JP6593781B2 - 誘電体磁器組成物、誘電体磁器組成物の製造方法、及び積層型セラミック電子部品 - Google Patents
誘電体磁器組成物、誘電体磁器組成物の製造方法、及び積層型セラミック電子部品 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims description 114
- 239000000203 mixture Substances 0.000 title claims description 56
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 229910052573 porcelain Inorganic materials 0.000 title description 3
- 150000001875 compounds Chemical class 0.000 claims description 42
- 238000010304 firing Methods 0.000 claims description 27
- 239000000843 powder Substances 0.000 claims description 22
- 229910052788 barium Inorganic materials 0.000 claims description 16
- 229910052791 calcium Inorganic materials 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 15
- 239000010953 base metal Substances 0.000 claims description 13
- 229910052787 antimony Inorganic materials 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- 239000001301 oxygen Substances 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 5
- 238000003786 synthesis reaction Methods 0.000 claims description 5
- 238000005303 weighing Methods 0.000 claims 1
- 239000011575 calcium Substances 0.000 description 32
- 238000000034 method Methods 0.000 description 13
- 239000003985 ceramic capacitor Substances 0.000 description 11
- 239000013078 crystal Substances 0.000 description 8
- 238000001354 calcination Methods 0.000 description 7
- 230000005621 ferroelectricity Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000000383 hazardous chemical Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- -1 oxides Chemical class 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000002459 sustained effect Effects 0.000 description 2
- 238000001308 synthesis method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910018054 Ni-Cu Inorganic materials 0.000 description 1
- 229910018481 Ni—Cu Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 229910010252 TiO3 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000013522 chelant Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 238000000975 co-precipitation Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001027 hydrothermal synthesis Methods 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000001637 plasma atomic emission spectroscopy Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000010532 solid phase synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Description
すなわち、上記Sbの化合物形態には、通常、Sb 2 O 3 等の3価のSb化合物と、Sb 2 O 5 等の5価のSb化合物が存在する。この場合、焼成処理を還元性雰囲気で行うと、3価のSb化合物は価数を維持し、5価のSb化合物は還元されて3価となる。そして、3価のSb、Ti、及びBaの各々イオン半径の関係からSbはイオン半径の大きいBaが配位するAサイトにBaの一部を置換する形態で固溶すると考えられる。
そして、このようにSbがAサイトに固溶する結果、SbはO原子と共有結合してAサイトの中心位置から変位し、これにより結晶軸のc軸とa軸との比c/aが大きくなって正方晶性が向上し、キュリー点Tcは強誘電性が維持される140℃以上の温度に向上すると考えられる。
セラミック素原料として、BaCO3、CaCO3、TiO2、及びSb2O3を用意し、Ba、Ca、Sbのモル部がTi100モル部に対し焼成後に表1となるように、これらセラミック素原料を秤量した。尚、Sb2O3は還元性雰囲気下での焼成で揮発すると想定されることから、50〜100モル%過剰に秤量した。
試料番号1〜38の各試料について、外部電極形成前のセラミック焼結体をXRD法(X線回析法)で構造解析した。その結果、セラミック焼結体は、いずれもペロブスカイト型結晶構造を有することが確認された。
2a〜2f 内部電極層
6a〜6g 誘電体層
Claims (5)
- 主成分が少なくともBa、Ca、Ti、及びSbを含有した一般式ABO 3 で表される非鉛系のペロブスカイト型化合物で形成され、
前記Sbの含有量が、Ti100モル部に対し0.1〜5モル部とされると共に、前記SbはAサイトに固溶され、
前記Baの含有量は、Ti100モル部に対し80モル部以上であり、かつ前記Caの含有量は、Ti100モル部に対し15モル部以下であり、
キュリー点Tcが140℃以上であることを特徴とする誘電体磁器組成物。 - 焼成後において、Baの含有量がTi100モル部に対し80モル部以上となり、Caの含有量がTi100モル部に対し15モル部以下となり、Sbの含有量がTi100モル部に対し0.1〜5モル部となるように、少なくともBa化合物、Ca化合物、Ti化合物、及びSb化合物を含むセラミック素原料を秤量し、前記セラミック素原料から主成分粉末を作製する主成分粉末作製工程と、
前記主成分粉末に成形加工を施し、セラミック成形体を作製する成形体作製工程と、
前記セラミック成形体を還元性雰囲気下、焼成し、キュリー点Tcが140℃以上のセラミック焼結体を作製する焼成工程とを含むことを特徴とする誘電体磁器組成物の製造方法。 - 前記還元性雰囲気は、酸素分圧が10-7〜10-11MPaであり、前記焼成時の焼成温度は1100〜1400℃であることを特徴とする請求項2記載の誘電体磁器組成物の製造方法。
- 前記主成分粉末作製工程は、前記セラミック素原料の混合物を還元性雰囲気下で仮焼し、前記主成分粉末を合成することを特徴とする請求項2又は請求項3記載の誘電体磁器組成物の製造方法。
- 誘電体層と内部電極層とが交互に積層された積層型セラミック電子部品において、
前記内部電極層が、卑金属材料で形成されると共に、
前記誘電体層が、請求項1記載の誘電体磁器組成物で形成されていることを特徴とする積層型セラミック電子部品。
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US8686827B2 (en) * | 2010-04-08 | 2014-04-01 | Hitachi Metals, Ltd. | PTC element and heating-element module |
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KR20130036594A (ko) | 2011-10-04 | 2013-04-12 | 삼성전기주식회사 | 유전체 조성물 및 이를 포함하는 세라믹 전자 부품 |
KR101452048B1 (ko) * | 2012-11-09 | 2014-10-22 | 삼성전기주식회사 | 적층 세라믹 커패시터, 적층 세라믹 커패시터의 회로 기판 실장 구조 및 적층 세라믹 커패시터의 포장체 |
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