HK1245316A1 - 各向異性導電膜、連接方法及接合體 - Google Patents

各向異性導電膜、連接方法及接合體

Info

Publication number
HK1245316A1
HK1245316A1 HK18104772.6A HK18104772A HK1245316A1 HK 1245316 A1 HK1245316 A1 HK 1245316A1 HK 18104772 A HK18104772 A HK 18104772A HK 1245316 A1 HK1245316 A1 HK 1245316A1
Authority
HK
Hong Kong
Prior art keywords
conductive film
connection method
bonded structure
anisotropically conductive
anisotropically
Prior art date
Application number
HK18104772.6A
Other languages
English (en)
Inventor
伊藤将大
工藤克哉
Original Assignee
迪睿合株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 迪睿合株式会社 filed Critical 迪睿合株式会社
Publication of HK1245316A1 publication Critical patent/HK1245316A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
HK18104772.6A 2015-03-24 2018-04-12 各向異性導電膜、連接方法及接合體 HK1245316A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015060755A JP6510846B2 (ja) 2015-03-24 2015-03-24 異方性導電フィルム、接続方法、及び接合体
PCT/JP2016/055866 WO2016152385A1 (ja) 2015-03-24 2016-02-26 異方性導電フィルム、接続方法、及び接合体

Publications (1)

Publication Number Publication Date
HK1245316A1 true HK1245316A1 (zh) 2018-08-24

Family

ID=56977973

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18104772.6A HK1245316A1 (zh) 2015-03-24 2018-04-12 各向異性導電膜、連接方法及接合體

Country Status (6)

Country Link
JP (1) JP6510846B2 (zh)
KR (1) KR102026547B1 (zh)
CN (1) CN107429125B (zh)
HK (1) HK1245316A1 (zh)
TW (1) TWI690945B (zh)
WO (1) WO2016152385A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117377229B (zh) * 2023-12-07 2024-02-20 深圳清大电子科技有限公司 一种用于导电膜贴合的热压工艺与设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323246A (ja) * 2000-03-07 2001-11-22 Sony Chem Corp 電極接続用接着剤及びこれを用いた接着方法
US6942824B1 (en) * 2002-05-22 2005-09-13 Western Digital (Fremont), Inc. UV curable and electrically conductive adhesive for bonding magnetic disk drive components
JP2006199778A (ja) * 2005-01-19 2006-08-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
JP4967482B2 (ja) * 2006-02-27 2012-07-04 日立化成工業株式会社 導電粒子、接着剤組成物及び回路接続材料
CN102167964B (zh) * 2006-07-21 2013-10-16 日立化成株式会社 电路连接材料、电路部件的连接结构及电路部件的连接方法
JP5226562B2 (ja) * 2008-03-27 2013-07-03 デクセリアルズ株式会社 異方性導電フィルム、並びに、接合体及びその製造方法
JP4897778B2 (ja) * 2008-11-20 2012-03-14 ソニーケミカル＆インフォメーションデバイス株式会社 接続フィルム、並びに、接合体及びその製造方法
KR101403846B1 (ko) * 2009-11-05 2014-06-03 히타치가세이가부시끼가이샤 열 중합계 개시제 시스템 및 접착제 조성물
JP5685473B2 (ja) * 2011-04-06 2015-03-18 デクセリアルズ株式会社 異方性導電フィルム、接合体の製造方法、及び接合体
JP5690637B2 (ja) * 2011-04-12 2015-03-25 デクセリアルズ株式会社 異方性導電フィルム、接続方法及び接続構造体
WO2013024544A1 (ja) * 2011-08-18 2013-02-21 日立化成工業株式会社 接着材リール
JP6231257B2 (ja) * 2011-12-15 2017-11-15 デクセリアルズ株式会社 導電性接着剤、及び電子部品の接続方法
JP6002518B2 (ja) * 2012-09-21 2016-10-05 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体

Also Published As

Publication number Publication date
TW201635312A (zh) 2016-10-01
CN107429125B (zh) 2020-09-29
KR102026547B1 (ko) 2019-09-27
JP6510846B2 (ja) 2019-05-08
WO2016152385A1 (ja) 2016-09-29
KR20170107530A (ko) 2017-09-25
TWI690945B (zh) 2020-04-11
JP2016180047A (ja) 2016-10-13
CN107429125A (zh) 2017-12-01

Similar Documents

Publication Publication Date Title
EP3109982A4 (en) Stator assembly method and stator assembly device
HK1246509A1 (zh) 各向異性導電性膜及連接構造體
EP3358819A4 (en) Photographing method, photographing device and terminal
EP3319293A4 (en) Cross-terminal login-free method and device
HK1250424A1 (zh) 各向異性導電膜和連接結構體
EP3193326A4 (en) Image-processing device, and image-processing method
SG11201705711QA (en) Anisotropic conductive film
EP2966607A4 (en) METHOD, TERMINAL AND RECHARGE SERVER
EP3176905A4 (en) Electrical storage system, and electrical storage method
EP3229467A4 (en) Imaging method, imaging device, and electronic device
EP3200521A4 (en) Location method, location server and terminal
EP3287228A4 (en) Assembly manufacturing device and assembly manufacturing method
EP3358647A4 (en) CONNECTION DEVICE BETWEEN BATTERIES AND DEVICE FOR CONNECTING BATTERIES
HK1198448A1 (zh) 各向異性導電膜、連接方法及接合體
HK1257192A1 (zh) 各向異性導電膜、其製造方法和連接結構體
EP3327532A4 (en) Host-position estimation device and host-position estimation method
HK1249665A1 (zh) 各向異性導電膜和連接結構體
HK1245509A1 (zh) 各向異性導電性膜及連接構造體
HK1245567A1 (zh) 各向異性導電連接結構體、各向異性導電連接方法和各向異性導電粘接劑
EP3395292A4 (en) METHOD FOR MEASURING THREE-DIMENSIONAL FORMS AND DEVICE FOR MEASURING THREE-DIMENSIONAL FORMS
EP3118978A4 (en) Stator manufacturing device and manufacturing method
EP3154252A4 (en) Photographing method, device and terminal
HK1252270A1 (zh) 各向異性導電膜和連接結構體
EP3318346A4 (en) MECHANICAL BONDING DEVICE AND MECHANICAL BONDING PROCESS
EP3104467A4 (en) Laminated connector