JP6542221B2 - プリント回路基板を使用して形成されたコネクタインサート - Google Patents
プリント回路基板を使用して形成されたコネクタインサート Download PDFInfo
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- JP6542221B2 JP6542221B2 JP2016536509A JP2016536509A JP6542221B2 JP 6542221 B2 JP6542221 B2 JP 6542221B2 JP 2016536509 A JP2016536509 A JP 2016536509A JP 2016536509 A JP2016536509 A JP 2016536509A JP 6542221 B2 JP6542221 B2 JP 6542221B2
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- printed circuit
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C3/00—Milling particular work; Special milling operations; Machines therefor
- B23C3/12—Trimming or finishing edges, e.g. deburring welded corners
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C5/00—Milling-cutters
- B23C5/02—Milling-cutters characterised by the shape of the cutter
- B23C5/04—Plain cutters, i.e. having essentially a cylindrical or tapered cutting surface of substantial length
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C5/00—Milling-cutters
- B23C5/02—Milling-cutters characterised by the shape of the cutter
- B23C5/12—Cutters specially designed for producing particular profiles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2210/00—Details of milling cutters
- B23C2210/08—Side or top views of the cutting edge
- B23C2210/086—Discontinuous or interrupted cutting edges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2210/00—Details of milling cutters
- B23C2210/08—Side or top views of the cutting edge
- B23C2210/088—Cutting edges with a wave form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2210/00—Details of milling cutters
- B23C2210/24—Overall form of the milling cutter
- B23C2210/244—Milling cutters comprised of disc-shaped modules or multiple disc-like cutters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2220/00—Details of milling processes
- B23C2220/16—Chamferring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2226/00—Materials of tools or workpieces not comprising a metal
- B23C2226/27—Composites, e.g. fibre reinforced composites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/06—Connectors or connections adapted for particular applications for computer periphery
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0227—Split or nearly split shielding or ground planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09027—Non-rectangular flat PCB, e.g. circular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09154—Bevelled, chamferred or tapered edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09354—Ground conductor along edge of main surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
- H05K2203/1469—Circuit made after mounting or encapsulation of the components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Description
本願は、参照によって本明細書に組み込まれる、2014年8月22日付で出願された米国特許出願第14/466,899号の優先権を主張し、2013年8月23日付で出願された米国特許仮出願第61/869,585号及び2013年11月17日付で出願された第61/905,275号の利益を主張するものである。
Claims (19)
- コネクタインサートであって、
上部、下部、及び前部を有するプリント回路基板と、
前記プリント回路基板上の1つ以上の電子デバイスと、
前記プリント回路基板の前記上部にメッキされた複数の第1の接点と、
前記プリント回路基板にメッキされ、かつ、前記複数の第1の接点の周囲に設けられた接地リングと、
前記複数の第1の接点を前記1つ以上の電子デバイスに結合するために前記プリント回路基板内に配線された複数のトレースと、を備え、
前記コネクタインサートは、対応するコネクタレセプタクル内に嵌合するように成形され、前記コネクタインサートが前記コネクタレセプタクルと結合するとき、前記接地リングは前記コネクタレセプタクル内の接地接点と直接接触し、前記複数の第1の接点のそれぞれは、前記コネクタレセプタクル内の複数の第2の接点のうちの対応する接点と直接接触する、コネクタインサート。 - 前記プリント回路基板の前記下部にメッキされた複数の第2の接点を更に備え、前記接地リングは前記複数の第2の接点の周囲に設けられ、かつ、前記コネクタインサートの下面の一部を形成する、請求項1に記載のコネクタインサート。
- 前記複数のトレースは、前記プリント回路基板内の1つ以上の層上に配線される、請求項1または2に記載のコネクタインサート。
- 前記複数のトレースのうちの少なくとも2つが整合されたインピーダンスを有する、請求項1から3のいずれか1項に記載のコネクタインサート。
- 前記プリント回路基板は中央接地平面を有する請求項1から4のいずれか一項に記載のコネクタインサート。
- 前記複数の第1の接点と前記接地リングとの間にソルダーマスク領域を更に備える、請求項1から5のいずれか1項に記載のコネクタインサート。
- 前記複数の第1の接点と前記接地リングとの間にカバーレイを更に備える、請求項1から6のいずれか1項に記載のコネクタインサート。
- 前記コネクタインサートの前記上部と前記前部との間、及び前記下部と前記前部との間の縁部が面取りされる、請求項7に記載のコネクタインサート。
- コネクタインサートを製造する方法であって、
1つ以上の電子デバイスをプリント回路基板上に配置することと、
複数の接点及び前記プリント回路基板上の前記1つ以上の電子デバイスへの複数の接続及び前記複数の接点の周囲の接地リングを含む、前記プリント回路基板上の領域をメッキすることと、を含み、
前記コネクタインサートは、対応するコネクタレセプタクルと係合するように成形され、前記コネクタインサートが前記コネクタレセプタクルと結合するとき、前記接地リングは前記コネクタレセプタクル内の接地接点と直接接触し、前記複数の接点のそれぞれは、前記コネクタレセプタクル内の複数の第2の接点のうちの対応する接点と直接接触する、方法。 - ソルダーマスク層を前記プリント回路基板上に配置することと、
前記ソルダーマスク層が主に前記プリント回路基板のメッキされていない領域を覆うように、前記ソルダーマスク層をエッチングすることと、を更に含む、請求項9に記載の方法。 - 前記プリント回路基板上の領域をメッキすることは、
銅層を前記プリント回路基板上にメッキすることと、
前記複数の接点及び前記プリント回路基板上の前記1つ以上の電子デバイスへの前記複数の接続を形成するように、前記銅層をエッチングすることと、を含む、請求項10に記載の方法。 - 前記プリント回路基板上の領域をメッキすることは、
ニッケル層を前記プリント回路基板上にメッキすることと、
前記銅層を覆うように前記ニッケル層をエッチングすることと、を含む、請求項11に記載の方法。 - 前記プリント回路基板上の領域をメッキすることは、
前記複数の接点を金メッキすることを更に含む、請求項12に記載の方法。 - 前記プリント回路基板上の領域をメッキすることは、
金層を前記プリント回路基板上にメッキすることと、
前記複数の接点を覆うように前記金層をエッチングすることと、を含む、請求項12に記載の方法。 - 前記プリント回路基板上の領域をメッキすることは、
金属層を前記プリント回路基板上にメッキすることと、
接点以外のメッキされた領域を覆うように、前記金属層をエッチングすることと、を含む、請求項14に記載の方法。 - 前記金属層はクロム又はパラジウム−ニッケルで形成される、請求項15に記載の方法。
- 前記接地リングが前記コネクタインサートの外面である請求項1に記載のコネクタインサート。
- 前記接地リングは前記プリント回路基板上に形成された金属層である請求項1から8のいずれか一項に記載のコネクタインサート。
- 前記接地リングは前記プリント回路基板上に形成された金属層である請求項9から16のいずれか一項に記載の方法。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361869585P | 2013-08-23 | 2013-08-23 | |
US61/869,585 | 2013-08-23 | ||
US201361905275P | 2013-11-17 | 2013-11-17 | |
US61/905,275 | 2013-11-17 | ||
US14/466,899 US9992863B2 (en) | 2013-08-23 | 2014-08-22 | Connector inserts and receptacle tongues formed using printed circuit boards |
US14/466,899 | 2014-08-22 | ||
PCT/US2014/052538 WO2015027239A2 (en) | 2013-08-23 | 2014-08-25 | Connector inserts and receptacle tongues formed using printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016531407A JP2016531407A (ja) | 2016-10-06 |
JP6542221B2 true JP6542221B2 (ja) | 2019-07-10 |
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ID=51589499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016536509A Expired - Fee Related JP6542221B2 (ja) | 2013-08-23 | 2014-08-25 | プリント回路基板を使用して形成されたコネクタインサート |
Country Status (7)
Country | Link |
---|---|
US (1) | US9992863B2 (ja) |
JP (1) | JP6542221B2 (ja) |
KR (1) | KR101856393B1 (ja) |
CN (1) | CN105474476B (ja) |
AU (1) | AU2014308574B2 (ja) |
DE (1) | DE112014003876T5 (ja) |
WO (1) | WO2015027239A2 (ja) |
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USD684539S1 (en) | 2012-07-06 | 2013-06-18 | Apple Inc. | Connector |
WO2015073974A2 (en) | 2013-11-17 | 2015-05-21 | Apple Inc. | Connector receptacle having a shield |
CN204424499U (zh) | 2013-11-17 | 2015-06-24 | 苹果公司 | 电子设备、连接器插入部和连接器插座 |
US9450339B2 (en) | 2014-01-12 | 2016-09-20 | Apple Inc. | Ground contacts for reduced-length connector inserts |
US10418763B2 (en) | 2014-05-26 | 2019-09-17 | Apple Inc. | Connector insert assembly |
US9490581B2 (en) | 2014-05-26 | 2016-11-08 | Apple Inc. | Connector insert assembly |
US9356370B2 (en) | 2014-05-26 | 2016-05-31 | Apple Inc. | Interposer for connecting a receptacle tongue to a printed circuit board |
US9515439B2 (en) | 2014-05-26 | 2016-12-06 | Apple Inc. | Connector insert assembly |
DE202016002696U1 (de) * | 2016-04-20 | 2017-07-24 | Würth Elektronik eiSos Gmbh & Co. KG | Steckverbinder für die Datenübertragung |
CN106507603A (zh) * | 2016-12-30 | 2017-03-15 | 桂林电子科技大学 | 一种符合人机工程学的快速定位操作的贴片工序辅助装置 |
JP6930854B2 (ja) * | 2017-04-28 | 2021-09-01 | 新光電気工業株式会社 | 基板モジュール |
CN112151081B (zh) * | 2019-06-26 | 2022-05-31 | 西部数据技术公司 | 数据存储设备和用于其的连接器 |
USD966193S1 (en) * | 2020-05-22 | 2022-10-11 | Dongguan Ceesing Intelligent Device Manufacturing Co, Ltd | Connector |
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CN105474476A (zh) | 2016-04-06 |
DE112014003876T5 (de) | 2016-05-12 |
AU2014308574A1 (en) | 2016-03-10 |
WO2015027239A4 (en) | 2015-08-27 |
WO2015027239A2 (en) | 2015-02-26 |
JP2016531407A (ja) | 2016-10-06 |
KR20160035597A (ko) | 2016-03-31 |
WO2015027239A3 (en) | 2015-06-25 |
CN105474476B (zh) | 2019-06-18 |
US9992863B2 (en) | 2018-06-05 |
AU2014308574B2 (en) | 2018-02-15 |
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