JP6510846B2 - 異方性導電フィルム、接続方法、及び接合体 - Google Patents
異方性導電フィルム、接続方法、及び接合体 Download PDFInfo
- Publication number
- JP6510846B2 JP6510846B2 JP2015060755A JP2015060755A JP6510846B2 JP 6510846 B2 JP6510846 B2 JP 6510846B2 JP 2015060755 A JP2015060755 A JP 2015060755A JP 2015060755 A JP2015060755 A JP 2015060755A JP 6510846 B2 JP6510846 B2 JP 6510846B2
- Authority
- JP
- Japan
- Prior art keywords
- anisotropic conductive
- conductive film
- electronic component
- organic peroxide
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 24
- 125000002091 cationic group Chemical group 0.000 claims description 38
- 238000010438 heat treatment Methods 0.000 claims description 38
- 150000001451 organic peroxides Chemical class 0.000 claims description 38
- 238000006243 chemical reaction Methods 0.000 claims description 36
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 239000003795 chemical substances by application Substances 0.000 claims description 31
- 239000002245 particle Substances 0.000 claims description 27
- 230000000977 initiatory effect Effects 0.000 claims description 21
- 238000003825 pressing Methods 0.000 claims description 18
- 239000002516 radical scavenger Substances 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 10
- 238000000354 decomposition reaction Methods 0.000 claims 1
- 238000011156 evaluation Methods 0.000 description 29
- 238000005260 corrosion Methods 0.000 description 20
- 230000007797 corrosion Effects 0.000 description 20
- 239000000758 substrate Substances 0.000 description 14
- 239000011521 glass Substances 0.000 description 12
- 239000000126 substance Substances 0.000 description 10
- 238000000137 annealing Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000006087 Silane Coupling Agent Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 150000001768 cations Chemical class 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- -1 radical compound Chemical class 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000013034 phenoxy resin Substances 0.000 description 6
- 229920006287 phenoxy resin Polymers 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000002923 metal particle Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 230000009257 reactivity Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005536 corrosion prevention Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 1
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
- NJJFUIRLYRVDFM-UHFFFAOYSA-N 2,3,5,6-tetrabutylbenzene-1,4-diol Chemical compound CCCCC1=C(O)C(CCCC)=C(CCCC)C(O)=C1CCCC NJJFUIRLYRVDFM-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 229910017008 AsF 6 Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 239000004250 tert-Butylhydroquinone Substances 0.000 description 1
- 235000019281 tert-butylhydroquinone Nutrition 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Insulated Conductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesive Tapes (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015060755A JP6510846B2 (ja) | 2015-03-24 | 2015-03-24 | 異方性導電フィルム、接続方法、及び接合体 |
| CN201680014311.0A CN107429125B (zh) | 2015-03-24 | 2016-02-26 | 各向异性导电膜、连接方法及接合体 |
| KR1020177023549A KR102026547B1 (ko) | 2015-03-24 | 2016-02-26 | 이방성 도전 필름, 접속 방법, 및 접합체 |
| PCT/JP2016/055866 WO2016152385A1 (ja) | 2015-03-24 | 2016-02-26 | 異方性導電フィルム、接続方法、及び接合体 |
| TW105106656A TWI690945B (zh) | 2015-03-24 | 2016-03-04 | 各向異性導電薄膜、連接方法、及其接合體 |
| HK18104772.6A HK1245316A1 (zh) | 2015-03-24 | 2018-04-12 | 各向異性導電膜、連接方法及接合體 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015060755A JP6510846B2 (ja) | 2015-03-24 | 2015-03-24 | 異方性導電フィルム、接続方法、及び接合体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016180047A JP2016180047A (ja) | 2016-10-13 |
| JP2016180047A5 JP2016180047A5 (zh) | 2018-02-08 |
| JP6510846B2 true JP6510846B2 (ja) | 2019-05-08 |
Family
ID=56977973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015060755A Active JP6510846B2 (ja) | 2015-03-24 | 2015-03-24 | 異方性導電フィルム、接続方法、及び接合体 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6510846B2 (zh) |
