JP6568340B2 - 内面に不活性の気相コーティングを有する金属部品の製造方法 - Google Patents
内面に不活性の気相コーティングを有する金属部品の製造方法 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D15/00—Separating processes involving the treatment of liquids with solid sorbents; Apparatus therefor
- B01D15/08—Selective adsorption, e.g. chromatography
- B01D15/10—Selective adsorption, e.g. chromatography characterised by constructional or operational features
- B01D15/22—Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the construction of the column
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/045—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
- C23C16/325—Silicon carbide
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/403—Oxides of aluminium, magnesium or beryllium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/405—Oxides of refractory metals or yttrium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45555—Atomic layer deposition [ALD] applied in non-semiconductor technology
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N30/00—Investigating or analysing materials by separation into components using adsorption, absorption or similar phenomena or using ion-exchange, e.g. chromatography or field flow fractionation
- G01N30/02—Column chromatography
- G01N30/50—Conditioning of the sorbent material or stationary liquid
- G01N30/56—Packing methods or coating methods
- G01N2030/567—Packing methods or coating methods coating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
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- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Treatment Of Liquids With Adsorbents In General (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Description
特許、特許出願、特許公報、雑誌、書籍、文書、ウェブコンテンツなどの他の文献の参照および引用を本開示中で行った。これらの文献はすべて、ここにおいて、その全体が、すべての目的のために、参照により本明細書中に組み込まれる。参照により本明細書中に組み込まれるとされる資料またはその一部で、既存の定義、記述、または、本明細書中に明示的に記載された他の開示資料と矛盾するものは、組み込まれた資料と本開示資料との間で矛盾が生じない程度まで組み込まれるに過ぎない。矛盾が生じた場合、好ましい開示として本開示を優先し、矛盾を解決するものとする。
本明細書中に開示した代表的な例は、本発明の例示を助けることを意図しており、本発明の範囲を限定することを意図しておらず、または、本発明の範囲を限定すると理解すべきでもない。実際、本明細書中に記述および記載したものに加えて、本発明のさまざまな変形例およびさらに多くのその実施形態が、続く実施例ならびに本明細書中で引用した科学文献および特許文献への参照を含めて、本文献の全内容から、当業者にとって明らかとなるであろう。続く実施例は、本発明の実施に、そのさまざまな実施形態およびその均等物において適用することのできる、重要な追加の情報、例証および案内を収めている。
第1のコーティングであるアモルファスSiコーティングを、ステンレス鋼切り取り試片、フリットおよびHPLCカラム上、ならびに、チタン切り取り試片上に堆積させた。堆積は、分子前駆体としてSiH4ガスを使用し、閉じたリアクタ内で、熱化学蒸着により行った。堆積のための温度は350℃〜450℃であり、リアクタ内のSiH4の分圧はドライ窒素ガス中で50〜1000ミリバールであった。2つの堆積が連続して行われて、切り取り試片上に550nmのコーティング厚みを実現し、HPLCカラムの内部に100nmを実現した。
第2のコーティングである高分子シロキサンコーティングを、化学蒸着を使用して、350℃〜450℃の温度で堆積させた。100nm〜300nmのコーティング厚みが、ステンレス鋼切り取り試片、ステンレス鋼フリット上、および、HPLCカラムの内面上で得られた。
第3のコーティングは、a-Si上の150nmのシロキサンコーティングにより覆われた、ステンレス鋼の上に直接載っている200 nmのa-Siからなる二重膜であった。このコーティングを、上述した化学蒸着処理により、ステンレス鋼切り取り試片上に堆積させた。これらの切り取り試片は、0.1%のギ酸に浸したのちに、金属イオン濃度について10倍以上の減少を示した。類似の二重膜をもHPLCカラムの内面に堆積させたところ、ステンレス鋼カラムと比較して、シトクロムCの液体クロマトグラフィー分離が優れていることを示した。
第4のコーティングは、原子層堆積により堆積された、TiO2の下のAl2O3の二重膜であった。このAl2O3/TiO2二重膜を、ステンレス鋼切り取り試片およびフリットと、100μmおよび250μmの内径を有する100mmの長さの毛管の内面および外面に堆積させた。コーティングを、トリメチルアルミニウムおよび200Cの水に100回交互にさらし、次いで、テトラキス(ジメチルアミド)チタン(IV)および200℃の水に827回交互にさらすことにより堆積させた。層の最終的な厚みは、Al2O3が約7nmおよびTiO2が40nmとなった。
