JP6529684B2 - 表面処理銅箔及びこれを用いた銅張積層板 - Google Patents

表面処理銅箔及びこれを用いた銅張積層板 Download PDF

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Publication number
JP6529684B2
JP6529684B2 JP2018545262A JP2018545262A JP6529684B2 JP 6529684 B2 JP6529684 B2 JP 6529684B2 JP 2018545262 A JP2018545262 A JP 2018545262A JP 2018545262 A JP2018545262 A JP 2018545262A JP 6529684 B2 JP6529684 B2 JP 6529684B2
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Prior art keywords
copper foil
laser
layer
foil
treated copper
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Japanese (ja)
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JPWO2018181061A1 (ja
Inventor
佐藤　章
章 佐藤
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THE FURUKAW ELECTRIC CO., LTD.
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THE FURUKAW ELECTRIC CO., LTD.
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2018545262A 2017-03-30 2018-03-23 表面処理銅箔及びこれを用いた銅張積層板 Active JP6529684B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017068487 2017-03-30
JP2017068487 2017-03-30
PCT/JP2018/011885 WO2018181061A1 (ja) 2017-03-30 2018-03-23 表面処理銅箔及びこれを用いた銅張積層板

Publications (2)

Publication Number Publication Date
JPWO2018181061A1 JPWO2018181061A1 (ja) 2019-04-04
JP6529684B2 true JP6529684B2 (ja) 2019-06-12

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JP2018545262A Active JP6529684B2 (ja) 2017-03-30 2018-03-23 表面処理銅箔及びこれを用いた銅張積層板

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Country Link
JP (1) JP6529684B2 (ko)
KR (1) KR102353878B1 (ko)
CN (1) CN110475909B (ko)
TW (1) TWI693306B (ko)
WO (1) WO2018181061A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019173164A (ja) * 2018-03-28 2019-10-10 日立金属株式会社 アルミニウム箔の製造方法
JP7247015B2 (ja) * 2019-05-08 2023-03-28 古河電気工業株式会社 電解銅箔、該電解銅箔を用いた表面処理銅箔、並びに該表面処理銅箔を用いた銅張積層板及びプリント配線板
TWI764170B (zh) * 2019-06-19 2022-05-11 金居開發股份有限公司 微粗糙電解銅箔以及銅箔基板
CN111455416B (zh) * 2020-05-29 2021-02-09 佛冈建滔实业有限公司 一种高精密线路板高力学性能电解铜箔的制备工艺
CN115046367B (zh) * 2022-05-26 2024-04-09 九江德福科技股份有限公司 一种电解铜箔表面干燥处理方法及装置

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EP1139415B1 (en) * 2000-03-30 2009-02-25 Nitto Denko Corporation Water-permeable adhesive tape for semiconductor processing
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
US6893742B2 (en) * 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement
JP2003340964A (ja) * 2002-03-18 2003-12-02 Ube Ind Ltd 銅張り積層基板
JP2004237596A (ja) * 2003-02-06 2004-08-26 Nippon Steel Chem Co Ltd フレキシブル銅張積層板およびその製造方法
CN1985411A (zh) * 2004-02-11 2007-06-20 奥林公司 耐激光切割铜箔
JP2006216194A (ja) * 2005-02-07 2006-08-17 Toray Ind Inc 磁気記録媒体支持体およびその製造方法
US8722199B2 (en) * 2005-03-31 2014-05-13 Mitsui Mining & Smelting Co., Ltd. Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil
KR20090004961A (ko) * 2006-03-24 2009-01-12 우베 고산 가부시키가이샤 동배선 폴리이미드 필름의 제조방법 및 동배선 폴리이미드 필름
JP5181618B2 (ja) * 2007-10-24 2013-04-10 宇部興産株式会社 金属箔積層ポリイミド樹脂基板
JP2009172996A (ja) * 2007-12-26 2009-08-06 Shin Etsu Chem Co Ltd フレキシブル銅張積層板及びその製造方法
JP5400447B2 (ja) * 2009-03-31 2014-01-29 三井金属鉱業株式会社 粗化処理銅箔、粗化処理銅箔の製造方法及び銅張積層板
CN101787251B (zh) * 2010-02-10 2013-08-28 上海南亚覆铜箔板有限公司 一种适用于全避光性能的覆铜箔层压板的粘合剂
US9138964B2 (en) * 2010-11-22 2015-09-22 Mitsui Mining & Smelting Co., Ltd Surface-treated copper foil
JP5653876B2 (ja) 2011-09-30 2015-01-14 古河電気工業株式会社 レーザー吸収層付き銅箔および該銅箔を用いた銅張り積層板及びプリント配線板
AU2013298673B2 (en) 2012-07-31 2016-09-22 Sanofi Sa Arrangement for a drug delivery device
JP6425399B2 (ja) 2013-03-28 2018-11-21 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
KR101449342B1 (ko) * 2013-11-08 2014-10-13 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지
JP5710737B1 (ja) * 2013-11-29 2015-04-30 Jx日鉱日石金属株式会社 表面処理銅箔、積層板、プリント配線板、プリント回路板及び電子機器
JP6591766B2 (ja) * 2014-04-24 2019-10-16 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、積層体、電子機器及びプリント配線板の製造方法
JP5823005B1 (ja) * 2014-08-29 2015-11-25 Jx日鉱日石金属株式会社 キャリア付銅箔の製造方法、銅張積層板の製造方法、プリント配線板の製造方法、及び、電子機器及びキャリア付銅箔
JP6236119B2 (ja) * 2015-06-24 2017-11-22 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
CN204820554U (zh) * 2015-07-30 2015-12-02 无锡光群雷射科技有限公司 全新激光全息镭射箱包包装膜
CN108044242A (zh) * 2017-12-18 2018-05-18 中国兵器装备集团自动化研究所 一种激光加工铜箔孔的装置

Also Published As

Publication number Publication date
CN110475909A (zh) 2019-11-19
TWI693306B (zh) 2020-05-11
KR20190133681A (ko) 2019-12-03
TW201903212A (zh) 2019-01-16
JPWO2018181061A1 (ja) 2019-04-04
KR102353878B1 (ko) 2022-01-19
WO2018181061A1 (ja) 2018-10-04
CN110475909B (zh) 2021-12-24

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