| KR (1) | KR102026547B1 (zh) |
| CN (1) | CN107429125B (zh) |
| HK (1) | HK1245316A1 (zh) |
| TW (1) | TWI690945B (zh) |
| WO (1) | WO2016152385A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117377229B (zh) * | 2023-12-07 | 2024-02-20 | 深圳清大电子科技有限公司 | 一种用于导电膜贴合的热压工艺与设备 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001323246A (ja) * | 2000-03-07 | 2001-11-22 | Sony Chem Corp | 電極接続用接着剤及びこれを用いた接着方法 |
| US6942824B1 (en) * | 2002-05-22 | 2005-09-13 | Western Digital (Fremont), Inc. | UV curable and electrically conductive adhesive for bonding magnetic disk drive components |
| JP2006199778A (ja) * | 2005-01-19 | 2006-08-03 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体 |
| JP4967482B2 (ja) * | 2006-02-27 | 2012-07-04 | 日立化成工業株式会社 | 導電粒子、接着剤組成物及び回路接続材料 |
| CN102167964B (zh) * | 2006-07-21 | 2013-10-16 | 日立化成株式会社 | 电路连接材料、电路部件的连接结构及电路部件的连接方法 |
| JP5226562B2 (ja) * | 2008-03-27 | 2013-07-03 | デクセリアルズ株式会社 | 異方性導電フィルム、並びに、接合体及びその製造方法 |
| JP4897778B2 (ja) * | 2008-11-20 | 2012-03-14 | ソニーケミカル＆インフォメーションデバイス株式会社 | 接続フィルム、並びに、接合体及びその製造方法 |
| TWI529186B (zh) * | 2009-11-05 | 2016-04-11 | 日立化成股份有限公司 | 熱聚合系起始劑系統及黏著劑組成物 |
| JP5685473B2 (ja) * | 2011-04-06 | 2015-03-18 | デクセリアルズ株式会社 | 異方性導電フィルム、接合体の製造方法、及び接合体 |
| JP5690637B2 (ja) * | 2011-04-12 | 2015-03-25 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法及び接続構造体 |
| WO2013024544A1 (ja) * | 2011-08-18 | 2013-02-21 | 日立化成工業株式会社 | 接着材リール |
| JP6231257B2 (ja) * | 2011-12-15 | 2017-11-15 | デクセリアルズ株式会社 | 導電性接着剤、及び電子部品の接続方法 |
| JP6002518B2 (ja) * | 2012-09-21 | 2016-10-05 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
-
2015
- 2015-03-24 JP JP2015060755A patent/JP6510846B2/ja active Active
-
2016
- 2016-02-26 KR KR1020177023549A patent/KR102026547B1/ko active IP Right Grant
- 2016-02-26 WO PCT/JP2016/055866 patent/WO2016152385A1/ja active Application Filing
- 2016-02-26 CN CN201680014311.0A patent/CN107429125B/zh active Active
- 2016-03-04 TW TW105106656A patent/TWI690945B/zh active
-
2018
- 2018-04-12 HK HK18104772.6A patent/HK1245316A1/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN107429125A (zh) | 2017-12-01 |
| HK1245316A1 (zh) | 2018-08-24 |
| KR102026547B1 (ko) | 2019-09-27 |
| WO2016152385A1 (ja) | 2016-09-29 |
| JP2016180047A (ja) | 2016-10-13 |
| TWI690945B (zh) | 2020-04-11 |
| TW201635312A (zh) | 2016-10-01 |
| KR20170107530A (ko) | 2017-09-25 |
| CN107429125B (zh) | 2020-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7100088B2 (ja) | 導電材料 | |
| KR102649655B1 (ko) | 접착제 조성물 | |
| TWI699415B (zh) | 熱硬化性接著組成物 | |
| JP2013206823A (ja) | 導電性粒子、回路接続材料、実装体、及び実装体の製造方法 | |
| JP2008111092A (ja) | 回路接続材料及びそれを用いた接続構造体 | |
| KR102615097B1 (ko) | 회로 접속용 접착제 조성물 및 구조체 | |
| JP6510846B2 (ja) | 異方性導電フィルム、接続方法、及び接合体 | |
| TW201539489A (zh) | 各向異性導電薄膜、其連接方法及其接合體 | |
| KR102114802B1 (ko) | 이방성 도전 필름, 접속 방법 및 접합체 | |
| US7846547B2 (en) | Insulation-coated conductive particle | |
| JP7006029B2 (ja) | 回路接続用接着剤組成物及び構造体 | |
| KR102094305B1 (ko) | 회로 접속 재료 | |
| JP6472702B2 (ja) | 異方性導電フィルム、接続方法、及び接合体 | |
| JP6493968B2 (ja) | 接続方法、接合体、異方性導電フィルム、及び接合体の前駆体 | |
| JP5177439B2 (ja) | 絶縁被覆導電粒子 | |
| JP2002226808A (ja) | 回路接続用接着剤 | |
| JP7506714B2 (ja) | 導電材料 | |
| JP2002226807A (ja) | 回路接続用接着剤及びそれを用いた回路接続方法、接続構造体 | |
| JP7496949B1 (ja) | 導電性接着剤層 | |
| JP6142612B2 (ja) | 異方性導電フィルム | |
| JP5365816B2 (ja) | 絶縁被覆導電粒子 | |
| KR102545861B1 (ko) | 도전 재료 | |
| JP2023121608A (ja) | 異方性導電フィルム、接続構造体および接続構造体の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171218 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20171218 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20181030 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181205 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20190220 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190312 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190405 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6510846 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |