TWI676086B - 顯影液之管理方法及裝置 - Google Patents
顯影液之管理方法及裝置 Download PDFInfo
- Publication number
- TWI676086B TWI676086B TW104143286A TW104143286A TWI676086B TW I676086 B TWI676086 B TW I676086B TW 104143286 A TW104143286 A TW 104143286A TW 104143286 A TW104143286 A TW 104143286A TW I676086 B TWI676086 B TW I676086B
- Authority
- TW
- Taiwan
- Prior art keywords
- concentration
- developer
- carbon dioxide
- conductivity
- developing solution
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 85
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims abstract description 336
- 239000001569 carbon dioxide Substances 0.000 claims abstract description 168
- 229910002092 carbon dioxide Inorganic materials 0.000 claims abstract description 168
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 139
- 238000007726 management method Methods 0.000 claims abstract description 105
- 238000010521 absorption reaction Methods 0.000 claims abstract description 64
- 239000007788 liquid Substances 0.000 claims description 53
- 238000004364 calculation method Methods 0.000 claims description 46
- 238000000491 multivariate analysis Methods 0.000 claims description 22
- 238000011161 development Methods 0.000 abstract description 53
- 238000013500 data storage Methods 0.000 abstract description 8
- 239000000243 solution Substances 0.000 description 201
- 238000005259 measurement Methods 0.000 description 64
- 238000002835 absorbance Methods 0.000 description 57
- 238000003860 storage Methods 0.000 description 38
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 38
- 230000008569 process Effects 0.000 description 34
- 239000011159 matrix material Substances 0.000 description 20
- 238000004448 titration Methods 0.000 description 20
- 230000000694 effects Effects 0.000 description 19
- 238000000611 regression analysis Methods 0.000 description 17
- 239000007864 aqueous solution Substances 0.000 description 15
- 238000002474 experimental method Methods 0.000 description 12
- 239000000523 sample Substances 0.000 description 11
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 239000012086 standard solution Substances 0.000 description 10
- 238000003756 stirring Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 9
- 238000005070 sampling Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- 239000002699 waste material Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000003153 chemical reaction reagent Substances 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 5
- 238000000691 measurement method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000003513 alkali Substances 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 238000012937 correction Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000011088 calibration curve Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000006386 neutralization reaction Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- LJRGBERXYNQPJI-UHFFFAOYSA-M sodium;3-nitrobenzenesulfonate Chemical compound [Na+].[O-][N+](=O)C1=CC=CC(S([O-])(=O)=O)=C1 LJRGBERXYNQPJI-UHFFFAOYSA-M 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000153 supplemental effect Effects 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- HXCHRJMJMALFHP-UHFFFAOYSA-N azanium;ethanol;hydroxide Chemical compound N.O.CCO HXCHRJMJMALFHP-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- -1 carbon dioxide forms carbonates Chemical class 0.000 description 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000002790 cross-validation Methods 0.000 description 1
