JP6505373B2 - フレキシブル電子デバイスの製造方法 - Google Patents
フレキシブル電子デバイスの製造方法 Download PDFInfo
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- JP6505373B2 JP6505373B2 JP2014074294A JP2014074294A JP6505373B2 JP 6505373 B2 JP6505373 B2 JP 6505373B2 JP 2014074294 A JP2014074294 A JP 2014074294A JP 2014074294 A JP2014074294 A JP 2014074294A JP 6505373 B2 JP6505373 B2 JP 6505373B2
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- electronic device
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- conductive substrate
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- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
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- WOSVXXBNNCUXMT-UHFFFAOYSA-N cyclopentane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)C1C(O)=O WOSVXXBNNCUXMT-UHFFFAOYSA-N 0.000 description 1
- BEDDLDBPAODZQH-UHFFFAOYSA-N dibenzo-p-dioxin-2,7-diamine Chemical compound NC1=CC=C2OC3=CC(N)=CC=C3OC2=C1 BEDDLDBPAODZQH-UHFFFAOYSA-N 0.000 description 1
- QQSBWCNELOEITJ-UHFFFAOYSA-N dibenzofuran-3,7-diamine Chemical compound NC1=CC=C2C3=CC=C(N)C=C3OC2=C1 QQSBWCNELOEITJ-UHFFFAOYSA-N 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
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- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
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- 229940018564 m-phenylenediamine Drugs 0.000 description 1
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- 239000007769 metal material Substances 0.000 description 1
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- 150000004706 metal oxides Chemical class 0.000 description 1
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- KADGVXXDDWDKBX-UHFFFAOYSA-N naphthalene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C21 KADGVXXDDWDKBX-UHFFFAOYSA-N 0.000 description 1
- BBYQSYQIKWRMOE-UHFFFAOYSA-N naphthalene-1,2,6,7-tetracarboxylic acid Chemical compound C1=C(C(O)=O)C(C(O)=O)=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 BBYQSYQIKWRMOE-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- GOGZBMRXLADNEV-UHFFFAOYSA-N naphthalene-2,6-diamine Chemical compound C1=C(N)C=CC2=CC(N)=CC=C21 GOGZBMRXLADNEV-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- AVRVTTKGSFYCDX-UHFFFAOYSA-N perylene-1,2,7,8-tetracarboxylic acid Chemical compound C1=CC(C2=C(C(C(=O)O)=CC=3C2=C2C=CC=3)C(O)=O)=C3C2=C(C(O)=O)C(C(O)=O)=CC3=C1 AVRVTTKGSFYCDX-UHFFFAOYSA-N 0.000 description 1
