

Similar Documents

Publication Publication Date Title
CN101264585B (zh) 双面研磨装置
KR102315142B1 (ko) 평면 연마 장치
TWI709457B (zh) 平面研磨裝置及載具
CN108700405A (zh) 晶圆载体厚度测量装置
EP2937622A1 (en) Pipe inspection robot, and method for inspection of pipe
JP6622105B2 (ja) 平面研磨装置
CN109690282A (zh) 用于测量橡胶磨损的装置
CN106956216A (zh) 一种研磨抛光加工状态在线监测装置
KR101020122B1 (ko) 다중의 연마패드를 구비한 폴리싱 장치
JP5090952B2 (ja) 超音波探傷装置
US7137867B2 (en) Thickness control method and double side polisher
CN108382594A (zh) 一种应用于检测桥梁底部缺陷的无人机
JP6474070B2 (ja) 斜張橋の斜材点検方法
CN111721519A (zh) 内窥镜插入部测试装置
KR101067171B1 (ko) 발전기 회전자의 리테이닝 링의 자동 회전 검사장치
JPWO2019065107A1 (ja) ギヤ位置決め装置、応力測定システム、ギヤ位置決め方法及び応力測定方法
JP2012522649A (ja) 両面研削機における極薄被加工物の材料除去機械加工方法
CN109507222B (zh) 一种连续测量材料高温方向光谱发射率的方法
JP7386411B2 (ja) 被削材観測装置とその研削制御方法
JP6308529B2 (ja) 斜張橋の斜材点検装置及び斜材点検方法
CN213004602U (zh) 研磨装置
CN212159037U (zh) 内窥镜插入部测试装置
KR101400162B1 (ko) 풍력발전기의 블레이드 검사 시스템
JP2012255719A (ja) 引き摺り試験装置
CN219320134U (zh) 一种检测平台及镜片检测装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181003

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20181003

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190809

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190820

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191017

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20191105

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20191121

R150 Certificate of patent or registration of utility model

Ref document number: 6622105

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250