JP6533207B2 - 太陽電池モジュール - Google Patents
太陽電池モジュール Download PDFInfo
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- JP6533207B2 JP6533207B2 JP2016240273A JP2016240273A JP6533207B2 JP 6533207 B2 JP6533207 B2 JP 6533207B2 JP 2016240273 A JP2016240273 A JP 2016240273A JP 2016240273 A JP2016240273 A JP 2016240273A JP 6533207 B2 JP6533207 B2 JP 6533207B2
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- 239000004020 conductor Substances 0.000 claims description 31
- 239000003566 sealing material Substances 0.000 claims description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 12
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 230000008602 contraction Effects 0.000 description 7
- 238000005476 soldering Methods 0.000 description 5
- 230000037303 wrinkles Effects 0.000 description 5
- 238000003475 lamination Methods 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
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Description
図1は、本発明の実施形態1に係る車両の外観を示す斜視図である。図2は、本発明の実施形態1に係る車両が備える太陽電池モジュールの外観を示す平面図であって、図1の矢印II方向から見た図である。図3は、図2中の太陽電池モジュールにおいて第一カバーを外して内部構造を拡大して示す平面図である。なお、簡略化のため、太陽電池モジュールの一部の太陽電池セルのみを記載している。図4は位置決め構造を説明するために示す平面図である。図5は、図4中のV−V線に沿った断面図である。
また、第二カバー112は、透明であっても不透明であってもよい。
図8は、本発明の実施形態2に従ったタブ線の平面図である。実施の形態2に従ったタブ線230では、2つの台座231の間に別の台座233が設けられており、台座233には貫通孔が設けられておらず接続座のみが設けられている。さらに台座231,233を接続する伸縮部232は、4本の波形配線232aで構成されている。ストリングス間コネクタ320,330も同様に構成されてもよい。
Claims (3)
- 少なくとも一部分が透明性を有する板状の第一カバーと、
前記第一カバーに対向配置された第二カバーと、
前記第一カバーおよび前記第二カバーの間に配置された少なくとも1つの太陽電池セルと、
前記第一カバーおよび前記第二カバーの間を埋めて互いを接合し、前記太陽電池セルを封止する封止材と、
前記太陽電池セルに電気的に接続されて前記第一カバーと前記第二カバーとの間で前記封止材に取り囲まれる導電体とを備え、
前記導電体は、複数の台座と、前記複数の台座を接続する、長手方向に伸縮可能な配線とを有し、前記複数の台座には、貫通孔と、前記太陽電池セルに電気的に接続される接続座とが設けられ、
前記第一カバーおよび前記第二カバーの少なくとも一方は、前記複数の台座の前記貫通孔に挿入されて前記導電体を位置決めする位置決め部を有し、
複数の前記太陽電池セルが一列に接続されて太陽電池ストリングを構成し、前記複数の台座は、前記太陽電池ストリングの両端部に接続され、前記位置決め部は前記太陽電池ストリングの両端部に接続された前記導電体を位置決めする、太陽電池モジュール。 - 前記第一カバーは外部から前記第一カバー内部を遮蔽する有色部を備え、
前記位置決め部は前記有色部と前記第二カバーとの間に配置される、請求項1に記載の太陽電池モジュール。 - 前記位置決め部は前記有色部に一体で設けられる、請求項2に記載の太陽電池モジュール。
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CN201711293245.8A CN108231927B (zh) | 2016-12-12 | 2017-12-08 | 太阳能电池组件以及导电体 |
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