- FVDOBFPYBSDRKH-UHFFFAOYSA-N perylene-3,4,9,10-tetracarboxylic acid Chemical compound C=12C3=CC=C(C(O)=O)C2=C(C(O)=O)C=CC=1C1=CC=C(C(O)=O)C2=C1C3=CC=C2C(=O)O FVDOBFPYBSDRKH-UHFFFAOYSA-N 0.000 description 1
- CYPCCLLEICQOCV-UHFFFAOYSA-N phenanthrene-1,2,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C3=CC=C(C(=O)O)C(C(O)=O)=C3C=CC2=C1 CYPCCLLEICQOCV-UHFFFAOYSA-N 0.000 description 1
- UMSVUULWTOXCQY-UHFFFAOYSA-N phenanthrene-1,2,7,8-tetracarboxylic acid Chemical compound OC(=O)C1=CC=C2C3=CC=C(C(=O)O)C(C(O)=O)=C3C=CC2=C1C(O)=O UMSVUULWTOXCQY-UHFFFAOYSA-N 0.000 description 1
- RVRYJZTZEUPARA-UHFFFAOYSA-N phenanthrene-1,2,9,10-tetracarboxylic acid Chemical compound C1=CC=C2C(C(O)=O)=C(C(O)=O)C3=C(C(O)=O)C(C(=O)O)=CC=C3C2=C1 RVRYJZTZEUPARA-UHFFFAOYSA-N 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
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- MIROPXUFDXCYLG-UHFFFAOYSA-N pyridine-2,5-diamine Chemical compound NC1=CC=C(N)N=C1 MIROPXUFDXCYLG-UHFFFAOYSA-N 0.000 description 1
- YKWDNEXDHDSTCU-UHFFFAOYSA-N pyrrolidine-2,3,4,5-tetracarboxylic acid Chemical compound OC(=O)C1NC(C(O)=O)C(C(O)=O)C1C(O)=O YKWDNEXDHDSTCU-UHFFFAOYSA-N 0.000 description 1
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- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
Description
m−TB:2,2’−ジメチル−4,4’−ジアミノビフェニル
4,4'‐DAPE:4,4‘‐ジアミノジフェニルエーテル
TPE‐R:1,3−ビス(4−アミノフェノキシ)ベンゼン
BAPP:2,2-ビス(4-アミノフェノキシフェニル)プロパン
PMDA:ピロメリット酸二無水物
BPDA:3,3’4,4’−ビフェニルテトラカルボン酸
ODPA:4,4’−オキシジフタル酸ニ無水物
DMAc:N,N−ジメチルアセトアミド
ポリアミック酸溶液の粘度は、恒温水槽付のコーンプレート式粘度計(トキメック社製)にて、25℃で測定した。
ポリイミド樹脂フィルムを30mm×30mmのサイズに切り出し、周期加熱法による厚み方向の熱拡散率(アルバック理工製FTC‐1装置)、DSCによる比熱、水中置換法による密度をそれぞれ測定し、これらの結果をもとに熱伝導率(W/m・K)を算出した。
ポリイミド樹脂フィルムを30mm×30mmのサイズに切り出し、光交流法による面方向の熱拡散率(アルバック理工製Laser PIT装置)、DSCによる比熱、水中置換法による密度をそれぞれ測定し、これらの結果をもとに熱伝導率(W/m・K)を算出した。
3mm×15mmのサイズのポリイミド樹脂フィルムを、熱機械分析(TMA)装置にて5gの荷重を加えながら一定の昇温速度(20℃/min)で30℃から260℃の温度範囲で引張り試験を行い、温度に対するポリイミドフィルムの伸び量から熱膨張係数(ppm/K)を測定した。
ポリイミド樹脂フィルム(10mm×22.6mm)を動的熱器械分析装置(正式名;動的粘弾性測定装置(DMA))にて20℃から500℃まで5℃/分で昇温させたときの動的粘弾性を測定し、ガラス転移温度(tanδ極大値:℃)を求めた。
