CN101945561A - 散热装置及其制造方法 - Google Patents

散热装置及其制造方法 Download PDF

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CN101945561A
CN101945561A CN2009103041002A CN200910304100A CN101945561A CN 101945561 A CN101945561 A CN 101945561A CN 2009103041002 A CN2009103041002 A CN 2009103041002A CN 200910304100 A CN200910304100 A CN 200910304100A CN 101945561 A CN101945561 A CN 101945561A
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pedestal
heat
heat pipe
pipe
heat abstractor
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余业飞
查新祥
金先敏
郭哲豪
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Priority to CN2009103041002A priority Critical patent/CN101945561A/zh
Priority to US12/560,353 priority patent/US20110005727A1/en
Publication of CN101945561A publication Critical patent/CN101945561A/zh
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making
    • Y10T29/49353Heat pipe device making

Abstract

一种散热装置,包括一基座及结合于该基座内的至少一热管,该热管包括一管体、设于该管体内的毛细结构及容纳于管体内的工作液体,该热管的管体通过插入铸造成型的方式埋设于基座内从而与基座结合于一体,该热管的至少一末端露置于基座外部。该散热装置的制造方法包括以下步骤:提供内部设有毛细结构的一金属管体,该金属管体具有相对的第一末端和第二末端,该第一末端开口;将该管体置入模具内与熔融金属结合形成包覆该管体的一基座,同时使该管体的第一末端露置于基座外部;从该管体的第一末端对该管体注入工作液体并抽真空;密封该管体的第一末端。

