JP6534686B2 - 冷却器 - Google Patents
冷却器 Download PDFInfo
- Publication number
- JP6534686B2 JP6534686B2 JP2016566527A JP2016566527A JP6534686B2 JP 6534686 B2 JP6534686 B2 JP 6534686B2 JP 2016566527 A JP2016566527 A JP 2016566527A JP 2016566527 A JP2016566527 A JP 2016566527A JP 6534686 B2 JP6534686 B2 JP 6534686B2
- Authority
- JP
- Japan
- Prior art keywords
- tank
- pipe
- base block
- cooler
- pipes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
- F28F7/02—Blocks traversed by passages for heat-exchange media
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Air-Conditioning For Vehicles (AREA)
Description
本願は、2014年12月25日に出願された特願2014−262356号に基づき優先権を主張し、その内容をここに援用する。
また、本発明の冷却器において、タンクの上下方向の高さは発熱体の上下方向の高さよりも低く設定されているとよい。
図1から図3は、本発明の実施形態の冷却器100を示している。この冷却器100は、発熱体10が装着される装着面21aが上下方向に沿って形成されたベースブロック20と、このベースブロック20の装着面21aとは反対側の反対面21bに埋設された複数のタンク31及び各タンク31の側面に立設した状態で接続された複数のパイプ32からなるパイプユニット30と、複数のパイプ32を貫通させた状態でこれらパイプ32に取り付けられた複数の放熱フィン40とを備え、車両に用いられる。
20 ベースブロック
21a 装着面
21b 反対面
30 パイプユニット
31 タンク
32 パイプ
40 放熱フィン
60 冷媒
100 冷却器
Claims (3)
- 上下方向に沿い発熱体が装着される装着面を有するベースブロックと、
該ベースブロックの前記装着面とは反対面に埋設され冷媒が収容されたタンク、及び該タンクの側面に立設状態で接続された相互に平行な複数のパイプからなるパイプユニットと、
複数の前記パイプを貫通させた状態でこれらパイプに取り付けられた複数の放熱フィンと
を備え、
前記タンクは、前記ベースブロックの厚み方向に沿う厚みを上下方向に沿う高さよりも薄くした偏平形状に設けられ、前記タンクの厚みの半分以上が前記ベースブロックに埋め込まれ、
前記パイプは、前記タンクの側面の上側位置に接続されており、前記タンクにおける前記パイプの接続口が、前記タンク内の前記冷媒の液面より上方に間隔をおいて設けられている
冷却器。 - 前記ベースブロックには、前記発熱体が上下に複数設置されるとともに、複数の前記パイプユニットが相互に並列に埋設されており、
前記各パイプユニットの前記タンクの設置間隔が、前記発熱体の設置予定間隔よりも狭く設定されており、
前記放熱フィンが、前記各パイプユニットの前記パイプに跨って一体に設けられている請求項1に記載の冷却器。 - タンクの上下方向の高さは発熱体の上下方向の高さよりも低く設定されていることを特徴とする請求項2記載の冷却器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014262356 | 2014-12-25 | ||
JP2014262356 | 2014-12-25 | ||
PCT/JP2015/086286 WO2016104727A1 (ja) | 2014-12-25 | 2015-12-25 | 冷却器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016104727A1 JPWO2016104727A1 (ja) | 2017-10-05 |
JP6534686B2 true JP6534686B2 (ja) | 2019-06-26 |
Family
ID=56150739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016566527A Expired - Fee Related JP6534686B2 (ja) | 2014-12-25 | 2015-12-25 | 冷却器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10544993B2 (ja) |
EP (1) | EP3239639A4 (ja) |
JP (1) | JP6534686B2 (ja) |
KR (1) | KR20170097057A (ja) |
CN (1) | CN107003077A (ja) |
WO (1) | WO2016104727A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016104729A1 (ja) * | 2014-12-25 | 2016-06-30 | 三菱アルミニウム株式会社 | 冷却器 |
WO2019229876A1 (ja) * | 2018-05-30 | 2019-12-05 | 三菱電機株式会社 | 冷却装置 |
CN111386012B (zh) * | 2020-02-28 | 2022-03-25 | 北京空间飞行器总体设计部 | 一种适用于临近空间的可变散热能力的散热器 |
JP7492598B2 (ja) * | 2020-03-23 | 2024-05-29 | ケーエムダブリュ・インコーポレーテッド | 電装素子の放熱装置 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5253702A (en) * | 1992-01-14 | 1993-10-19 | Sun Microsystems, Inc. | Integral heat pipe, heat exchanger, and clamping plate |
JP3067399B2 (ja) * | 1992-07-03 | 2000-07-17 | 株式会社日立製作所 | 半導体冷却装置 |