積層体の銅箔層を幅1.0mm、長さ180mmの長矩形にパターンエッチングし、そのパターンが中央になるように、幅20mm、長さ200mmに試験片を切り抜き、IPC−TM−650.2.4.19により180°引剥し試験を行った。
ポリアミド酸溶液Aを合成するため、窒素気流下で、m−TB(32g、0.90mol)及びTPE−R(4.8g、0.10mol)を1000mlのセパラブルフラスコの中で攪拌しながら溶剤DMAc425g中に溶解させた。次いで、BPDA(9.7g、0.197mol)、PMDA(28.5g、0.788mol)を加えた。その後、溶液を室温で3時間攪拌を続けて重合反応を行い、茶褐色の粘稠なポリアミド酸溶液Aを得た。以下、表2に示した組成に基づき、上記と同様の方法で、ポリアミド酸溶液B〜Dを合成した。ポリアミド酸溶液A〜Dはポリアミド酸と溶媒DMAcからなり、ポリアミド酸溶液について粘度と熱膨張係数、ガラス転移温度をそれぞれ測定した。
次に、固形分濃度15wt%のポリアミド酸溶液Aを43.5重量部と、酸化アルミニウム[球状、平均粒径3μm]を3.25重量部と、窒化ホウ素[板状、平均粒径4.5μm]を3.25重量部とを均一になるまで遠心攪拌機で混合し、熱伝導性フィラーを含有するポリアミド酸とフィラーの混合溶液(サンプルE)を得た。
合成例3で得たポリアミド酸樹脂溶液Cを硬化後の厚みが約2μmとなるようにガラス基板に塗布し、120℃で加熱乾燥し溶剤を除去した。次に、その上に合成例5で得たポリアミド酸樹脂Eの溶液を硬化後の厚みが約21μmとなるように塗布し、120℃で加熱乾燥し溶剤を除去した。さらに、その上に合成例3で得たポリアミド酸樹脂溶液Cを硬化後の厚みが約2μmとなるように塗布し、120℃で加熱乾燥し溶剤を除去した。その後、120〜360℃の温度範囲で、段階的に30分かけて昇温加熱して、ガラス上に3層のポリイミド樹脂層(C/E/C)からなる熱伝導性基板用積層体を作製した。ポリイミド樹脂層の特性を評価するために、ガラス基板からポリイミド樹脂層を剥離して、ポリイミド樹脂フィルム(M1)を作製した。このポリイミド樹脂フィルムのCTE、熱伝導率を評価した。以下同様にしてガラス基板上で3層、2層、単層のポリイミド樹脂フィルムM2〜M14、M16〜M21を作成した後、CTE、熱伝導率を評価した。結果を表5に示す。
はポリアミド酸溶液DとAlN(71wt%)からなる樹脂組成物(Q)を20μm銅箔の上に塗布し、イミド化して厚さ5μmの積層体フィルム(M22)を得た。得られた積層体フィルムの銅箔とのピール強度を表6に示す。この積層体フィルムに既知の方法を用いて、ガスバリアとしてのSiN層(150μm)及びSiO層(100μm)を順次形成したのちTFTとなるアモルファスシリコン層50μmを形成し、TFTが形成された積層体フィルムを得たのち、銅箔からTFTが形成された熱伝導性基板を剥離してフレキシブル電子デバイスを得た。TFT形成後もピール強度に大きな変化はなかった。同様に、ポリアミド酸溶液DとAlN(51wt%)からなる樹脂組成物を銅箔の上に塗布しイミド化した積層体フィルム(M23)を作成し、TFTを形成したところ同様なフレキシブル電子デバイスが得られた
熱伝導性フィラーを含有しないポリイミド樹脂層と銅箔との積層体フィルム(M24、M25)表2の層構成にて作成した。180度ピール強度を測定したのち、実施例1、2と同様にTFTを形成したが、銅箔から物理的に剥離は可能であったが、TFTに割れが発生した。
Claims (6)
- 樹脂と熱伝導性フィラー30〜80wt%からなる熱伝導性樹脂材料を支持体に塗布して熱伝導性基板と支持体からなる積層体を製造する工程、熱伝導性基板上にデバイス層を形成する工程、及び支持体と熱伝導性基板を剥離する工程を有するフレキシブル電子デバイスの製造方法。
- 熱伝導性基板の平面方向の熱伝導率λxyが0.7W/mK以上であり、厚み方向の熱伝導率λzが0.3W/mK以上であることを特徴とする、請求項1に記載のフレキシブル電子デバイスの製造方法。
- 支持体と熱伝導性基板の熱膨張係数差が15ppm/K以下であり、熱伝導性基板とデバイス層の熱膨張係数差が15ppm/K以下である請求項1〜3のいずれかに記載のフレキシブル電子デバイスの製造方法。
- 熱伝導性基板が2層以上のポリイミド樹脂からなる多層構造であり、少なくとも1層が熱伝導性フィラーを含有する熱伝導層であると共に、デバイス層と接する側の層は、表面が平滑な平滑層であることを特徴とする請求項1〜4のいずれかに記載のフレキシブル電子デバイスの製造方法。
- フレキシブル電子デバイスが表示デバイス、又は発光デバイスである請求項1〜5のいずれかに記載の熱伝導性フレキシブル電子デバイスの製造方法。
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JP2015125807A (ja) * | 2013-12-25 | 2015-07-06 | 新日鉄住金化学株式会社 | 熱伝導性有機発光素子基板 |
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