Description

散热装置及其制造方法
技术领域
本发明涉及一种适合于发热电子元件散热的散热装置及其制造方法。
背景技术
随着电脑产业的迅速发展,CPU追求高速度化,多功能化及小型化所衍生的散热问题越来越严重,因此,必须将热量及时有效地散发出去,否则会极大地影响电子元件的工作性能,同时还会缩减电子元件的使用寿命。
业界通常采用散热装置为发热电子元件散热。传统的散热装置大多采用吸热底板与圆型热管的组合,该吸热底板上开设有容置热管的凹槽,该热管收容于凹槽内并与吸热底板通过锡膏焊接相连,然而,此类结构的散热装置存在以下几点问题:其一、成型该散热装置时,需在吸热底板上开设凹槽,及组合该热管与吸热底板的工序,其制造过程及组装过程繁琐费时,造成成本的增加;其二、由于制程公差的问题,该热管与吸热底板结合不紧密,容易产生较大的接触热阻,严重影响热传导效率;其三、由于锡膏焊接的工艺不易控制致使产品的品质差异较大。
发明内容
有鉴于此,有必要提供一种制程简单且散热效率高的散热装置及其制造方法。
一种散热装置,包括一基座及结合于该基座内的至少一热管,该热管包括一管体、设于该管体内的毛细结构及容纳于管体内的工作液体,该热管的管体通过插入铸造成型的方式埋设于基座内从而与基座结合于一体,该热管的至少一末端露置于基座外部。
提供内部设有毛细结构的一金属管体,该金属管体具有相对的第一末端和第二末端,该第一末端开口;将该管体置入模具内与熔融金属结合形成包覆该管体的一基座,同时使该管体的第一末端露置于基座外部;从该管体的第一末端对该管体注入工作液体并抽真空;密封该管体的第一末端。
与传统散热装置相比,上述散热装置省去了在基座上开设凹槽及组装并焊接热管与基座的工序,制程简单方便,且热管与基座通过铸造成型的方式一体成型,该热管与基座实现无间隙紧密结合,大大减小了热管与基座之间的接触热阻,提高散热装置的散热性能。
附图说明
图1为本发明散热装置第一实施例的立体图。
图2为图1所示散热装置沿II-II线的剖面图。
图3为图1所示散热装置的一制造方法的流程图。
图4为运用图3所示制造方法成型图1所示散热装置的成型过程示意图。
图5为本发明散热装置第二实施例的仰视图。
图6为本发明散热装置第三实施例的立体图。
具体实施方式
请参阅图1及图2,该散热装置100包括一基座12及埋设于基座12内的数根热管16。
该基座12大致呈方矩形,其由导热性能良好的金属材料比如铝制成。该基座12包括用于与发热电子元件(图未示)接触的一底面122及与该底面122相对的一顶面124。
这些热管16的形状结构相同,每一热管16呈直线型延伸,包括一中空管体162、贴附于管体162内壁的毛细结构164及容纳于管体162内的工作液体(图未示)。该管体162由导热良能良好的金属材料比如铜制成。该工作液体为低沸点液体,比如水、酒精等。该工作液体受热时易蒸发汽化,遇冷则易液化凝结。该毛细结构164可为细微的沟槽、烧结粉末、丝网或任意其中之二组合的复合型毛细结构。本实施例中,该毛细结构164为烧结粉末。该毛细结构164内具有若干细小孔隙,可为液化凝结后的工作液体提供回流的动力。
这些热管16相互平行,且均匀间隔设置。这些热管16从基座12的一侧边延伸至相对的另一侧边。每一热管16的两末端分别突出于该基座12的两侧而露置于外界。这些热管16呈扁平状,从而每一热管16具有一平坦的吸热面161。该热管16的吸热面161暴露出基座12并与基座12的底面122平齐,因此,该热管16的吸热面161可直接与发热电子元件接触吸热。
请参阅图3及图4,成型该散热装置100时,首先提供内部设有毛细结构164a的扁平状金属管体162a,该管体162a的一端开口,另一端密封;将管体162a置入一成型所述基座12的铸造模具18内,并向该模具18注入熔融金属,使管体162a与熔融的金属结合在一起形成包覆该管体162a的基座12,同时使该管体162a的两末端露置于基座外部;从该管体162a的开口端对该管体162a注入工作液体并抽真空;密封该管体162a的开口端,得到所述散热装置100。
该热管16通过插入铸造成型(Insert Molding)的方式嵌设于该基座12内与该基座12结合于一体,在将管体162a置入模具18中之前,对该管体162a进行压扁使其具有平坦的吸热面161。在将管体162a置入模具18中时,使该管体162a的至少一末端即开口端露置于基座12外部,以便于成型完成之后对管体162a进行注液、抽真空及封口等操作。
和传统散热装置相比,该散热装置100省去了在基座12内开设凹槽的工序,且无需组装热管16与基座12,省去焊接工艺,制程简单方便。此外,该热管16与基座12之间实现无间隙的紧密结合,大大减少了热管16与基座12间的接触热阻。本实施例中,该基座12由铝制成,该热管16的管体162由铜制成,为避免该铝质的基座12与铜质的热管16发生电化学腐蚀,可预先在热管16的管体162的外表面喷涂或镀覆一层界面材料比如镍层。
该散热装置100工作时,该基座12的底面122与热管16的吸热面161贴设于发热电子元件上,该基座12的底面122与热管16的吸热面161同时从发热电子元件吸热。该基座12将吸收的热量直接传导至其顶面124散发出去;热管16吸收热量后,其内的工作液体蒸发汽化,将热量迅速传导至整个热管16的内部,然后迅速传导至热管16外围的基座12,使基座12各部分均匀受热。由于热管16与基座12成型为一体的结构,热管16与基座12之间的热阻达到最小,因而热量可迅速从热管16传递至基座12,从而提升该散热装置100的散热性能。
图5所示为本发明散热装置第二实施例,该散热装置200与上述实施例的散热装置100相似,包括一方矩状的基座22及通过铸造成型的方式嵌设于基座22底部的热管26、27。该散热装置200与上述实施例的散热装置100的不同之处在于:该散热装置200包括一呈直线型的第一热管26及弯折的两第二热管27。该第一热管26位于中间,从基座22的一侧边的中央延伸至相对的另一侧边的中央,该第一热管26的两末端分别突出于基座22两侧。
该两第二热管27分别位于该第一热管26的两侧。该两第二热管27包括位于中间的直管部272及分别位于直管部272两端的两折管部271、273,该两第二热管27的直管部272与第一热管26相平行,折管部271、273分别呈放射状向基座22的四个角落延伸并突出于基座22外侧,由于第二热管27的折管部271、273向基座22的角落延伸,可使基座22受热更均匀,从而提高基座22的利用率。成型该散热装置200的方法与成型上述实施例中的散热装置100的方法相同,在此不赘述。
图6所示为本发明散热装置的第三实施例。该散热装置300与上述第一实施例中的散热装置100相似,也包括一基座32及设于该基座32内的热管36。该基座32具有与发热电子元件接触的底面322及与底面322相对的一顶面324。该散热装置300与上述第一实施例中的散热装置100的区别在于:成型该基座32时,于该基座32的顶面324一体延伸出若干散热鳍片34,该热管36的形状也与上述实施例中的热管16的形状有所不同,该热管36呈U型。沿其延伸方向包括一蒸发段362及一冷凝段364。该热管36的蒸发段362埋设于基座32内,冷凝段364穿设于散热鳍片34中。该热管36也呈扁平状,从而其蒸发段362也具有一平坦的接触面用于与发热电子元件接触。该热管36通过插入铸造成型的方式与该基座32、散热鳍片34结合于一体,如此可使该热管36与基座32及散热鳍片34间实现无间隙的紧密结合,使热管36与基座32、散热鳍片34间的接触热阻降至最小,从而提升该散热装置300的散热效率。
成型该散热装置300的方法与成型上述第一实施例的散热装置100的方法相似。首先提供内部设有毛细结构的金属管体,该管体的一端开口,另一端密封,该管体呈扁平状,且弯折成U型;将管体置入一成型所述基座32及散热鳍片34的模具内,使管体用于形成蒸发段362的部分与熔融的金属结合在一起形成包覆该蒸发段部分的基座32,该管体用于形成冷凝段364的部分与熔融的金属结合在一起形成包覆该冷凝段部分外围的散热鳍片34,同时使该管体的两末端露置于基座32或散热鳍片34的外部;从该管体的开口端对该管体注入工作液体并抽真空;密封管体的该开口端,得到该散热装置300。

