JP6505534B2 - 現像液の管理方法及び装置 - Google Patents

現像液の管理方法及び装置 Download PDF

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JP6505534B2
JP6505534B2 JP2015144971A JP2015144971A JP6505534B2 JP 6505534 B2 JP6505534 B2 JP 6505534B2 JP 2015144971 A JP2015144971 A JP 2015144971A JP 2015144971 A JP2015144971 A JP 2015144971A JP 6505534 B2 JP6505534 B2 JP 6505534B2
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JP2017028091A (ja
JP2017028091A5 (enExample
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中川　俊元
俊元 中川
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株式会社平間理化研究所
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Priority to JP2015144971A priority Critical patent/JP6505534B2/ja
Priority to KR1020150181207A priority patent/KR20170011962A/ko
Priority to TW104143286A priority patent/TWI676086B/zh
Priority to TW108131471A priority patent/TWI695236B/zh
Priority to CN201510994042.6A priority patent/CN106371295A/zh
Publication of JP2017028091A publication Critical patent/JP2017028091A/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2015144971A 2015-07-22 2015-07-22 現像液の管理方法及び装置 Expired - Fee Related JP6505534B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015144971A JP6505534B2 (ja) 2015-07-22 2015-07-22 現像液の管理方法及び装置
KR1020150181207A KR20170011962A (ko) 2015-07-22 2015-12-17 현상액의 관리 방법 및 장치
TW104143286A TWI676086B (zh) 2015-07-22 2015-12-23 顯影液之管理方法及裝置
TW108131471A TWI695236B (zh) 2015-07-22 2015-12-23 顯影液之管理方法及裝置
CN201510994042.6A CN106371295A (zh) 2015-07-22 2015-12-25 显影液的管理方法及装置

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JP2015144971A JP6505534B2 (ja) 2015-07-22 2015-07-22 現像液の管理方法及び装置

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JP2019014496A Division JP6624762B2 (ja) 2019-01-30 2019-01-30 現像液の管理方法及び装置

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JP2017028091A JP2017028091A (ja) 2017-02-02
JP2017028091A5 JP2017028091A5 (enExample) 2018-03-29
JP6505534B2 true JP6505534B2 (ja) 2019-04-24

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JP2015144971A Expired - Fee Related JP6505534B2 (ja) 2015-07-22 2015-07-22 現像液の管理方法及び装置

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JP (1) JP6505534B2 (enExample)
KR (1) KR20170011962A (enExample)
CN (1) CN106371295A (enExample)
TW (2) TWI676086B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018120899A (ja) * 2017-01-23 2018-08-02 株式会社平間理化研究所 現像液管理装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018200943A (ja) * 2017-05-26 2018-12-20 株式会社平間理化研究所 現像液の濃度管理装置、及び、基板の現像処理システム
CN107300838A (zh) * 2017-08-08 2017-10-27 武汉华星光电技术有限公司 显影液稀释系统
WO2019036936A1 (zh) * 2017-08-23 2019-02-28 深圳市柔宇科技有限公司 显影液回收系统
CN108121174A (zh) * 2017-12-20 2018-06-05 武汉华星光电半导体显示技术有限公司 显影设备及其显影液供应系统
JP7137959B2 (ja) * 2018-04-20 2022-09-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US20250021007A1 (en) * 2023-07-14 2025-01-16 Yu Kang NIEH Photoresist developer solutions containing low foam dispersing compositions and quantification methods

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JP2561578B2 (ja) * 1991-08-07 1996-12-11 株式会社平間理化研究所 現像液管理装置
CN1327888A (zh) * 2000-06-09 2001-12-26 株式会社平间理化研究所 基板表面处理装置
TWI298423B (en) * 2001-02-06 2008-07-01 Nagase & Co Ltd Developer producing equipment and method
US6752545B2 (en) * 2001-08-16 2004-06-22 Nagase & Co., Ltd. Alkali-based treating liquid, treating liquid adjusting method and equipment, treating liquid supplying method and equipment
JP2003131398A (ja) * 2001-08-16 2003-05-09 Hirama Rika Kenkyusho:Kk アルカリ系加工液、加工液調整方法及び装置、並びに、加工液供給方法及び装置
JP3782374B2 (ja) * 2002-07-19 2006-06-07 株式会社平間理化研究所 レジスト剥離装置
US20040055621A1 (en) * 2002-09-24 2004-03-25 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids and ultrasonic energy
JP2004271974A (ja) * 2003-03-10 2004-09-30 Fuji Photo Film Co Ltd 感光性平版印刷版の現像液疲労度検出方法および現像液管理方法
JP4366490B2 (ja) * 2003-08-22 2009-11-18 長瀬産業株式会社 現像液供給方法及び装置
JP4323946B2 (ja) * 2003-12-19 2009-09-02 キヤノン株式会社 露光装置
EP1748469A4 (en) * 2004-05-21 2012-04-04 Jsr Corp LIQUID FOR IMMERSION EXPOSURE AND METHOD OF IMMERSION EXPOSURE
JP4649158B2 (ja) * 2004-09-30 2011-03-09 富士フイルム株式会社 ホログラム記録方法
JP2006285132A (ja) * 2005-04-05 2006-10-19 Konica Minolta Medical & Graphic Inc 感光性平版印刷版の処理方法
CN101563654A (zh) * 2006-11-30 2009-10-21 三菱化学工程株式会社 显影液的浓度调节方法、调制装置和显影液
US20080156356A1 (en) * 2006-12-05 2008-07-03 Nikon Corporation Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method
CN101641647A (zh) * 2007-01-17 2010-02-03 索尼株式会社 显影液以及制备微细加工材料的方法
WO2008088076A1 (ja) * 2007-01-17 2008-07-24 Sony Corporation 現像液、および微細加工体の製造方法
WO2010016110A1 (ja) * 2008-08-05 2010-02-11 富士通株式会社 重回帰分析による予測モデルの作成方法、作成システムおよび作成プログラム
JP2011128455A (ja) * 2009-12-18 2011-06-30 Nagase & Co Ltd 炭酸系塩類濃度測定装置、アルカリ現像液管理システム、及び、炭酸系塩類濃度測定方法
JP6721157B2 (ja) * 2015-07-22 2020-07-08 株式会社平間理化研究所 現像液の成分濃度測定方法及び装置、並びに、現像液管理方法及び装置
JP6713658B2 (ja) * 2015-07-22 2020-06-24 株式会社平間理化研究所 現像液の成分濃度測定装置、成分濃度測定方法、現像液管理装置、及び現像液管理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018120899A (ja) * 2017-01-23 2018-08-02 株式会社平間理化研究所 現像液管理装置

Also Published As

Publication number Publication date
TWI676086B (zh) 2019-11-01
TWI695236B (zh) 2020-06-01
JP2017028091A (ja) 2017-02-02
TW201704901A (zh) 2017-02-01
TW201944181A (zh) 2019-11-16
KR20170011962A (ko) 2017-02-02
CN106371295A (zh) 2017-02-01

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