JP6545468B2 - 分割溝形成装置および分割溝形成方法 - Google Patents

分割溝形成装置および分割溝形成方法 Download PDF

Info

Publication number
JP6545468B2
JP6545468B2 JP2015006401A JP2015006401A JP6545468B2 JP 6545468 B2 JP6545468 B2 JP 6545468B2 JP 2015006401 A JP2015006401 A JP 2015006401A JP 2015006401 A JP2015006401 A JP 2015006401A JP 6545468 B2 JP6545468 B2 JP 6545468B2
Authority
JP
Japan
Prior art keywords
cutter
groove
motor
substrate
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015006401A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016132107A (ja
JP2016132107A5 (enExample
Inventor
島村　哲也
哲也 島村
和廣 百鬼
和廣 百鬼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shoda Techtron Corp
Original Assignee
Shoda Techtron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoda Techtron Corp filed Critical Shoda Techtron Corp
Priority to JP2015006401A priority Critical patent/JP6545468B2/ja
Priority to TW104136677A priority patent/TWI658889B/zh
Priority to CN201580062078.9A priority patent/CN107000253B/zh
Priority to US15/543,825 priority patent/US10195677B2/en
Priority to DE112015005977.6T priority patent/DE112015005977T5/de
Priority to PCT/JP2015/083185 priority patent/WO2016114013A1/ja
Publication of JP2016132107A publication Critical patent/JP2016132107A/ja
Publication of JP2016132107A5 publication Critical patent/JP2016132107A5/ja
Application granted granted Critical
Publication of JP6545468B2 publication Critical patent/JP6545468B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D45/00—Sawing machines or sawing devices with circular saw blades or with friction saw discs
    • B23D45/10—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a plurality of circular saw blades
    • B23D45/105—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a plurality of circular saw blades operating within the same plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
    • B28D1/048—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs with a plurality of saw blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Milling Processes (AREA)
JP2015006401A 2015-01-16 2015-01-16 分割溝形成装置および分割溝形成方法 Active JP6545468B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2015006401A JP6545468B2 (ja) 2015-01-16 2015-01-16 分割溝形成装置および分割溝形成方法
TW104136677A TWI658889B (zh) 2015-01-16 2015-11-06 分割槽形成裝置及分割槽形成方法
US15/543,825 US10195677B2 (en) 2015-01-16 2015-11-26 Dividing groove forming device, and dividing groove forming method
DE112015005977.6T DE112015005977T5 (de) 2015-01-16 2015-11-26 Teilungsrillenbildungsvorrichtung und Teilungsrillenbildungsverfahren
CN201580062078.9A CN107000253B (zh) 2015-01-16 2015-11-26 分割槽形成装置及分割槽形成方法
PCT/JP2015/083185 WO2016114013A1 (ja) 2015-01-16 2015-11-26 分割溝形成装置および分割溝形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015006401A JP6545468B2 (ja) 2015-01-16 2015-01-16 分割溝形成装置および分割溝形成方法

Publications (3)

Publication Number Publication Date
JP2016132107A JP2016132107A (ja) 2016-07-25
JP2016132107A5 JP2016132107A5 (enExample) 2018-03-01
JP6545468B2 true JP6545468B2 (ja) 2019-07-17

Family

ID=56405570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015006401A Active JP6545468B2 (ja) 2015-01-16 2015-01-16 分割溝形成装置および分割溝形成方法

Country Status (6)

Country Link
US (1) US10195677B2 (enExample)
JP (1) JP6545468B2 (enExample)
CN (1) CN107000253B (enExample)
DE (1) DE112015005977T5 (enExample)
TW (1) TWI658889B (enExample)
WO (1) WO2016114013A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018181908A (ja) * 2017-04-04 2018-11-15 株式会社ディスコ 加工方法
JP2018181902A (ja) 2017-04-04 2018-11-15 株式会社ディスコ 加工方法
JP7759612B2 (ja) * 2021-09-24 2025-10-24 ショーダテクトロン株式会社 板材切削装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1453332C3 (de) * 1961-04-05 1974-06-06 Vyzkumny A Vyvojovy Ustav Drevarsky, Prag Verfahren zum Längsschneiden von Holzklötzen bzw. Prismen
DE3737868A1 (de) 1987-11-07 1989-05-18 Loehr & Herrmann Gmbh Vorrichtung zum trennen und besaeumen von leiterplatten
JPH02109630A (ja) * 1988-10-20 1990-04-23 Mitsubishi Heavy Ind Ltd 移相装置
DE4035792C1 (en) * 1990-11-10 1992-04-23 Loehr & Herrmann Gmbh, 7531 Neuhausen, De Printed circuit board panel de-edging device - has two saw-blades mounted in bearingblockings which can be positionally adjusted
JP4338982B2 (ja) 2003-01-27 2009-10-07 ユニ・チャーム株式会社 ロータリーカッターおよびこれを用いた繊維製品の製造方法
US20080028902A1 (en) * 2006-08-03 2008-02-07 Kimberly-Clark Worldwide, Inc. Dual roll, variable sheet-length, perforation system
JP5305108B2 (ja) 2010-10-15 2013-10-02 修 小林 回転工具
CN103180255A (zh) * 2010-10-20 2013-06-26 旭硝子株式会社 母玻璃基板开孔加工方法及母玻璃基板
US9993932B2 (en) 2011-09-09 2018-06-12 Vits International, Inc. Rotary cutter

Also Published As

Publication number Publication date
JP2016132107A (ja) 2016-07-25
TW201627092A (zh) 2016-08-01
CN107000253B (zh) 2019-10-01
DE112015005977T5 (de) 2018-01-04
TWI658889B (zh) 2019-05-11
CN107000253A (zh) 2017-08-01
WO2016114013A1 (ja) 2016-07-21
US20170368619A1 (en) 2017-12-28
US10195677B2 (en) 2019-02-05

Similar Documents

Publication Publication Date Title
US7757591B2 (en) Aligned multi-diamond cutting tool assembly for creating microreplication tools
JP6545468B2 (ja) 分割溝形成装置および分割溝形成方法
TW201440986A (zh) 半導體單結晶錠的切片方法
TWI522207B (zh) A method and apparatus for punching a hard brittle sheet
JPH09103991A (ja) 裁断制御方法
JP7045126B2 (ja) 基板切断装置および基板切断方法
WO2007052553A1 (ja) オフセット工具によるワークの加工方法
EP2937196B1 (en) Blade for a cutting tool of a ceramic cutting machine
JP2012231058A (ja) ウエーハの加工方法
JP3596278B2 (ja) 丸ダイス式転造装置
JP2013058653A (ja) 板状物の分割方法
JP2016132107A5 (enExample)
CN106041595B (zh) 一种斜孔加工方法
JP2019043124A (ja) スクライビングホイール、その製造方法、スクライブ方法及びホルダユニット
JP2010184319A (ja) 切削方法
KR101616770B1 (ko) 절삭가공기구 및 절삭가공방법
AU2019363146A1 (en) Device for cutting sheet metal
JP4685560B2 (ja) 回転刃の研磨装置
JP2001162426A (ja) 曲面切削装置及び曲面切削方法
JP2589417B2 (ja) ダイシングソーを用いた小物部品の加工方法
JP2006130628A (ja) 板材の切断機
JP2017100231A (ja) 被加工物の分割方法
JP4469615B2 (ja) 円形部材の切り出し工具及びこの切り出し工具を用いた円形部材の切り出し方法
KR20230066844A (ko) 박막 유리의 절단면 식각 장치
JP2005228909A (ja) セラミック基板の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180115

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180115

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20181218

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20190212

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190227

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190528

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190619

R150 Certificate of patent or registration of utility model

Ref document number: 6545468

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313532

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250