Claims (9)
- 管腔、通路または空洞を有する金属製の物体の内面をコーティングするための方法であって、気相処理により、均一な厚みを有する連続した保護的なコーティングを形成することを含み、
(a)気相中に1つ以上の分子前駆体を供給するステップと、
(b)前記管腔、通路または空洞の内面を、前記気相中で、前記1つ以上の分子前駆体にさらすステップと、
(c)前記さらされた内面で、または、前記さらされた内面の付近で、前記1つ以上の分子前駆体を反応、分解、または、他の仕方で変化させ、次いで、その上に堆積させるステップと、
(d)不活性ガスを流して、それにより、反応しなかった1つ以上の分子前駆体を、および、存在するようであれば、反応の副産物を除去するステップと、
(e)所望の膜厚および/または組成に到達するために必要であれば、前記ステップ(a)〜(d)の1つ以上を選択的に繰り返すステップと、を含み、
前記保護的なコーティングは、Siベース、Tiベース、ZrベースまたはAlベースの無機化合物から選択された材料を含み、
前記Siベースの無機化合物は、SiC、Si 3 N 4 、SiO x C y (ここで2x+4y=4)、SiO m N n (ここで2m+3n=4)またはSiC x H y (ここで4x+y=4)である、方法。 - 前記管腔、通路または空洞は、約10mm未満の少なくとも1つの寸法および約20mmよりも長い少なくとも1つの寸法により特徴付けられる、請求項1に記載の方法。
- 前記金属製の部品は、
(A)約10mm未満の内径および約20mmよりも長い長さにより特徴付けられ、前記保護的なコーティングが約10nm〜約5μmの均一な厚みを有する、クロマトグラフィーカラム、または、(B)約1mmよりも小さい、少なくとも1つの内部寸法を有する微小流体素子もしくはその部品である、請求項1または請求項2に記載の方法。 - 前記保護的なコーティングは、ZrO2、Al2O3およびそれらの混合物から選択された材料を含む、請求項1〜請求項3のいずれか1項に記載の方法。
- 前記保護的なコーティングは、それぞれが異なる保護的な材料を含む2つ以上の層を含んでおり、または、当該金属製の部品は、ステンレス鋼、チタンまたはチタン合金で形成されている、請求項1〜請求項4のいずれか1項に記載の方法。
- 前記気相処理は化学蒸着または原子層堆積を含む、請求項1〜請求項5のいずれか1項に記載の方法。
- 前記保護的なコーティングは、Tiベースの材料を含む、請求項1〜請求項3のいずれか1項に記載の方法。
- 前記保護的なコーティングは、Zrベースの材料を含む、請求項1〜請求項3のいずれか1項に記載の方法。
- 前記保護的なコーティングは、Alベースの材料を含む、請求項1〜請求項3のいずれか1項に記載の方法。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/946,942 | 2013-07-19 | ||
| US13/946,942 US20150024152A1 (en) | 2013-07-19 | 2013-07-19 | Metal components with inert vapor phase coating on internal surfaces |
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| Publication Number | Publication Date |
|---|---|
| JP2015021965A JP2015021965A (ja) | 2015-02-02 |
| JP6568340B2 true JP6568340B2 (ja) | 2019-08-28 |
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| JP2014115869A Active JP6568340B2 (ja) | 2013-07-19 | 2014-06-04 | 内面に不活性の気相コーティングを有する金属部品の製造方法 |
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|---|---|
| US (11) | US20150024152A1 (ja) |
| EP (1) | EP2826884A1 (ja) |
| JP (1) | JP6568340B2 (ja) |
| CN (1) | CN104294236A (ja) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103237920B (zh) | 2010-10-05 | 2016-01-13 | 西尔科特克公司 | 耐磨涂层、包含该耐磨涂层的产品以及涂覆该耐磨涂层的方法 |
| WO2016114850A1 (en) | 2015-01-14 | 2016-07-21 | Agilent Technologies, Inc. | Components with an atomic layer deposition coating and methods of producing the same |
| US10876206B2 (en) * | 2015-09-01 | 2020-12-29 | Silcotek Corp. | Thermal chemical vapor deposition coating |
| CN105154853A (zh) * | 2015-09-11 | 2015-12-16 | 兰州空间技术物理研究所 | 一种在管状基底内表面沉积薄膜的方法 |
| US20160046408A1 (en) * | 2015-10-27 | 2016-02-18 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Internally coated vessel for housing a metal halide |
| US10087521B2 (en) * | 2015-12-15 | 2018-10-02 | Silcotek Corp. | Silicon-nitride-containing thermal chemical vapor deposition coating |
| EP3446106B1 (en) * | 2016-04-22 | 2021-01-27 | Hewlett-Packard Development Company, L.P. | Sers sensor apparatus with passivation film |
| CN109906108B (zh) * | 2016-11-11 | 2022-05-10 | 思拓凡瑞典有限公司 | 色谱柱 |
| US10487403B2 (en) * | 2016-12-13 | 2019-11-26 | Silcotek Corp | Fluoro-containing thermal chemical vapor deposition process and article |
