JP6597927B1 - 電磁波シールドシート、および電磁波シールド性配線回路基板 - Google Patents
電磁波シールドシート、および電磁波シールド性配線回路基板 Download PDFInfo
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- JP6597927B1 JP6597927B1 JP2019112479A JP2019112479A JP6597927B1 JP 6597927 B1 JP6597927 B1 JP 6597927B1 JP 2019112479 A JP2019112479 A JP 2019112479A JP 2019112479 A JP2019112479 A JP 2019112479A JP 6597927 B1 JP6597927 B1 JP 6597927B1
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- electromagnetic wave
- layer
- conductive adhesive
- wave shielding
- adhesive layer
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019112479A JP6597927B1 (ja) | 2019-06-18 | 2019-06-18 | 電磁波シールドシート、および電磁波シールド性配線回路基板 |
| CN202120388776.0U CN214592685U (zh) | 2019-06-18 | 2020-06-12 | 电磁波屏蔽片、电磁波屏蔽性配线电路基板及电子设备 |
| CN202010536865.5A CN111556703B (zh) | 2019-06-18 | 2020-06-12 | 电磁波屏蔽片及电磁波屏蔽性配线电路基板 |
| CN202021082076.0U CN212727896U (zh) | 2019-06-18 | 2020-06-12 | 电磁波屏蔽片及电磁波屏蔽性配线电路基板 |
| TW109120091A TWI837383B (zh) | 2019-06-18 | 2020-06-15 | 電磁波屏蔽片及電磁波屏蔽性配線電路基板 |
| KR1020200072136A KR102196833B1 (ko) | 2019-06-18 | 2020-06-15 | 전자파 차폐 시트, 및 전자파 차폐성 배선 회로 기판 |
| KR1020200181887A KR20200145812A (ko) | 2019-06-18 | 2020-12-23 | 전자파 차폐 시트, 및 전자파 차폐성 배선 회로 기판 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019112479A JP6597927B1 (ja) | 2019-06-18 | 2019-06-18 | 電磁波シールドシート、および電磁波シールド性配線回路基板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019165990A Division JP2020205399A (ja) | 2019-09-12 | 2019-09-12 | 電磁波シールドシート、および電磁波シールド性配線回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP6597927B1 true JP6597927B1 (ja) | 2019-10-30 |
| JP2020205354A JP2020205354A (ja) | 2020-12-24 |
Family
ID=68383210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019112479A Active JP6597927B1 (ja) | 2019-06-18 | 2019-06-18 | 電磁波シールドシート、および電磁波シールド性配線回路基板 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6597927B1 (zh) |
| KR (2) | KR102196833B1 (zh) |
| CN (3) | CN212727896U (zh) |
| TW (1) | TWI837383B (zh) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2020129985A1 (ja) * | 2018-12-18 | 2020-06-25 | 東洋インキＳｃホールディングス株式会社 | 電子部品搭載基板および電子機器 |
| JP2021086948A (ja) * | 2019-11-28 | 2021-06-03 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシート、および電磁波シールド性配線回路基板 |
| JP2021090013A (ja) * | 2019-12-05 | 2021-06-10 | 東洋インキＳｃホールディングス株式会社 | 電子部品搭載基板および電子機器 |
| WO2021251288A1 (ja) * | 2020-06-11 | 2021-12-16 | 三井金属鉱業株式会社 | 両面銅張積層板 |
| JP2022061301A (ja) * | 2020-10-06 | 2022-04-18 | 東洋インキＳｃホールディングス株式会社 | 金属板用接合剤、プリント配線板用補強部材及びその製造方法、並びに、配線板及びその製造方法 |
| WO2022136973A1 (en) * | 2020-12-21 | 2022-06-30 | 3M Innovative Properties Company | Circuit board to which 3d formed electromagnetic shielding film is attached, 3d formable electromagnetic shielding film, and 3d formed electromagnetic shielding film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10015915B2 (en) | 2011-11-24 | 2018-07-03 | Tatsuta Electric Wire & Cable Co., Ltd. | Shield film, shielded printed wiring board, and method for manufacturing shield film |
