JP6515819B2 - 評価装置、プローブ位置の検査方法 - Google Patents

評価装置、プローブ位置の検査方法 Download PDF

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Publication number
JP6515819B2
JP6515819B2 JP2016002890A JP2016002890A JP6515819B2 JP 6515819 B2 JP6515819 B2 JP 6515819B2 JP 2016002890 A JP2016002890 A JP 2016002890A JP 2016002890 A JP2016002890 A JP 2016002890A JP 6515819 B2 JP6515819 B2 JP 6515819B2
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Japan
Prior art keywords
probes
transparent member
housing
insulating plate
prism
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Active
Application number
JP2016002890A
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English (en)
Japanese (ja)
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JP2017123442A5 (enExample
JP2017123442A (ja
Inventor
竹迫　憲浩
憲浩 竹迫
岡田　章
章 岡田
貴也 野口
貴也 野口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2016002890A priority Critical patent/JP6515819B2/ja
Priority to US15/283,617 priority patent/US9804197B2/en
Priority to CN201710010160.8A priority patent/CN106960804B/zh
Publication of JP2017123442A publication Critical patent/JP2017123442A/ja
Publication of JP2017123442A5 publication Critical patent/JP2017123442A5/ja
Application granted granted Critical
Publication of JP6515819B2 publication Critical patent/JP6515819B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2016002890A 2016-01-08 2016-01-08 評価装置、プローブ位置の検査方法 Active JP6515819B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016002890A JP6515819B2 (ja) 2016-01-08 2016-01-08 評価装置、プローブ位置の検査方法
US15/283,617 US9804197B2 (en) 2016-01-08 2016-10-03 Evaluation apparatus and probe position inspection method
CN201710010160.8A CN106960804B (zh) 2016-01-08 2017-01-06 评价装置、探针位置的检查方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016002890A JP6515819B2 (ja) 2016-01-08 2016-01-08 評価装置、プローブ位置の検査方法

Publications (3)

Publication Number Publication Date
JP2017123442A JP2017123442A (ja) 2017-07-13
JP2017123442A5 JP2017123442A5 (enExample) 2018-07-12
JP6515819B2 true JP6515819B2 (ja) 2019-05-22

Family

ID=59275562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016002890A Active JP6515819B2 (ja) 2016-01-08 2016-01-08 評価装置、プローブ位置の検査方法

Country Status (3)

Country Link
US (1) US9804197B2 (enExample)
JP (1) JP6515819B2 (enExample)
CN (1) CN106960804B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018013342A (ja) * 2016-07-19 2018-01-25 株式会社ディスコ 検査方法
WO2019097629A1 (ja) * 2017-11-16 2019-05-23 三菱電機株式会社 プローブカード、半導体測定装置および半導体測定システム
CN108287266A (zh) * 2017-12-29 2018-07-17 南京协辰电子科技有限公司 Pcb阻抗自动测试机
CN108828267B (zh) * 2018-03-19 2021-05-25 长江存储科技有限责任公司 晶圆翘曲程度测量方法及装置
WO2022259454A1 (ja) * 2021-06-10 2022-12-15 日本電子材料株式会社 プローブカード

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4929893A (en) * 1987-10-06 1990-05-29 Canon Kabushiki Kaisha Wafer prober
JPH01282829A (ja) * 1988-05-10 1989-11-14 Canon Inc ウエハプローバ
JPH0756498B2 (ja) * 1991-12-04 1995-06-14 株式会社東京カソード研究所 プローブカード検査装置
US5657394A (en) * 1993-06-04 1997-08-12 Integrated Technology Corporation Integrated circuit probe card inspection system
JPH0837211A (ja) * 1994-07-26 1996-02-06 Hitachi Ltd 半導体装置の検査装置
US6002426A (en) * 1997-07-02 1999-12-14 Cerprobe Corporation Inverted alignment station and method for calibrating needles of probe card for probe testing of integrated circuits
JPH11149107A (ja) * 1997-11-17 1999-06-02 Canon Inc 電子カメラ
EP0962777A3 (en) * 1998-06-02 2002-12-11 Nihon Densan Read Kabushiki Kaisha, (Nidec-Read Corporation) Printed circuit board testing apparatus
US6710798B1 (en) * 1999-03-09 2004-03-23 Applied Precision Llc Methods and apparatus for determining the relative positions of probe tips on a printed circuit board probe card
JP2001189353A (ja) * 2000-01-04 2001-07-10 Toshiba Corp プローブ検査装置及びプローブ検査方法
JP4721247B2 (ja) * 2001-03-16 2011-07-13 東京エレクトロン株式会社 プローブ方法及びプローブ装置
JP2005292455A (ja) * 2004-03-31 2005-10-20 Hosiden Corp 撮像装置及びこれを搭載した電子機器
JP5250279B2 (ja) 2008-02-23 2013-07-31 東京エレクトロン株式会社 プローブ装置
JP5260119B2 (ja) * 2008-04-02 2013-08-14 東京エレクトロン株式会社 アライメント方法
JP5892912B2 (ja) * 2012-11-20 2016-03-23 三菱電機株式会社 半導体装置の評価方法
JP6084469B2 (ja) * 2013-01-28 2017-02-22 三菱電機株式会社 半導体評価装置および半導体評価方法
JP6478891B2 (ja) * 2015-10-07 2019-03-06 三菱電機株式会社 プローブ位置検査装置

Also Published As

Publication number Publication date
US20170199225A1 (en) 2017-07-13
CN106960804A (zh) 2017-07-18
CN106960804B (zh) 2020-05-08
US9804197B2 (en) 2017-10-31
JP2017123442A (ja) 2017-07-13

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