| KR102604606B1 (ko) * | 2017-05-16 | 2023-11-22 | 주식회사 다이셀 | 크로마토그래피용 칼럼관 및 그것을 사용한 크로마토그래피용 칼럼 |
| US11161324B2 (en) | 2017-09-13 | 2021-11-02 | Silcotek Corp. | Corrosion-resistant coated article and thermal chemical vapor deposition coating process |
| US12180581B2 (en) * | 2017-09-18 | 2024-12-31 | Waters Technologies Corporation | Use of vapor deposition coated flow paths for improved chromatography of metal interacting analytes |
| US11709156B2 (en) | 2017-09-18 | 2023-07-25 | Waters Technologies Corporation | Use of vapor deposition coated flow paths for improved analytical analysis |
| US12181452B2 (en) * | 2017-09-18 | 2024-12-31 | Waters Technologies Corporation | Use of vapor deposition coated flow paths for improved chromatography of metal interacting analytes |
| US11709155B2 (en) | 2017-09-18 | 2023-07-25 | Waters Technologies Corporation | Use of vapor deposition coated flow paths for improved chromatography of metal interacting analytes |
| US11959894B2 (en) | 2018-02-23 | 2024-04-16 | Silcotek Corp | Liquid chromatography technique |
| WO2020022226A1 (ja) | 2018-07-23 | 2020-01-30 | ジーエルサイエンス株式会社 | カラムハードウェア及び分離カラム並びにそれらの製造方法 |
| CN113507971A (zh) | 2019-02-27 | 2021-10-15 | 沃特世科技公司 | 用于最大程度减少分析物吸附的色谱密封件和经涂覆的流动路径 |
| CN113507972B (zh) * | 2019-02-27 | 2023-10-20 | 沃特世科技公司 | 用于色谱效应的经涂覆的流动路径部件 |
| WO2020252306A1 (en) | 2019-06-14 | 2020-12-17 | Silcotek Corp. | Nano-wire growth |
| EP4090964B1 (en) | 2020-01-17 | 2025-05-21 | Waters Technologies Corporation | Methods to increase sensitivity of a lc/ms analysis |
| US11918936B2 (en) * | 2020-01-17 | 2024-03-05 | Waters Technologies Corporation | Performance and dynamic range for oligonucleotide bioanalysis through reduction of non specific binding |
| US11740211B2 (en) | 2020-01-31 | 2023-08-29 | Waters Technologies Corporation | LC/MS adduct mitigation by vapor deposition coated surfaces |
| US12473635B2 (en) | 2020-06-03 | 2025-11-18 | Silcotek Corp. | Dielectric article |
| EP4628889A3 (en) | 2020-09-24 | 2025-12-10 | Waters Technologies Corporation | Chromatographic hardware improvements for the separation of reactive molecules |
| WO2022093468A1 (en) * | 2020-10-30 | 2022-05-05 | Agilent Technologies, Inc. | Resistive coating for a capillary |
| JP7534254B2 (ja) * | 2021-03-26 | 2024-08-14 | 京セラ株式会社 | クロマトグラフィー管およびその製造方法ならびに高速液体クロマトグラフ |
| WO2023009395A1 (en) | 2021-07-30 | 2023-02-02 | Restek Corporation | Silica-passivated article and method for forming |
| CN117646188A (zh) * | 2023-12-14 | 2024-03-05 | 珠海格力电子元器件有限公司 | 化学气相沉积设备和化学气相沉积设备的制作方法 |
| US20250305122A1 (en) * | 2024-04-02 | 2025-10-02 | Entegris, Inc. | Coated conduits, related systems and related methods |
Family Cites Families (70)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2523257C2 (de) * | 1975-05-26 | 1982-10-28 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Beschichtung von Innenflächen bei rohrförmigen Hohlkörpern mit Tantal durch chemische Dampfphasenabscheidung |
| DE2829568C2 (de) * | 1978-07-05 | 1982-12-02 | Fa. Hermann C. Starck Berlin, 1000 Berlin | Verfahren zur Abscheidung von gleichmäßigen, festhaftenden Schichten hochschmelzender Metalle auf induktiv erhitzten Metallrohr-Innenflächen durch Gasphasenreduktion sowie Vorrichtung zur Durchführung des Verfahrens |
| JPS57161648A (en) * | 1981-03-31 | 1982-10-05 | Shimadzu Corp | Column of chromatography |
| DE3273546D1 (en) | 1981-06-19 | 1986-11-06 | Ceskoslovenska Akademie Ved | Column for liquid chromatography |
| US4376641A (en) | 1981-12-14 | 1983-03-15 | The Dow Chemical Company | Coated capillary chromatographic column |
| TW203633B (ja) | 1991-06-03 | 1993-04-11 | L Air Liquide Sa Pour L Expl Des Proce | |
| CA2070145A1 (en) * | 1991-06-03 | 1992-12-04 | Yao-En Li | Process for passivating metal surfaces to enhance the stability of gaseous hydride mixtures at low concentration in contact therewith |
| EP0624795B1 (en) | 1993-05-14 | 1999-04-07 | Upchurch Scientific, Inc. | Column for liquid chromatography |
| US5482628A (en) | 1994-04-15 | 1996-01-09 | Upchurch Scientific, Inc. | Column for liquid chromatography |
| US5651885A (en) | 1994-04-15 | 1997-07-29 | Schick; Hans G. | Column for liquid chromatography |
| US5871158A (en) * | 1997-01-27 | 1999-02-16 | The University Of Utah Research Foundation | Methods for preparing devices having metallic hollow microchannels on planar substrate surfaces |
| TW520440B (en) * | 1997-03-28 | 2003-02-11 | Shiseido Co Ltd | A liquid chromatography apparatus and a packing material for the chromatographic column |
| FI104383B (fi) * | 1997-12-09 | 2000-01-14 | Fortum Oil & Gas Oy | Menetelmä laitteistojen sisäpintojen päällystämiseksi |
| EP1043755B1 (en) | 1997-12-24 | 2004-08-04 | Hamamatsu Photonics K.K. | Deuterium gas discharge tube |
| US6511760B1 (en) | 1998-02-27 | 2003-01-28 | Restek Corporation | Method of passivating a gas vessel or component of a gas transfer system using a silicon overlay coating |
| JP2000173548A (ja) | 1998-12-09 | 2000-06-23 | Hamamatsu Photonics Kk | ガス放電管 |
| US6444326B1 (en) | 1999-03-05 | 2002-09-03 | Restek Corporation | Surface modification of solid supports through the thermal decomposition and functionalization of silanes |
| US6225211B1 (en) | 1999-04-29 | 2001-05-01 | Industrial Technology Research Institute | Method for making stacked and borderless via structures on semiconductor substrates for integrated circuits |
| US20020123606A1 (en) * | 1999-08-26 | 2002-09-05 | Kurian Joseph Varapadavil | Poly(trimethylene terephthalate) with low level of DI(1,3-propylene glycol) |
| KR100338361B1 (ko) * | 2000-01-28 | 2002-05-30 | 유승렬 | 탄화수소 열분해 반응기 튜브 내벽에 코크의 저감을 위한온라인 코팅 방법 |
| US6225221B1 (en) | 2000-02-10 | 2001-05-01 | Chartered Semiconductor Manufacturing Ltd. | Method to deposit a copper seed layer for dual damascene interconnects |
| DE10008906A1 (de) * | 2000-02-25 | 2001-08-30 | Bayer Ag | Testsystem auf Basis von Mikrokapillaren |
| US6749813B1 (en) * | 2000-03-05 | 2004-06-15 | 3M Innovative Properties Company | Fluid handling devices with diamond-like films |
| EP1262100B1 (en) | 2000-03-06 | 2011-07-06 | Fumakilla Limited | Fan type chemicals diffusing device |
| JP2002164190A (ja) | 2000-11-22 | 2002-06-07 | Matsushita Electric Ind Co Ltd | 陰極放電管の駆動装置及び方法 |
| JP2002228668A (ja) | 2001-01-31 | 2002-08-14 | Shimadzu Corp | オートサンプラ |
| DE60219620T2 (de) | 2001-06-06 | 2008-01-31 | Senju Pharmaceutical Co., Ltd. | L-ascorbinsäure-2-o-maleinsäure-a-tocopheroldiester-1-propanol addukt und verfahren zu dessen herstellung |
| US6729352B2 (en) | 2001-06-07 | 2004-05-04 | Nanostream, Inc. | Microfluidic synthesis devices and methods |
| US6880576B2 (en) | 2001-06-07 | 2005-04-19 | Nanostream, Inc. | Microfluidic devices for methods development |
| AUPS001602A0 (en) * | 2002-01-17 | 2002-02-07 | Sge International Pty Ltd | Chromatography column |
| JP2004037266A (ja) * | 2002-07-03 | 2004-02-05 | Chromato Science Kk | 分析用カラムとその製造方法 |
| US6783673B2 (en) * | 2002-08-23 | 2004-08-31 | Biotage, Inc. | Composite chromatography column |
| JP4358492B2 (ja) * | 2002-09-25 | 2009-11-04 | レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード | 熱化学気相成長法によるシリコン窒化物膜またはシリコンオキシ窒化物膜の製造方法 |
| US20040066703A1 (en) | 2002-10-03 | 2004-04-08 | Protasis Corporation | Fluid-handling apparatus and methods |
| US7070833B2 (en) | 2003-03-05 | 2006-07-04 | Restek Corporation | Method for chemical vapor deposition of silicon on to substrates for use in corrosive and vacuum environments |
| US6716693B1 (en) | 2003-03-27 | 2004-04-06 | Chartered Semiconductor Manufacturing Ltd. | Method of forming a surface coating layer within an opening within a body by atomic layer deposition |
| US20070017870A1 (en) * | 2003-09-30 | 2007-01-25 | Belov Yuri P | Multicapillary device for sample preparation |
| US7166212B2 (en) * | 2003-09-30 | 2007-01-23 | Chromba, Inc. | Multicapillary column for chromatography and sample preparation |
| CA2945455C (en) | 2003-11-20 | 2019-11-26 | Sigma-Aldrich Co. Llc | Polysilazane thermosetting polymers for use in chromatographic systems and applications |
| US8394338B2 (en) | 2004-04-26 | 2013-03-12 | Roche Diagnostics Operations, Inc. | Process for hydrophilizing surfaces of fluidic components and systems |
| US7879396B2 (en) * | 2004-06-04 | 2011-02-01 | Applied Microstructures, Inc. | High aspect ratio performance coatings for biological microfluidics |
| US20060251795A1 (en) | 2005-05-05 | 2006-11-09 | Boris Kobrin | Controlled vapor deposition of biocompatible coatings for medical devices |
| US20060171654A1 (en) | 2004-06-15 | 2006-08-03 | Hawkins Aaron R | Integrated planar microfluidic bioanalytical systems |
| US7300684B2 (en) | 2004-07-15 | 2007-11-27 | Sub-One Technology, Inc. | Method and system for coating internal surfaces of prefabricated process piping in the field |
| US7629270B2 (en) * | 2004-08-27 | 2009-12-08 | Asm America, Inc. | Remote plasma activated nitridation |
| US7220671B2 (en) | 2005-03-31 | 2007-05-22 | Intel Corporation | Organometallic precursors for the chemical phase deposition of metal films in interconnect applications |
| US7473637B2 (en) * | 2005-07-20 | 2009-01-06 | Micron Technology, Inc. | ALD formed titanium nitride films |
| US20070148326A1 (en) | 2005-12-28 | 2007-06-28 | Hastings Mitchell R | Syringe |
| JP5357059B2 (ja) | 2007-02-28 | 2013-12-04 | ウオーターズ・テクノロジーズ・コーポレイシヨン | 拡散結合チタン構成要素を有する液体クロマトグラフィ装置 |
| WO2008108754A1 (en) | 2007-03-06 | 2008-09-12 | Varian Semiconductor Equipment Associates, Inc. | Technique for atomic layer deposition |
| US7733552B2 (en) | 2007-03-21 | 2010-06-08 | Qualcomm Mems Technologies, Inc | MEMS cavity-coating layers and methods |
| EP2304423B1 (en) | 2008-07-18 | 2019-02-20 | Waters Technologies Corporation | Devices having an inert surface and methods of making same |
| US20110186537A1 (en) * | 2008-09-22 | 2011-08-04 | Becton, Dickinson And Company | Systems, Apparatus and Methods for Coating the Interior of a Container Using a Photolysis and/or Thermal Chemical Vapor Deposition Process |
| CN101750449A (zh) * | 2008-12-18 | 2010-06-23 | 中国科学院生态环境研究中心 | 脂蛋白毛细管涂层及其制备方法 |
| US9151734B2 (en) | 2009-03-05 | 2015-10-06 | Idex Health & Science Llc | Connection assembly for ultra high pressure liquid chromatography |
| DE102009002129A1 (de) * | 2009-04-02 | 2010-10-28 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Hartstoffbeschichtete Körper und Verfahren zur Herstellung hartstoffbeschichteter Körper |
| US7985188B2 (en) * | 2009-05-13 | 2011-07-26 | Cv Holdings Llc | Vessel, coating, inspection and processing apparatus |
| GB2471271A (en) * | 2009-06-19 | 2010-12-29 | Univ Dublin City | Method of coating the channels of a microfluidic device |
| EP2456481B1 (en) | 2009-07-24 | 2016-11-23 | Boston Scientific Scimed, Inc. | Medical devices having an inorganic coating layer formed by atomic layer deposition |
| JP5656010B2 (ja) * | 2009-12-04 | 2015-01-21 | ノベラス・システムズ・インコーポレーテッドNovellus Systems Incorporated | ハードマスク膜を形成する方法およびハードマスク膜を成膜する装置 |
| US8178443B2 (en) | 2009-12-04 | 2012-05-15 | Novellus Systems, Inc. | Hardmask materials |
| CN102905836B (zh) * | 2010-03-26 | 2016-05-04 | 沃特世科技公司 | 具有扩散结合且表面改性的构件的层析设备 |
| US9475225B2 (en) | 2010-07-16 | 2016-10-25 | SiO2 Medical Produts, Inc. | Injection molding process and product produced using the same |
| US8569070B2 (en) | 2010-07-16 | 2013-10-29 | Idex Health & Science Llc | Connection assembly for ultra high pressure liquid chromatography |
| US8329038B2 (en) * | 2010-11-16 | 2012-12-11 | Nobull Innovation Llc | Methods and apparatus for making a chromatography column |
| US9272095B2 (en) * | 2011-04-01 | 2016-03-01 | Sio2 Medical Products, Inc. | Vessels, contact surfaces, and coating and inspection apparatus and methods |
| US20150297800A1 (en) * | 2012-07-03 | 2015-10-22 | Sio2 Medical Products, Inc. | SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS |
| US20140273525A1 (en) | 2013-03-13 | 2014-09-18 | Intermolecular, Inc. | Atomic Layer Deposition of Reduced-Leakage Post-Transition Metal Oxide Films |
| JP6218921B2 (ja) | 2013-04-10 | 2017-10-25 | ピコサン オーワイPicosun Oy | Aldコーティングによるターゲットポンプ内部の保護 |
| US10767259B2 (en) | 2013-07-19 | 2020-09-08 | Agilent Technologies, Inc. | Components with an atomic layer deposition coating and methods of producing the same |
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| US20190390329A1 (en) | 2019-12-26 |
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