| JP2013168643A (ja) | 2012-01-17 | 2013-08-29 | Toyo Ink Sc Holdings Co Ltd | 電磁波シールドシートおよび電磁波シールド層付き配線板の製造方法 |
| CN104487534B (zh) * | 2012-07-11 | 2016-11-09 | 大自达电线股份有限公司 | 硬化导电胶组成物、电磁波屏蔽膜、导电胶膜、黏合方法及线路基板 |
| JP2015065343A (ja) * | 2013-09-25 | 2015-04-09 | タツタ電線株式会社 | シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法 |
| KR102432750B1 (ko) * | 2016-02-12 | 2022-08-12 | 타츠타 전선 주식회사 | 전자파 차폐 필름 |
| JP2017147276A (ja) * | 2016-02-15 | 2017-08-24 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器 |
| KR102394462B1 (ko) * | 2016-09-06 | 2022-05-03 | 타츠타 전선 주식회사 | 전자파 실드 필름 |
| KR102267570B1 (ko) * | 2017-02-08 | 2021-06-18 | 타츠타 전선 주식회사 | 전자파 차폐 필름, 차폐 프린트 배선판 및 전자 기기 |
| JP6970025B2 (ja) * | 2018-01-10 | 2021-11-24 | タツタ電線株式会社 | 電磁波シールドフィルム |
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2019
- 2019-06-18 JP JP2019112479A patent/JP6597927B1/ja active Active
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2020
- 2020-06-12 CN CN202021082076.0U patent/CN212727896U/zh active Active
- 2020-06-12 CN CN202010536865.5A patent/CN111556703B/zh active Active
- 2020-06-12 CN CN202120388776.0U patent/CN214592685U/zh active Active
- 2020-06-15 KR KR1020200072136A patent/KR102196833B1/ko active IP Right Grant
- 2020-06-15 TW TW109120091A patent/TWI837383B/zh active
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020129985A1 (ja) * | 2018-12-18 | 2020-06-25 | 東洋インキＳｃホールディングス株式会社 | 電子部品搭載基板および電子機器 |
| JP2021086948A (ja) * | 2019-11-28 | 2021-06-03 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシート、および電磁波シールド性配線回路基板 |
| JP7400406B2 (ja) | 2019-11-28 | 2023-12-19 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシート、および電磁波シールド性配線回路基板 |
| JP2021090013A (ja) * | 2019-12-05 | 2021-06-10 | 東洋インキＳｃホールディングス株式会社 | 電子部品搭載基板および電子機器 |
| WO2021251288A1 (ja) * | 2020-06-11 | 2021-12-16 | 三井金属鉱業株式会社 | 両面銅張積層板 |
| US11670455B2 (en) | 2020-06-11 | 2023-06-06 | Mitsui Mining & Smelting Co., Ltd. | Double-sided copper-clad laminate |
| JP2022061301A (ja) * | 2020-10-06 | 2022-04-18 | 東洋インキＳｃホールディングス株式会社 | 金属板用接合剤、プリント配線板用補強部材及びその製造方法、並びに、配線板及びその製造方法 |
| JP7107344B2 (ja) | 2020-10-06 | 2022-07-27 | 東洋インキＳｃホールディングス株式会社 | 金属板用接合剤、プリント配線板用補強部材及びその製造方法、並びに、配線板及びその製造方法 |
| WO2022136973A1 (en) * | 2020-12-21 | 2022-06-30 | 3M Innovative Properties Company | Circuit board to which 3d formed electromagnetic shielding film is attached, 3d formable electromagnetic shielding film, and 3d formed electromagnetic shielding film |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20200145812A (ko) | 2020-12-30 |
| TW202102102A (zh) | 2021-01-01 |
| KR102196833B1 (ko) | 2020-12-30 |
| JP2020205354A (ja) | 2020-12-24 |
| CN212727896U (zh) | 2021-03-16 |
| CN111556703A (zh) | 2020-08-18 |
| CN214592685U (zh) | 2021-11-02 |
| KR20200144492A (ko) | 2020-12-29 |
| TWI837383B (zh) | 2024-04-01 |
| CN111556703B (zh) | 2021-04-20 |
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