JP3020790B2 (ja) * | 1993-12-28 | 2000-03-15 | 株式会社日立製作所 | ヒートパイプ式冷却装置とこれを用いた車両制御装置 |
JPH0942870A (ja) | 1995-07-31 | 1997-02-14 | Hitachi Cable Ltd | ヒートパイプ式ヒートシンク |
JPH10274487A (ja) | 1997-03-31 | 1998-10-13 | Toshiba Transport Eng Kk | ヒートパイプ式冷却器 |
JP2004125381A (ja) * | 2002-08-02 | 2004-04-22 | Mitsubishi Alum Co Ltd | ヒートパイプユニット及びヒートパイプ冷却器 |
JP4714434B2 (ja) * | 2004-07-20 | 2011-06-29 | 古河スカイ株式会社 | ヒートパイプヒートシンク |
EP1859336A2 (de) * | 2005-03-07 | 2007-11-28 | Asetek A/S | Kühlsystem für elektronische geräte, insbesondere computer |
JP2009270750A (ja) | 2008-05-05 | 2009-11-19 | Golden Sun News Technics Co Ltd | 放熱器に埋め込んだヒートパイプ蒸発部の平坦化法とヒートパイプ付き放熱器 |
JP2010060164A (ja) * | 2008-09-01 | 2010-03-18 | Sumitomo Light Metal Ind Ltd | ヒートパイプ式ヒートシンク |
JP2010133686A (ja) * | 2008-12-08 | 2010-06-17 | Mitsubishi Materials Corp | ヒートパイプ及び冷却器 |
CN101945561A (zh) * | 2009-07-07 | 2011-01-12 | 富准精密工业(深圳)有限公司 | 散热装置及其制造方法 |
JP5131323B2 (ja) * | 2010-07-02 | 2013-01-30 | 日立電線株式会社 | ヒートパイプ式冷却装置及びこれを用いた車両制御装置 |
US20120216991A1 (en) * | 2011-02-25 | 2012-08-30 | Shih-Ming Chen | Method for assembling heat pipe and thermo-conductive body and structure thereof |
JP2012234928A (ja) * | 2011-04-28 | 2012-11-29 | Toyota Industries Corp | 沸騰冷却装置 |
CN103167780B (zh) * | 2011-12-16 | 2016-06-08 | 台达电子企业管理(上海)有限公司 | 功率模块用复合式散热器组件 |
US20130180688A1 (en) * | 2012-01-16 | 2013-07-18 | Cooler Master Co., Ltd. | Heat-dissipating module and method for manufacturing the same |
JP2014152983A (ja) * | 2013-02-07 | 2014-08-25 | Mitsubishi Alum Co Ltd | 冷却器 |
JP2014159915A (ja) | 2013-02-20 | 2014-09-04 | Uacj Copper Tube Corp | 自然空冷型ヒートパイプ式ヒートシンク |
US20140293541A1 (en) * | 2013-03-26 | 2014-10-02 | Ge Energy Power Conversion Technology Ltd | Heat pipe heat sink for high power density |
US10107558B2 (en) * | 2013-09-02 | 2018-10-23 | Asia Vital Components Co., Ltd. | Thermal module |
US20160102920A1 (en) * | 2014-10-08 | 2016-04-14 | Mersen Canada Toronto Inc. | Heat pipe assembly with bonded fins on the baseplate hybrid |
WO2016104729A1 (ja) * | 2014-12-25 | 2016-06-30 | 三菱アルミニウム株式会社 | 冷却器 |
WO2016104728A1 (ja) * | 2014-12-25 | 2016-06-30 | 三菱アルミニウム株式会社 | 冷却器 |
-
2015
- 2015-12-25 KR KR1020177017334A patent/KR20170097057A/ko unknown
- 2015-12-25 JP JP2016566527A patent/JP6534686B2/ja not_active Expired - Fee Related
- 2015-12-25 EP EP15873295.8A patent/EP3239639A4/en not_active Withdrawn
- 2015-12-25 CN CN201580067513.7A patent/CN107003077A/zh active Pending
- 2015-12-25 WO PCT/JP2015/086286 patent/WO2016104727A1/ja active Application Filing
- 2015-12-25 US US15/537,288 patent/US10544993B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10544993B2 (en) | 2020-01-28 |
KR20170097057A (ko) | 2017-08-25 |
EP3239639A4 (en) | 2018-10-17 |
US20180051936A1 (en) | 2018-02-22 |
JPWO2016104727A1 (ja) | 2017-10-05 |
EP3239639A1 (en) | 2017-11-01 |
CN107003077A (zh) | 2017-08-01 |
WO2016104727A1 (ja) | 2016-06-30 |
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