- 238000001739 density measurement Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000003112 inhibitor Chemical class 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-144971 | 2015-07-22 | ||
| JP2015144971A JP6505534B2 (ja) | 2015-07-22 | 2015-07-22 | 現像液の管理方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201704901A TW201704901A (zh) | 2017-02-01 |
| TWI676086B true TWI676086B (zh) | 2019-11-01 |
Family
ID=57880865
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104143286A TWI676086B (zh) | 2015-07-22 | 2015-12-23 | 顯影液之管理方法及裝置 |
| TW108131471A TWI695236B (zh) | 2015-07-22 | 2015-12-23 | 顯影液之管理方法及裝置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108131471A TWI695236B (zh) | 2015-07-22 | 2015-12-23 | 顯影液之管理方法及裝置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6505534B2 (enExample) |
| KR (1) | KR20170011962A (enExample) |
| CN (1) | CN106371295A (enExample) |
| TW (2) | TWI676086B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6712415B2 (ja) * | 2017-01-23 | 2020-06-24 | 株式会社平間理化研究所 | 現像液管理装置 |
| JP2018200943A (ja) * | 2017-05-26 | 2018-12-20 | 株式会社平間理化研究所 | 現像液の濃度管理装置、及び、基板の現像処理システム |
| CN107300838A (zh) * | 2017-08-08 | 2017-10-27 | 武汉华星光电技术有限公司 | 显影液稀释系统 |
| WO2019036936A1 (zh) * | 2017-08-23 | 2019-02-28 | 深圳市柔宇科技有限公司 | 显影液回收系统 |
| CN108121174A (zh) * | 2017-12-20 | 2018-06-05 | 武汉华星光电半导体显示技术有限公司 | 显影设备及其显影液供应系统 |
| JP7137959B2 (ja) * | 2018-04-20 | 2022-09-15 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| US20250021007A1 (en) * | 2023-07-14 | 2025-01-16 | Yu Kang NIEH | Photoresist developer solutions containing low foam dispersing compositions and quantification methods |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0540345A (ja) * | 1991-08-07 | 1993-02-19 | Hirama Rika Kenkyusho:Kk | 現像液管理装置 |
| JP2003131398A (ja) * | 2001-08-16 | 2003-05-09 | Hirama Rika Kenkyusho:Kk | アルカリ系加工液、加工液調整方法及び装置、並びに、加工液供給方法及び装置 |
| JP2005070351A (ja) * | 2003-08-22 | 2005-03-17 | Nagase & Co Ltd | 現像液供給方法及び装置 |
| WO2008088076A1 (ja) * | 2007-01-17 | 2008-07-24 | Sony Corporation | 現像液、および微細加工体の製造方法 |
| JP2008283162A (ja) * | 2006-11-30 | 2008-11-20 | Mitsubishi Chemical Engineering Corp | 現像液の濃度調節方法および調製装置ならびに現像液 |
| JP2011128455A (ja) * | 2009-12-18 | 2011-06-30 | Nagase & Co Ltd | 炭酸系塩類濃度測定装置、アルカリ現像液管理システム、及び、炭酸系塩類濃度測定方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1327888A (zh) * | 2000-06-09 | 2001-12-26 | 株式会社平间理化研究所 | 基板表面处理装置 |
| TWI298423B (en) * | 2001-02-06 | 2008-07-01 | Nagase & Co Ltd | Developer producing equipment and method |
| US6752545B2 (en) * | 2001-08-16 | 2004-06-22 | Nagase & Co., Ltd. | Alkali-based treating liquid, treating liquid adjusting method and equipment, treating liquid supplying method and equipment |
| JP3782374B2 (ja) * | 2002-07-19 | 2006-06-07 | 株式会社平間理化研究所 | レジスト剥離装置 |