Claims (10)

1.一种散热装置,包括一基座及结合于该基座内的至少一热管,该热管包括一管体、设于该管体内的毛细结构及容纳于管体内的工作液体,其特征在于:该热管的管体通过插入铸造成型的方式埋设于基座内从而与基座结合于一体,该热管的至少一末端露置于基座外部。
2.如权利要求1所述的散热装置,其特征在于:该热管呈扁平状,该热管具有一平坦的吸热面,该基座具有一用于与热源接触的底面,该热管的吸热面暴露于外界并与基座的底面平齐从而可与热源直接接触。
3.如权利要求2所述的散热装置,其特征在于:该基座包括与该底面相对的一顶面,该基座的顶面向上一体延伸形成若干散热鳍片。
4.如权利要求3所述的散热装置,其特征在于:该热管呈U型,包括一蒸发段及一冷凝段,该蒸发段埋设于该基座内,该冷凝段穿设于该散热鳍片中。
5.如权利要求1所述的散热装置,其特征在于:该基座呈方矩状,该热管有多个,包括第一热管及第二热管,该第一热管呈直线型,从该基座的一侧边的中央延伸至相对的另一侧边的中央,该第二热管包括与第一热管平行的一直管部及位于直管部两端的两折管部,该第二热管的折管部朝该基座的角落处延伸并突出于基座外侧。
6.一种散热装置的制造方法,包括以下步骤:
提供内部设有毛细结构的一金属管体,该金属管体具有相对的第一末端和第二末端,该第一末端开口;
将该管体置入模具内与熔融金属结合形成包覆该管体的一基座,同时使该管体的第一末端露置于基座外部;
从该管体的第一末端对该管体注入工作液体并抽真空;
密封该管体的第一末端。
7.如权利要求6所述的散热装置的制造方法,其特征在于:该基座具有一用于与热源接触的底面及与该底面相对的一顶面,成型该基座时,该基座的顶面一体形成若干散热鳍片。
8.如权利要求7所述的散热装置的制造方法,其特征在于:该热管呈U型,包括一蒸发段及一冷凝段,该蒸发段设于该基座内,该冷凝段穿设于该散热鳍片上。
9.如权利要求6所述的散热装置的制造方法,其特征在于:在将管体置入模具中之前先在管体的外表面涂覆一层界面材料。
10.如权利要求6至9中任意一项所述的散热装置的制造方法,其特征在于:该基座具有一用于与热源接触的底面,在将管体置入模具中之前,对该管体进行压扁使其具有平坦的吸热面,该管体与熔融金属成型后,该管体的吸热面与基座的底面平齐从而露置于外界。
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