JP6559499B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP6559499B2 JP6559499B2 JP2015158245A JP2015158245A JP6559499B2 JP 6559499 B2 JP6559499 B2 JP 6559499B2 JP 2015158245 A JP2015158245 A JP 2015158245A JP 2015158245 A JP2015158245 A JP 2015158245A JP 6559499 B2 JP6559499 B2 JP 6559499B2
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- insulating film
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Description
図1は、実施形態1に基づくチップ状態の半導体装置の構成を説明する概略平面図である。
実施形態1の作用効果について説明する。
実施形態2においては、ベベル保護機構が設けられていない場合の半導体装置の製造方法について説明する。
以降の処理については、図11〜13で説明したのと同様の工程であるのでその詳細な説明については繰り返さない。
実施形態2の作用効果について説明する。
(実施形態3)
上記の実施形態2においては、ベベル保護機構が設けられていない場合の半導体装置の製造方法について説明したが、上述したように第5工程において異方性エッチングにより溝を形成する場合について説明した。当該工程において、マスク材MKも所定膜厚分エッチング除去され、マスク材MKの膜厚は、ウェハ面内でばらつく可能性がある。
実施形態3の作用効果について説明する。
上記の実施形態3においては、マスク材MK1の上に絶縁膜NR1を形成する。そして、当該絶縁膜NR1の上にマスク材MK2を形成する。溝DTRを形成する際にマスク材MK2をハードマスクとして利用するが、その際に生じる残膜ばらつきについて、絶縁膜NR1をストッパーとしてエッチング処理することによりリセットすることが可能である。そして、絶縁膜NR1を除去することによりマスク材MK1が露出される。マスク材MK1の膜厚のばらつきは小さいためコンタクトを形成する際の層間のばらつきを低減することができる。これにより、トランジスタ特性のばらつきを抑制することが可能となる。
上記の実施形態1においては、マスク材をハードマスクとした場合に残膜ばらつきを低減する方式について説明した。
実施形態4の作用効果について説明する。
実施形態5においては、上記の実施形態4で説明した簡易な製造プロセスとともに、ベベル保護機構が設けられていない場合でもベベル部を簡易なプロセスで保護することが可能な半導体装置の製造方法について説明する。
実施形態5の作用効果について説明する。
(実施形態6)
上記の実施形態においては、マスク材MKを上端として溝DTR内に中空SPを形成する場合について説明した。
なお、異方性エッチングは、ドライエッチングにより行なう。ゲート電極層GEの側壁に残存するマスク材MK1の上端の位置が、ゲート電極層GEの上端よりも下側に位置するまで行なうことが望ましい。
上記の実施形態6においては、マスク材MK2および絶縁膜NRを除去した後、マスク材MK1をドライエッチングすることにより、ゲート電極層GEの側壁に位置するマスク材MK1の絶縁膜を残しつつ溝周囲のマスク材MK1を除去する。そして、各素子上を覆うように、かつ溝DTR内に中空SPを形成するように各素子上および溝DTR内に絶縁膜IIAが形成される。
以上、本開示を実施形態に基づき具体的に説明したが、本開示は、実施形態に限定されるものではなく、その要旨を逸脱しない範囲で種々変更可能であることはいうまでもない。
Claims (7)
- 半導体基板の主表面に、複数のゲート電極を形成する工程と、
前記複数のゲート電極間を埋め込むように前記複数のゲート電極上に第1の絶縁膜を形成する工程と、
前記第1の絶縁膜に対して材質が異なる第2の絶縁膜を前記第1の絶縁膜上に形成する工程と、
前記第2の絶縁膜に対して材質が異なる第3の絶縁膜を前記第2の絶縁膜上に形成する工程と、
前記第3の絶縁膜上に感光体パターンを形成する工程と、
前記感光体パターンをマスクとしてエッチングすることにより前記第1から第3の絶縁膜を貫通して前記半導体基板に達する溝を形成する工程と、
前記第3の絶縁膜が露出するように前記感光体パターンを除去する工程と、
露出した前記第3の絶縁膜をマスクとしてエッチングすることにより前記溝を前記半導体基板の内部に延伸させる工程と、
前記第3の絶縁膜と前記第2の絶縁膜とを除去する工程と、
前記溝内に中空空間が生じるように前記溝内と前記第1の絶縁膜上とに第4の絶縁膜を形成する工程とを備え、
前記第3の絶縁膜は、前記半導体基板の前記主表面の周縁に位置するべベル部を覆うように形成され、
前記第3の絶縁膜を形成した後、前記べベル部にて前記第3の絶縁膜を覆うように前記第3の絶縁膜に対して材質が異なる第5の絶縁膜を形成する工程をさらに備え、
前記第5の絶縁膜が前記べベル部上にて前記第3の絶縁膜を覆った状態で、前記第1から第3の絶縁膜を貫通して前記半導体基板に達する前記溝が形成される、半導体装置の製造方法。 - 前記べベル部にて前記第3の絶縁膜を覆うように前記第5の絶縁膜を形成する工程は、
前記第3の絶縁膜上に前記第5の絶縁膜を形成する工程と、
前記第3の絶縁膜が露出するまで前記第5の絶縁膜を除去することにより、前記べベル部に前記第5の絶縁膜を残存させる工程とを含む、請求項1記載の半導体装置の製造方法。 - 前記第3の絶縁膜と前記第2の絶縁膜とを除去した後、前記第1の絶縁膜に異方性ドライエッチングすることにより、前記ゲート電極の側壁に位置する前記第1の絶縁膜を残しつつ前記溝周囲の前記第1の絶縁膜を除去する工程をさらに備え、
前記第1の絶縁膜を異方性ドライエッチングした後、前記溝内に中空空間が生じるように前記溝内と前記第1の絶縁膜上とに前記第4の絶縁膜を形成する、請求項1記載の半導体装置の製造方法。 - 前記第1の絶縁膜を異方性ドライエッチングする工程は、前記ゲート電極の側壁に残存する前記第1の絶縁膜の上端の位置が、前記ゲート電極の上端よりも下側に位置するまで行なう、請求項3記載の半導体装置の製造方法。
- 前記第3の絶縁膜を形成した後、前記第3の絶縁膜を平坦化する工程をさらに備え、
前記第3の絶縁膜を平坦化した後、前記第3の絶縁膜上に前記感光体パターンを形成する、請求項1記載の半導体装置の製造方法。 - 半導体基板の主表面に、複数のゲート電極を形成する工程と、
前記複数のゲート電極間を埋め込むように前記複数のゲート電極上に第1の絶縁膜を形成する工程と、
前記第1の絶縁膜に対して材質が異なる第2の絶縁膜を前記第1の絶縁膜上に形成する工程と、
前記第2の絶縁膜に対して材質が異なる第3の絶縁膜を前記第2の絶縁膜上に形成する工程と、
前記第3の絶縁膜上に感光体パターンを形成する工程と、
前記感光体パターンをマスクとしてエッチングすることにより前記第1から第3の絶縁膜を貫通して前記半導体基板に達する溝を形成する工程と、
前記第3の絶縁膜が露出するように前記感光体パターンを除去する工程と、
露出した前記第3の絶縁膜をマスクとしてエッチングすることにより前記溝を前記半導体基板の内部に延伸させる工程と、
前記第3の絶縁膜と前記第2の絶縁膜とを除去する工程と、
前記第3の絶縁膜と前記第2の絶縁膜とを除去した後、前記第1の絶縁膜に異方性ドライエッチングすることにより、前記ゲート電極の側壁に位置する前記第1の絶縁膜を残しつつ前記溝周囲の前記第1の絶縁膜を除去する工程と
前記第1の絶縁膜を異方性ドライエッチングした後、前記溝内に中空空間が生じるように前記溝内と前記第1の絶縁膜上とに第4の絶縁膜を形成する工程とを備える、半導体装置の製造方法。 - 前記第3の絶縁膜を形成した後、前記第3の絶縁膜を平坦化する工程をさらに備え、
前記第3の絶縁膜を平坦化した後、前記第3の絶縁膜上に前記感光体パターンを形成する、請求項6に記載の半導体装置の製造方法。
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CN112926173B (zh) * | 2019-12-06 | 2024-03-01 | 上海梅山钢铁股份有限公司 | 一种热轧高强钢板成形极限图的计算方法 |
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JP6062269B2 (ja) * | 2013-01-31 | 2017-01-18 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
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US20170047338A1 (en) | 2017-02-16 |
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