JP6569936B2 - プリント配線板用基板 - Google Patents
プリント配線板用基板 Download PDFInfo
- Publication number
- JP6569936B2 JP6569936B2 JP2015114332A JP2015114332A JP6569936B2 JP 6569936 B2 JP6569936 B2 JP 6569936B2 JP 2015114332 A JP2015114332 A JP 2015114332A JP 2015114332 A JP2015114332 A JP 2015114332A JP 6569936 B2 JP6569936 B2 JP 6569936B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- copper foil
- printed wiring
- rolled copper
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 116
- 239000011889 copper foil Substances 0.000 claims description 103
- 239000010410 layer Substances 0.000 claims description 101
- 239000000758 substrate Substances 0.000 claims description 56
- 125000000524 functional group Chemical group 0.000 claims description 38
- -1 sulfonyldioxy group Chemical group 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 239000013078 crystal Substances 0.000 claims description 11
- 239000002344 surface layer Substances 0.000 claims description 9
- 125000003368 amide group Chemical group 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 4
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 claims description 4
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims description 4
- 125000000101 thioether group Chemical group 0.000 claims description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 4
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 125000005641 methacryl group Chemical group 0.000 claims description 3
- 238000002407 reforming Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 55
- 230000005540 biological transmission Effects 0.000 description 30
- 239000006087 Silane Coupling Agent Substances 0.000 description 21
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 20
- 238000000034 method Methods 0.000 description 16
- 238000005530 etching Methods 0.000 description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 13
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 13
- 238000012360 testing method Methods 0.000 description 13
- 125000001153 fluoro group Chemical group F* 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 125000004429 atom Chemical group 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 125000003118 aryl group Chemical group 0.000 description 9
- 229910052731 fluorine Inorganic materials 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 229920001643 poly(ether ketone) Polymers 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000003063 flame retardant Substances 0.000 description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 8
- 125000004432 carbon atom Chemical group C* 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- 239000004744 fabric Substances 0.000 description 7
- 239000004810 polytetrafluoroethylene Substances 0.000 description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- 229910052719 titanium Inorganic materials 0.000 description 7
- 239000004696 Poly ether ether ketone Substances 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 238000000354 decomposition reaction Methods 0.000 description 6
- 125000004433 nitrogen atom Chemical group N* 0.000 description 6
- 229920002530 polyetherether ketone Polymers 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000009257 reactivity Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000007788 roughening Methods 0.000 description 6
- 125000004434 sulfur atom Chemical group 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 125000003545 alkoxy group Chemical group 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 239000003607 modifier Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 125000005372 silanol group Chemical group 0.000 description 4
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000002500 effect on skin Effects 0.000 description 3
- 125000004428 fluoroalkoxy group Chemical group 0.000 description 3
- 125000003709 fluoroalkyl group Chemical group 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- RYSXWUYLAWPLES-MTOQALJVSA-N (Z)-4-hydroxypent-3-en-2-one titanium Chemical compound [Ti].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O RYSXWUYLAWPLES-MTOQALJVSA-N 0.000 description 2
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- 229920001780 ECTFE Polymers 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 2
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 2
- 238000009941 weaving Methods 0.000 description 2
- OVSGBKZKXUMMHS-VGKOASNMSA-L (z)-4-oxopent-2-en-2-olate;propan-2-olate;titanium(4+) Chemical compound [Ti+4].CC(C)[O-].CC(C)[O-].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O OVSGBKZKXUMMHS-VGKOASNMSA-L 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical group CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- HIQAWCBKWSQMRQ-UHFFFAOYSA-N 16-methylheptadecanoic acid;2-methylprop-2-enoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O HIQAWCBKWSQMRQ-UHFFFAOYSA-N 0.000 description 1
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 description 1
- QJPPPLJETZSLMG-UHFFFAOYSA-N 2-(3-trimethoxysilylpropylamino)ethylurea Chemical compound CO[Si](OC)(OC)CCCNCCNC(N)=O QJPPPLJETZSLMG-UHFFFAOYSA-N 0.000 description 1
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 1
- KKOHCQAVIJDYAF-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O KKOHCQAVIJDYAF-UHFFFAOYSA-N 0.000 description 1
- KTXWGMUMDPYXNN-UHFFFAOYSA-N 2-ethylhexan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCC(CC)C[O-].CCCCC(CC)C[O-].CCCCC(CC)C[O-].CCCCC(CC)C[O-] KTXWGMUMDPYXNN-UHFFFAOYSA-N 0.000 description 1
- WZLRYEIJALOESF-UHFFFAOYSA-R 2-ethylhexane-1,3-diolate;hydron;titanium(4+) Chemical compound [H+].[H+].[H+].[H+].[Ti+4].CCCC([O-])C(CC)C[O-].CCCC([O-])C(CC)C[O-].CCCC([O-])C(CC)C[O-].CCCC([O-])C(CC)C[O-] WZLRYEIJALOESF-UHFFFAOYSA-R 0.000 description 1
- AIFLGMNWQFPTAJ-UHFFFAOYSA-J 2-hydroxypropanoate;titanium(4+) Chemical compound [Ti+4].CC(O)C([O-])=O.CC(O)C([O-])=O.CC(O)C([O-])=O.CC(O)C([O-])=O AIFLGMNWQFPTAJ-UHFFFAOYSA-J 0.000 description 1
- YTOQRQCHVNXEFB-UHFFFAOYSA-N 2-methylpropan-1-ol;titanium Chemical compound [Ti].CC(C)CO YTOQRQCHVNXEFB-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- LVACOMKKELLCHJ-UHFFFAOYSA-N 3-trimethoxysilylpropylurea Chemical compound CO[Si](OC)(OC)CCCNC(N)=O LVACOMKKELLCHJ-UHFFFAOYSA-N 0.000 description 1
- PRKPGWQEKNEVEU-UHFFFAOYSA-N 4-methyl-n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC(C)C PRKPGWQEKNEVEU-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- USUBTRUMSIOARS-UHFFFAOYSA-N C(=C)NCCC[Si](OC(CCN)CC1=CC=CC=C1)(OC)OC Chemical compound C(=C)NCCC[Si](OC(CCN)CC1=CC=CC=C1)(OC)OC USUBTRUMSIOARS-UHFFFAOYSA-N 0.000 description 1
- KLQSRTKDOLFPQJ-UHFFFAOYSA-M CCCCO[Ti+](OCCCC)OCCCC.CCCCCCCCCCCCCCCCCC([O-])=O Chemical compound CCCCO[Ti+](OCCCC)OCCCC.CCCCCCCCCCCCCCCCCC([O-])=O KLQSRTKDOLFPQJ-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- AEMRFAOFKBGASW-UHFFFAOYSA-M Glycolate Chemical compound OCC([O-])=O AEMRFAOFKBGASW-UHFFFAOYSA-M 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- DRNPGEPMHMPIQU-UHFFFAOYSA-N O.[Ti].[Ti].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO.CCCCO Chemical compound O.[Ti].[Ti].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO.CCCCO DRNPGEPMHMPIQU-UHFFFAOYSA-N 0.000 description 1
- 229920001774 Perfluoroether Polymers 0.000 description 1
- 229920008285 Poly(ether ketone) PEK Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- LCKIEQZJEYYRIY-UHFFFAOYSA-N Titanium ion Chemical compound [Ti+4] LCKIEQZJEYYRIY-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000007718 adhesive strength test Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 125000003158 alcohol group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- XRASGLNHKOPXQL-UHFFFAOYSA-L azane 2-oxidopropanoate titanium(4+) dihydrate Chemical compound N.N.O.O.[Ti+4].CC([O-])C([O-])=O.CC([O-])C([O-])=O XRASGLNHKOPXQL-UHFFFAOYSA-L 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 1
- XMQYIPNJVLNWOE-UHFFFAOYSA-N dioctyl hydrogen phosphite Chemical compound CCCCCCCCOP(O)OCCCCCCCC XMQYIPNJVLNWOE-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- VTIXMGZYGRZMAW-UHFFFAOYSA-N ditridecyl hydrogen phosphite Chemical compound CCCCCCCCCCCCCOP(O)OCCCCCCCCCCCCC VTIXMGZYGRZMAW-UHFFFAOYSA-N 0.000 description 1
- XHWQYYPUYFYELO-UHFFFAOYSA-N ditridecyl phosphite Chemical compound CCCCCCCCCCCCCOP([O-])OCCCCCCCCCCCCC XHWQYYPUYFYELO-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- NCXTWAVJIHJVRV-UHFFFAOYSA-N ethane-1,2-diol;16-methylheptadecanoic acid;titanium Chemical compound [Ti].OCCO.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O NCXTWAVJIHJVRV-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 1
- 229960005082 etohexadiol Drugs 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000012210 heat-resistant fiber Substances 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000004658 ketimines Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- KQJBQMSCFSJABN-UHFFFAOYSA-N octadecan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-] KQJBQMSCFSJABN-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- CAQIWIAAHXOQOS-UHFFFAOYSA-N octadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCC(O)=O CAQIWIAAHXOQOS-UHFFFAOYSA-N 0.000 description 1