| US20040055621A1 (en) * | 2002-09-24 | 2004-03-25 | Air Products And Chemicals, Inc. | Processing of semiconductor components with dense processing fluids and ultrasonic energy |
| JP2004271974A (ja) * | 2003-03-10 | 2004-09-30 | Fuji Photo Film Co Ltd | 感光性平版印刷版の現像液疲労度検出方法および現像液管理方法 |
| JP4323946B2 (ja) * | 2003-12-19 | 2009-09-02 | キヤノン株式会社 | 露光装置 |
| EP1748469A4 (en) * | 2004-05-21 | 2012-04-04 | Jsr Corp | LIQUID FOR IMMERSION EXPOSURE AND METHOD OF IMMERSION EXPOSURE |
| JP4649158B2 (ja) * | 2004-09-30 | 2011-03-09 | 富士フイルム株式会社 | ホログラム記録方法 |
| JP2006285132A (ja) * | 2005-04-05 | 2006-10-19 | Konica Minolta Medical & Graphic Inc | 感光性平版印刷版の処理方法 |
| US20080156356A1 (en) * | 2006-12-05 | 2008-07-03 | Nikon Corporation | Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method |
| CN101641647A (zh) * | 2007-01-17 | 2010-02-03 | 索尼株式会社 | 显影液以及制备微细加工材料的方法 |
| WO2010016110A1 (ja) * | 2008-08-05 | 2010-02-11 | 富士通株式会社 | 重回帰分析による予測モデルの作成方法、作成システムおよび作成プログラム |
| JP6721157B2 (ja) * | 2015-07-22 | 2020-07-08 | 株式会社平間理化研究所 | 現像液の成分濃度測定方法及び装置、並びに、現像液管理方法及び装置 |
| JP6713658B2 (ja) * | 2015-07-22 | 2020-06-24 | 株式会社平間理化研究所 | 現像液の成分濃度測定装置、成分濃度測定方法、現像液管理装置、及び現像液管理方法 |
-
2015
- 2015-07-22 JP JP2015144971A patent/JP6505534B2/ja not_active Expired - Fee Related
- 2015-12-17 KR KR1020150181207A patent/KR20170011962A/ko not_active Ceased
- 2015-12-23 TW TW104143286A patent/TWI676086B/zh not_active IP Right Cessation
- 2015-12-23 TW TW108131471A patent/TWI695236B/zh not_active IP Right Cessation
- 2015-12-25 CN CN201510994042.6A patent/CN106371295A/zh active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0540345A (ja) * | 1991-08-07 | 1993-02-19 | Hirama Rika Kenkyusho:Kk | 現像液管理装置 |
| JP2003131398A (ja) * | 2001-08-16 | 2003-05-09 | Hirama Rika Kenkyusho:Kk | アルカリ系加工液、加工液調整方法及び装置、並びに、加工液供給方法及び装置 |
| JP2005070351A (ja) * | 2003-08-22 | 2005-03-17 | Nagase & Co Ltd | 現像液供給方法及び装置 |
| JP2008283162A (ja) * | 2006-11-30 | 2008-11-20 | Mitsubishi Chemical Engineering Corp | 現像液の濃度調節方法および調製装置ならびに現像液 |
| WO2008088076A1 (ja) * | 2007-01-17 | 2008-07-24 | Sony Corporation | 現像液、および微細加工体の製造方法 |
| JP2011128455A (ja) * | 2009-12-18 | 2011-06-30 | Nagase & Co Ltd | 炭酸系塩類濃度測定装置、アルカリ現像液管理システム、及び、炭酸系塩類濃度測定方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI695236B (zh) | 2020-06-01 |
| JP2017028091A (ja) | 2017-02-02 |
| TW201704901A (zh) | 2017-02-01 |
| TW201944181A (zh) | 2019-11-16 |
| KR20170011962A (ko) | 2017-02-02 |
| CN106371295A (zh) | 2017-02-01 |
| JP6505534B2 (ja) | 2019-04-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI676086B (zh) | 顯影液之管理方法及裝置 | |
| TWI700561B (zh) | 顯影液的成分濃度測定方法及裝置、與顯影液管理方法及裝置 | |
| KR101248213B1 (ko) | 에칭액 관리장치 | |
| JP5405042B2 (ja) | エッチング液調合装置及びエッチング液濃度測定装置 | |
| JP6713658B2 (ja) | 現像液の成分濃度測定装置、成分濃度測定方法、現像液管理装置、及び現像液管理方法 | |
| JP6624762B2 (ja) | 現像液の管理方法及び装置 | |
| JP6712415B2 (ja) | 現像液管理装置 | |
| JP5522860B2 (ja) | エッチング液管理装置 | |
| TW201827950A (zh) | 顯影裝置 | |
| TW201827948A (zh) | 顯影液管理裝置 | |
| TW201604324A (zh) | 蝕刻液管理裝置、蝕刻液管理方法、及蝕刻液之成分濃度測定方法 | |
| TW201828333A (zh) | 顯影液的成分濃度測定裝置、及顯影液管理裝置 | |
| TW201841218A (zh) | 顯影裝置 | |
| KR20180087119A (ko) | 현상액의 농도 감시 장치, 및 현상액 관리 장치 | |
| CN108345185A (zh) | 显影液的浓度监视装置及显影液管理装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |