TWI658889B - 分割槽形成裝置及分割槽形成方法 - Google Patents

分割槽形成裝置及分割槽形成方法 Download PDF

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Publication number
TWI658889B
TWI658889B TW104136677A TW104136677A TWI658889B TW I658889 B TWI658889 B TW I658889B TW 104136677 A TW104136677 A TW 104136677A TW 104136677 A TW104136677 A TW 104136677A TW I658889 B TWI658889 B TW I658889B
Authority
TW
Taiwan
Prior art keywords
cutter
tool
groove
motor
substrate
Prior art date
Application number
TW104136677A
Other languages
English (en)
Chinese (zh)
Other versions
TW201627092A (zh
Inventor
島村哲也
百鬼和廣
Original Assignee
日商庄田德古透隆股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商庄田德古透隆股份有限公司 filed Critical 日商庄田德古透隆股份有限公司
Publication of TW201627092A publication Critical patent/TW201627092A/zh
Application granted granted Critical
Publication of TWI658889B publication Critical patent/TWI658889B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D45/00—Sawing machines or sawing devices with circular saw blades or with friction saw discs
    • B23D45/10—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a plurality of circular saw blades
    • B23D45/105—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a plurality of circular saw blades operating within the same plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
    • B28D1/048—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs with a plurality of saw blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Milling Processes (AREA)
TW104136677A 2015-01-16 2015-11-06 分割槽形成裝置及分割槽形成方法 TWI658889B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-006401 2015-01-16
JP2015006401A JP6545468B2 (ja) 2015-01-16 2015-01-16 分割溝形成装置および分割溝形成方法

Publications (2)

Publication Number Publication Date
TW201627092A TW201627092A (zh) 2016-08-01
TWI658889B true TWI658889B (zh) 2019-05-11

Family

ID=56405570

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104136677A TWI658889B (zh) 2015-01-16 2015-11-06 分割槽形成裝置及分割槽形成方法

Country Status (6)

Country Link
US (1) US10195677B2 (enExample)
JP (1) JP6545468B2 (enExample)
CN (1) CN107000253B (enExample)
DE (1) DE112015005977T5 (enExample)
TW (1) TWI658889B (enExample)
WO (1) WO2016114013A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018181908A (ja) * 2017-04-04 2018-11-15 株式会社ディスコ 加工方法
JP2018181902A (ja) 2017-04-04 2018-11-15 株式会社ディスコ 加工方法
JP7759612B2 (ja) * 2021-09-24 2025-10-24 ショーダテクトロン株式会社 板材切削装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07100790A (ja) * 1990-11-10 1995-04-18 Loehr & Herrmann Gmbh プリント回路基板の切断装置と方法
CN1532328A (zh) * 2003-01-27 2004-09-29 ���ݼѹɷ����޹�˾ 旋转切割机及使用该旋转切割机的纤维制品制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1453332C3 (de) * 1961-04-05 1974-06-06 Vyzkumny A Vyvojovy Ustav Drevarsky, Prag Verfahren zum Längsschneiden von Holzklötzen bzw. Prismen
DE3737868A1 (de) 1987-11-07 1989-05-18 Loehr & Herrmann Gmbh Vorrichtung zum trennen und besaeumen von leiterplatten
JPH02109630A (ja) * 1988-10-20 1990-04-23 Mitsubishi Heavy Ind Ltd 移相装置
US20080028902A1 (en) * 2006-08-03 2008-02-07 Kimberly-Clark Worldwide, Inc. Dual roll, variable sheet-length, perforation system
JP5305108B2 (ja) 2010-10-15 2013-10-02 修 小林 回転工具
CN103180255A (zh) * 2010-10-20 2013-06-26 旭硝子株式会社 母玻璃基板开孔加工方法及母玻璃基板
US9993932B2 (en) 2011-09-09 2018-06-12 Vits International, Inc. Rotary cutter

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07100790A (ja) * 1990-11-10 1995-04-18 Loehr & Herrmann Gmbh プリント回路基板の切断装置と方法
CN1532328A (zh) * 2003-01-27 2004-09-29 ���ݼѹɷ����޹�˾ 旋转切割机及使用该旋转切割机的纤维制品制造方法

Also Published As

Publication number Publication date
JP2016132107A (ja) 2016-07-25
TW201627092A (zh) 2016-08-01
CN107000253B (zh) 2019-10-01
DE112015005977T5 (de) 2018-01-04
JP6545468B2 (ja) 2019-07-17
CN107000253A (zh) 2017-08-01
WO2016114013A1 (ja) 2016-07-21
US20170368619A1 (en) 2017-12-28
US10195677B2 (en) 2019-02-05

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