- 238000000879 optical micrograph Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 125000004115 pentoxy group Chemical group [*]OC([H])([H])C([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 239000010702 perfluoropolyether Substances 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- FBBATURSCRIBHN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyldisulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC FBBATURSCRIBHN-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
本発明の一態様に係るプリント配線板用基板は、フッ素樹脂を主成分とし、絶縁性を有するベースフィルムと、このベースフィルムの少なくとも一方の面に積層される圧延銅箔とを備え、上記ベースフィルムの上記圧延銅箔側の表層の少なくとも一部の領域に改質層を有し、上記改質層がシロキサン結合及び親水性官能基を含むプリント配線板用基板である。
本発明の好適な実施形態に係るプリント配線板用基板について、以下に図面を参照しつつ説明する。
上述したように、ベースフィルム1は、フッ素樹脂層2と改質層3とを有する。以下、フッ素樹脂層2及び改質層3について説明する。
フッ素樹脂層2は、フッ素樹脂を主成分とする層である。ここで、「フッ素樹脂」とは、高分子鎖の繰り返し単位を構成する炭素原子に結合する水素原子の少なくとも1つが、フッ素原子又はフッ素原子を有する有機基(以下、「フッ素原子含有基」ともいう)で置換されたものをいう。フッ素原子含有基は、直鎖状又は分岐状の有機基中の水素原子の少なくとも1つがフッ素原子で置換されたものであり、例えばフルオロアルキル基、フルオロアルコキシ基、フルオロポリエーテル基等が挙げられる。
改質層3は、シロキサン結合(Si−O−Si)及び親水性官能基を含む。この改質層3は、フッ素樹脂層2の主成分であるフッ素樹脂に、例えば親水性官能基を有し、かつシロキサン結合を生成する改質剤(シランカップリング剤)が結合して形成される。この場合、改質層3において、例えば親水性官能基がシロキサン結合を構成するSi原子に結合している。ここで、フッ素樹脂と改質剤との間の結合は、共有結合だけで構成される場合、共有結合及び水素結合を含む場合等がある。
圧延銅箔4は、導電層として用いられるものであり、プリント配線板を製造する際に、例えばエッチングにより種々のパターンに加工される。
次に、上述したプリント配線板用基板10の好適な製造方法について、図2A〜Cを参照しながら説明する。なお、図2A〜Cにおいて、図1と同一の構成要素には同一の符号を付し、その説明は省略する。
当該プリント配線板用基板は、フッ素樹脂を主成分とするベースフィルム及び圧延銅箔を備えるため、高周波領域に用いた際の伝送損失を抑制できる。また、ベースフィルムの圧延銅箔側の表層の少なくとも一部の領域に、シロキサン結合及び親水性官能基を含む改質層を有するため、圧延銅箔に対して伝送損失の抑制を阻害する粗化処理を施さなくても密着性を向上させることができる。従って、当該プリント配線板用基板によれば、密着性を向上させることができる上、伝送損失を抑制できる。
上記開示された実施形態は全ての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記実施形態の構成に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味及び範囲内での全ての変更が含まれることが意図される。
(試験例1)
プリント配線板用基板の作製に使用した圧延銅箔、フッ素樹脂材及びプライマ材料は以下の通りである。
プライマ材料を用いないこと以外は、上記試験例1と同様の手順でプリント配線板用基板を得た。
圧延銅箔の代わりに電解銅箔(福田金属社の「SV箔」、平均厚み18μm、フッ素樹脂材を積層させる面の最大高さ粗さRz1.5μm)を用いたこと以外は、上記試験例1と同様の手順でプリント配線板用基板を得た。
試験例1〜3のプリント配線板用基板について、JIS−K−6854−2(1999年)の「接着剤−剥離接着強さ試験方法−2部:180度剥離」に準じた方法で、銅箔とフッ素樹脂材との間の剥離強度(N/cm)を測定した。
試験例1〜3のプリント配線板用基板の銅箔をパターニングして、長さ30〜80mm、平均幅150μm、平均高さ18μmのマイクロストリップラインを形成した。次いで、各プリント配線板用基板におけるフッ素樹脂材の上記マイクロストリップラインとは反対側の面に平均厚み18μmの銅箔を貼り合わせて、伝送損失を評価するための試験基板を作製した。次いで、ネットワークアナライザ(Agilent社の「E8361A」)に各試験基板を接続し、周波数10GHz、温度25℃、相対湿度50%の条件で伝送損失(dB/cm)を測定した。
2 フッ素樹脂層
3,5 改質層
4 圧延銅箔
4a 圧延銅箔のベースフィルム側の面
10,20 プリント配線板用基板
101 プライマ材料
102 フッ素樹脂材
900 プレス機
Claims (4)
- フッ素樹脂を主成分とし、絶縁性を有するベースフィルムと、このベースフィルムの少なくとも一方の面に積層される圧延銅箔とを備え、
上記ベースフィルムの上記圧延銅箔側の表層の少なくとも一部の領域に改質層を有し、
上記改質層がシロキサン結合及び親水性官能基を含み、
上記圧延銅箔の上記改質層と接触する面の最大高さ粗さRzが4μm以下であり、
上記圧延銅箔の上記改質層と接触する面の結晶粒の平均長径が100μm以上180μm以下であるプリント配線板用基板。 - 上記圧延銅箔の銅の純度が99.99質量%以上である請求項1に記載のプリント配線板用基板。
- 上記親水性官能基が、水酸基、カルボキシ基、カルボニル基、アミノ基、アミド基、スルフィド基、スルホニル基、スルホ基、スルホニルジオキシ基、エポキシ基、メタクリル基、メルカプト基又はこれらの組合せである請求項1又は請求項2に記載のプリント配線板用基板。
- 上記改質層の平均厚みが400nm以下である請求項1、請求項2又は請求項3に記載のプリント配線板用基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015114332A JP6569936B2 (ja) | 2015-06-04 | 2015-06-04 | プリント配線板用基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015114332A JP6569936B2 (ja) | 2015-06-04 | 2015-06-04 | プリント配線板用基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017005002A JP2017005002A (ja) | 2017-01-05 |
