JP6510815B2 - ドープされた窒化ガリウム高電子移動度トランジスタ - Google Patents
ドープされた窒化ガリウム高電子移動度トランジスタ Download PDFInfo
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- 229910002601 GaN Inorganic materials 0.000 title claims description 28
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims description 28
- 230000004888 barrier function Effects 0.000 claims description 88
- 125000006850 spacer group Chemical group 0.000 claims description 37
- 229910052782 aluminium Inorganic materials 0.000 claims description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 28
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 22
- 229910052732 germanium Inorganic materials 0.000 claims description 21
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 description 19
- 239000002019 doping agent Substances 0.000 description 13
- 230000006911 nucleation Effects 0.000 description 12
- 238000010899 nucleation Methods 0.000 description 12
- 239000000203 mixture Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000003321 amplification Effects 0.000 description 3
- 239000002800 charge carrier Substances 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000002269 spontaneous effect Effects 0.000 description 3
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001803 electron scattering Methods 0.000 description 1
- 239000004047 hole gas Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005404 monopole Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- H01L29/66409—Unipolar field-effect transistors
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- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
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- H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
- H01L29/7785—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material with more than one donor layer
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Description
Claims (10)
- 第1窒化アルミニウムガリウム(AlGaN)サブ層および第1AlGaNスペーササブ層を備え、約15%の濃度のアルミニウムを含む第1AlGaNバリア層と、
前記第1AlGaNサブ層および前記第1AlGaNスペーササブ層の間の第1ドープ要素と、
前記第1AlGaNバリア層と結合して第1ヘテロ接合を形成する窒化ガリウム(GaN)チャネル層と、
前記GaNチャネル層と結合して第2ヘテロ接合を形成し、第2AlGaNサブ層および第2AlGaNスペーササブ層を備え、約4%の濃度のアルミニウムを含む第2AlGaNバリア層と、
前記第2AlGaNサブ層および前記第2AlGaNスペーササブ層の間の第2ドープ要素と、を備える装置。 - 前記第1および第2ドープ要素は、第1および第2ドープ層をそれぞれ含む、請求項1に記載の装置。
- 前記第1ドープ層は、約15%の濃度のアルミニウムと、約5×1019cm−3以上のドープ濃度のゲルマニウムとを含み、約10Åの厚さを有する、請求項2に記載の装置。
- 前記第2ドープ層は、約4%の濃度のアルミニウムと、約5×1019cm−3以上のドープ濃度のゲルマニウムとを含み、約10Åの厚さを有する、請求項2に記載の装置。
- 前記第1および第2ドープ要素は、第1および第2ドープパルスを含む、請求項1に記載の装置。
- 基板上に、第1窒化アルミニウムガリウム(AlGaN)サブ層および第1AlGaNスペーササブ層を備え、約15%の濃度のアルミニウムを含む第1AlGaNバリア層を形成するステップと、
前記第1AlGaNサブ層および前記第1AlGaNスペーササブ層の間に第1ドープ要素を形成するステップと、
前記第1AlGaNバリア層上に窒化ガリウム(GaN)チャネル層を形成するステップと、
前記GaNチャネル層上に、第2AlGaNサブ層および第2AlGaNスペーササブ層を備え、約4%の濃度のアルミニウムを含む第2AlGaNバリア層を形成するステップと、
前記第2AlGaNサブ層および前記第2AlGaNスペーササブ層の間に第2ドープ要素を形成するステップと、を備える方法。 - 前記第1ドープ要素を形成するステップは、約5×1019cm−3以上のドープ濃度を持つドープ層を形成するステップを含む、請求項6に記載の方法。
- 前記第1ドープ要素を形成するステップは、ドープパルスを形成するステップを含む、請求項6に記載の方法。
- RF信号を生成するトランシーバと、
前記トランシーバに結合され、前記トランシーバからのRF信号を増幅し、増幅されたRF信号をアンテナスイッチモジュールに供給するパワー増幅器モジュールと、を備え、 前記パワー増幅器モジュールは、高電子移動度トランジスタ(HEMT)を含み、前記HEMTは、
基板と、
前記基板上に設けられ、第1窒化アルミニウムガリウム(AlGaN)サブ層および第1AlGaNスペーササブ層を備え、約15%の濃度のアルミニウムを含む第1AlGaNバリア層と、
前記第1AlGaNサブ層および前記第1AlGaNスペーササブ層の間の第1ドープ要素と、
前記第1AlGaNバリア層上に設けられるチャネル層と、
前記チャネル層上に設けられ、第2AlGaNサブ層および第2AlGaNスペーササブ層を備え、約4%の濃度のアルミニウムを含む第2AlGaNバリア層と、
前記第2AlGaNサブ層および前記第2AlGaNスペーササブ層の間の第2ドープ要素と、を備えるシステム。 - 前記第1ドープ要素および前記第2ドープ要素は、いずれもゲルマニウムである、請求項9に記載のシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US14/157,245 US9640650B2 (en) | 2014-01-16 | 2014-01-16 | Doped gallium nitride high-electron mobility transistor |
US14/157,245 | 2014-01-16 |
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JP2015135965A JP2015135965A (ja) | 2015-07-27 |
JP2015135965A5 JP2015135965A5 (ja) | 2018-02-15 |
JP6510815B2 true JP6510815B2 (ja) | 2019-05-08 |
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US (1) | US9640650B2 (ja) |
JP (1) | JP6510815B2 (ja) |
DE (1) | DE102015000190A1 (ja) |
TW (1) | TWI651854B (ja) |
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US11233053B2 (en) | 2017-09-29 | 2022-01-25 | Intel Corporation | Group III-nitride (III-N) devices with reduced contact resistance and their methods of fabrication |
WO2019066935A1 (en) * | 2017-09-29 | 2019-04-04 | Intel Corporation | REDUCED CONTACT RESISTANCE GROUP III (N-N) NITRIDE DEVICES AND METHODS OF MAKING THE SAME |
US20190267480A1 (en) * | 2018-02-26 | 2019-08-29 | Duet Microelectronics Inc. | Anti-barrier-conduction (abc) spacers for high electron-mobility transistors (hemts) |
JP2021120966A (ja) * | 2018-04-27 | 2021-08-19 | ソニーセミコンダクタソリューションズ株式会社 | スイッチングトランジスタ及び半導体モジュール |
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CN115954378B (zh) * | 2023-03-15 | 2023-06-02 | 江西兆驰半导体有限公司 | 氮化镓功率器件及其制备方法 |
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US20130032860A1 (en) * | 2011-08-01 | 2013-02-07 | Fabio Alessio Marino | HFET with low access resistance |
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US9012939B2 (en) * | 2011-08-02 | 2015-04-21 | Kabushiki Kaisha Toshiba | N-type gallium-nitride layer having multiple conductive intervening layers |
JP2013207107A (ja) * | 2012-03-28 | 2013-10-07 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
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2014
- 2014-01-16 US US14/157,245 patent/US9640650B2/en active Active
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2015
- 2015-01-05 DE DE102015000190.6A patent/DE102015000190A1/de not_active Withdrawn
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TWI651854B (zh) | 2019-02-21 |
US20150200287A1 (en) | 2015-07-16 |
TW201532279A (zh) | 2015-08-16 |
US9640650B2 (en) | 2017-05-02 |
DE102015000190A1 (de) | 2015-07-16 |
JP2015135965A (ja) | 2015-07-27 |
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