JP6526427B2 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

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Publication number
JP6526427B2
JP6526427B2 JP2015012993A JP2015012993A JP6526427B2 JP 6526427 B2 JP6526427 B2 JP 6526427B2 JP 2015012993 A JP2015012993 A JP 2015012993A JP 2015012993 A JP2015012993 A JP 2015012993A JP 6526427 B2 JP6526427 B2 JP 6526427B2
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Japan
Prior art keywords
film
transistor
oxide
insulating film
semiconductor
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Expired - Fee Related
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JP2015012993A
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Japanese (ja)
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JP2015164181A (ja
JP2015164181A5 (enExample
Inventor
宮入　秀和
秀和 宮入
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2015012993A priority Critical patent/JP6526427B2/ja
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Publication of JP2015164181A5 publication Critical patent/JP2015164181A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00—Three-dimensional [3D] integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/62—Fin field-effect transistors [FinFET]

Landscapes

  • Thin Film Transistor (AREA)
  • Semiconductor Memories (AREA)
  • Electroluminescent Light Sources (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Non-Volatile Memory (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
JP2015012993A 2014-01-30 2015-01-27 半導体装置の作製方法 Expired - Fee Related JP6526427B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015012993A JP6526427B2 (ja) 2014-01-30 2015-01-27 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014015495 2014-01-30
JP2014015495 2014-01-30
JP2015012993A JP6526427B2 (ja) 2014-01-30 2015-01-27 半導体装置の作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019088202A Division JP2019125812A (ja) 2014-01-30 2019-05-08 半導体装置

Publications (3)

Publication Number Publication Date
JP2015164181A JP2015164181A (ja) 2015-09-10
JP2015164181A5 JP2015164181A5 (enExample) 2018-03-01
JP6526427B2 true JP6526427B2 (ja) 2019-06-05

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Family Applications (3)

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JP2015012993A Expired - Fee Related JP6526427B2 (ja) 2014-01-30 2015-01-27 半導体装置の作製方法
JP2019088202A Withdrawn JP2019125812A (ja) 2014-01-30 2019-05-08 半導体装置
JP2020219741A Active JP7054410B2 (ja) 2014-01-30 2020-12-29 半導体装置

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JP2019088202A Withdrawn JP2019125812A (ja) 2014-01-30 2019-05-08 半導体装置
JP2020219741A Active JP7054410B2 (ja) 2014-01-30 2020-12-29 半導体装置

Country Status (4)

Country Link
US (1) US20150214256A1 (enExample)
JP (3) JP6526427B2 (enExample)
KR (1) KR102325158B1 (enExample)
TW (1) TWI662653B (enExample)

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KR102244460B1 (ko) * 2013-10-22 2021-04-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102320576B1 (ko) * 2013-12-27 2021-11-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102582740B1 (ko) 2014-05-30 2023-09-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 이의 제조 방법, 및 전자 장치
US9831238B2 (en) 2014-05-30 2017-11-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including insulating film having opening portion and conductive film in the opening portion
US9647129B2 (en) 2014-07-04 2017-05-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2016125044A1 (en) 2015-02-06 2016-08-11 Semiconductor Energy Laboratory Co., Ltd. Device, manufacturing method thereof, and electronic device
KR102582523B1 (ko) 2015-03-19 2023-09-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 전자 기기
TWI777164B (zh) 2015-03-30 2022-09-11 日商半導體能源研究所股份有限公司 半導體裝置的製造方法
US10978489B2 (en) 2015-07-24 2021-04-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display panel, method for manufacturing semiconductor device, method for manufacturing display panel, and information processing device
WO2017081579A1 (en) * 2015-11-13 2017-05-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP6917700B2 (ja) 2015-12-02 2021-08-11 株式会社半導体エネルギー研究所 半導体装置
WO2017103737A1 (en) 2015-12-18 2017-06-22 Semiconductor Energy Laboratory Co., Ltd. Display panel, input/output device, data processing device, and method for manufacturing display panel
JP6853663B2 (ja) * 2015-12-28 2021-03-31 株式会社半導体エネルギー研究所 半導体装置
CN108886021B (zh) * 2016-02-12 2023-07-25 株式会社半导体能源研究所 半导体装置及其制造方法
JP6968567B2 (ja) * 2016-04-22 2021-11-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR102626961B1 (ko) * 2016-07-27 2024-01-17 엘지디스플레이 주식회사 하이브리드 타입의 박막 트랜지스터 및 이를 이용한 유기발광 표시장치
KR102458660B1 (ko) 2016-08-03 2022-10-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
KR102702938B1 (ko) 2016-11-30 2024-09-03 엘지디스플레이 주식회사 멀티 타입의 박막 트랜지스터를 포함하는 유기발광 표시장치
WO2019066872A1 (en) * 2017-09-28 2019-04-04 Intel Corporation MONOLITHIC INTEGRATION OF A THIN FILM TRANSISTOR ON A COMPLEMENTARY TRANSISTOR
US10381315B2 (en) * 2017-11-16 2019-08-13 Samsung Electronics Co., Ltd. Method and system for providing a reverse-engineering resistant hardware embedded security module
WO2019175704A1 (ja) 2018-03-16 2019-09-19 株式会社半導体エネルギー研究所 電気モジュール、表示パネル、表示装置、入出力装置、情報処理装置、電気モジュールの作製方法
US11189490B2 (en) 2018-09-28 2021-11-30 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing a semiconductor device and a semiconductor device
DE102019112120B4 (de) * 2018-09-28 2025-05-22 Taiwan Semiconductor Manufacturing Co. Ltd. Verfahren zur herstellung eines halbleiter-bauelements und halbleiter-bauelement
WO2020084415A1 (ja) * 2018-10-26 2020-04-30 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法
TWI690060B (zh) 2019-04-25 2020-04-01 元太科技工業股份有限公司 記憶體結構及其製造方法
KR102715249B1 (ko) 2019-12-31 2024-10-10 엘지디스플레이 주식회사 디스플레이 장치
US11929436B2 (en) 2021-02-02 2024-03-12 Taiwan Semiconductor Manufacturing Company Limited Thin transistor including a hydrogen-blocking dielectric barrier and methods for forming the same

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JP5064747B2 (ja) 2005-09-29 2012-10-31 株式会社半導体エネルギー研究所 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法
KR20120099475A (ko) * 2009-12-04 2012-09-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
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TWI525619B (zh) * 2011-01-27 2016-03-11 半導體能源研究所股份有限公司 記憶體電路
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JP5826716B2 (ja) * 2012-06-19 2015-12-02 株式会社東芝 半導体装置及びその製造方法
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Also Published As

Publication number Publication date
JP2015164181A (ja) 2015-09-10
TW201532197A (zh) 2015-08-16
US20150214256A1 (en) 2015-07-30
JP2019125812A (ja) 2019-07-25
TWI662653B (zh) 2019-06-11
KR20150091003A (ko) 2015-08-07
JP2021052213A (ja) 2021-04-01
JP7054410B2 (ja) 2022-04-13
KR102325158B1 (ko) 2021-11-10

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