JP6569936B2 true JP6569936B2 (ja) | 2019-09-04 |
Family
ID=57752889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015114332A Active JP6569936B2 (ja) | 2015-06-04 | 2015-06-04 | プリント配線板用基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6569936B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018221876A1 (ko) * | 2017-05-30 | 2018-12-06 | 주식회사 아모그린텍 | 연성인쇄회로기판 제조 방법 및 이에 의해 제조된 연성인쇄회로기판 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59208896A (ja) * | 1983-05-13 | 1984-11-27 | 日立電線株式会社 | 高周波プリント回路用銅張積層基板 |
JPS61118245A (ja) * | 1984-11-14 | 1986-06-05 | 松下電工株式会社 | 銅張積層板 |
JPH1168271A (ja) * | 1997-08-26 | 1999-03-09 | Hitachi Cable Ltd | 高純度銅配線基板 |
JP2002280688A (ja) * | 2001-03-16 | 2002-09-27 | Tomoegawa Paper Co Ltd | 印刷回路板作製用の接着剤付き銅箔および銅張り積層板 |
JP2010280191A (ja) * | 2009-06-08 | 2010-12-16 | Hitachi Cable Ltd | 熱処理用銅箔、熱処理用銅箔の製造方法およびフレキシブルプリント配線板 |
JP6461532B2 (ja) * | 2013-10-11 | 2019-01-30 | 住友電工プリントサーキット株式会社 | フッ素樹脂基材の製造方法及びプリント配線板の製造方法 |
-
2015
- 2015-06-04 JP JP2015114332A patent/JP6569936B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017005002A (ja) | 2017-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6350524B2 (ja) | 金属樹脂複合体及び金属樹脂複合体の製造方法 | |
JP6461532B2 (ja) | フッ素樹脂基材の製造方法及びプリント配線板の製造方法 | |
US11364714B2 (en) | Fluororesin base material, printed wiring board, and circuit module | |
JP6601814B2 (ja) | プリント配線板及びプリント配線板の製造方法 | |
JP6509836B2 (ja) | フッ素樹脂基材及びフレキシブルプリント配線板 | |
KR101883677B1 (ko) | 고주파 회로 기판 | |
JP6809771B2 (ja) | フッ素樹脂基材、プリント配線板、及び回路モジュール | |
JP2017120826A (ja) | 基板及びプリント配線板用基材 | |
JP2019104171A (ja) | 金属−樹脂積層体 | |
WO2021235460A1 (ja) | フッ素樹脂シート、多層シート及びシールド材 | |
KR20170041725A (ko) | 고주파 회로용에 적합한 양면 회로용 기판 | |
JPWO2019203243A1 (ja) | ロールフィルム、ロールフィルムの製造方法、銅張積層体の製造方法、及びプリント基板の製造方法 | |
JP2018014387A (ja) | 基板、フレキシブルプリント配線板用基材、フレキシブルプリント配線板及び基板の製造方法 | |
WO2014192322A1 (ja) | 高周波用プリント配線板及び配線材料 | |
JP2020158720A (ja) | 複合粒子、分散液、積層体の製造方法、膜の製造方法及び被覆織布の製造方法 | |
JP6420569B2 (ja) | 高周波用プリント配線板 | |
JP6256832B2 (ja) | 歪ゲージ用プリント配線板 | |
WO2015053309A1 (ja) | フッ素樹脂基材、プリント配線板、及び回路モジュール | |
JP4129627B2 (ja) | ビルドアップ配線板用積層フィルム及びビルドアップ配線板 | |
JP6569936B2 (ja) | プリント配線板用基板 | |
CN107852828B (zh) | 印刷线路板用基板、印刷线路板以及印刷线路板用基板的制造方法 | |
JP6281762B2 (ja) | プリント配線板 | |
JP6341495B2 (ja) | 高速伝送基板及び電子部品 | |
JP2015046072A (ja) | タッチセンサパネル | |
JP2013256053A (ja) | 金属樹脂積層体及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A625 | Written request for application examination (by other person) |
Free format text: JAPANESE INTERMEDIATE CODE: A625 Effective date: 20180122 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180905 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180911 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181102 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20190219 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190517 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20190528 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190709 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190725 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6569936 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |