JP6500103B2 - 基板保持装置及び成膜装置 - Google Patents

基板保持装置及び成膜装置 Download PDF

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Publication number
JP6500103B2
JP6500103B2 JP2017523645A JP2017523645A JP6500103B2 JP 6500103 B2 JP6500103 B2 JP 6500103B2 JP 2017523645 A JP2017523645 A JP 2017523645A JP 2017523645 A JP2017523645 A JP 2017523645A JP 6500103 B2 JP6500103 B2 JP 6500103B2
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Prior art keywords
plate
substrate
holding
intermediate plate
pressing
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JP2017523645A
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English (en)
Japanese (ja)
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JPWO2016199759A1 (ja
Inventor
あゆみ 織部
あゆみ 織部
宗源 萩原
宗源 萩原
博文 梅村
博文 梅村
憲昭 糟谷
憲昭 糟谷
潤一郎 小池
潤一郎 小池
和彦 小泉
和彦 小泉
英二 藤野
英二 藤野
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Ulvac Inc
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Ulvac Inc
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75733—Magnetic holding means

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2017523645A 2015-06-12 2016-06-07 基板保持装置及び成膜装置 Active JP6500103B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015119062 2015-06-12
JP2015119062 2015-06-12
PCT/JP2016/066899 WO2016199759A1 (ja) 2015-06-12 2016-06-07 基板保持装置、成膜装置及び基板保持方法

Publications (2)

Publication Number Publication Date
JPWO2016199759A1 JPWO2016199759A1 (ja) 2018-01-25
JP6500103B2 true JP6500103B2 (ja) 2019-04-10

Family

ID=57504783

Family Applications (1)

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JP2017523645A Active JP6500103B2 (ja) 2015-06-12 2016-06-07 基板保持装置及び成膜装置

Country Status (6)

Country Link
JP (1) JP6500103B2 (ko)
KR (1) KR102091560B1 (ko)
CN (1) CN107710397B (ko)
SG (1) SG11201710300SA (ko)
TW (1) TWI632639B (ko)
WO (1) WO2016199759A1 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106978591B (zh) * 2017-05-16 2019-07-02 昆山国显光电有限公司 蒸镀组件及蒸镀设备
KR102107973B1 (ko) * 2017-07-24 2020-05-07 어플라이드 머티어리얼스, 인코포레이티드 진공 챔버 내의 기판을 프로세싱하기 위한 장치 및 시스템, 및 마스크 캐리어에 대해 기판 캐리어를 정렬하는 방법
KR102010158B1 (ko) * 2017-12-26 2019-08-12 캐논 톡키 가부시키가이샤 성막장치, 성막방법 및 이를 사용한 유기 el 표시 장치의 제조방법
CN110819937A (zh) * 2018-08-14 2020-02-21 上海和辉光电有限公司 掩膜板移动治具
CN111188012A (zh) * 2018-11-14 2020-05-22 广东聚华印刷显示技术有限公司 蒸镀装置及蒸镀膜的制备方法、电致发光器件及制备方法
JP7269000B2 (ja) * 2018-12-26 2023-05-08 キヤノントッキ株式会社 基板載置方法、成膜方法、成膜装置、および有機ｅｌパネルの製造システム
CN109928210A (zh) * 2019-04-04 2019-06-25 东莞市敏顺自动化科技有限公司 多工件自动上下料机构
KR20210011790A (ko) * 2019-07-23 2021-02-02 캐논 톡키 가부시키가이샤 얼라인먼트 기구, 얼라인먼트 방법, 성막 장치 및 성막 방법
JP7057335B2 (ja) * 2019-10-29 2022-04-19 キヤノントッキ株式会社 基板保持装置、基板処理装置、基板保持方法、成膜方法、及び電子デバイスの製造方法
JP7159238B2 (ja) * 2020-03-13 2022-10-24 キヤノントッキ株式会社 基板キャリア、成膜装置、及び成膜方法
KR102591418B1 (ko) * 2020-09-04 2023-10-19 캐논 톡키 가부시키가이샤 캐리어, 성막 장치, 성막 방법 및 전자 디바이스의 제조 방법
CN112853273B (zh) * 2020-12-31 2022-12-16 南京深光科技有限公司 一种柔性amoled掩模版表面镀膜设备
JP2021073373A (ja) * 2021-01-05 2021-05-13 キヤノントッキ株式会社 基板載置方法、電子デバイスの製造方法、基板保持装置、及び電子デバイスの製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332609A (ja) * 2000-03-13 2001-11-30 Nikon Corp 基板保持装置及び露光装置
KR100838065B1 (ko) * 2002-05-31 2008-06-16 삼성에스디아이 주식회사 박막증착기용 고정장치와 이를 이용한 고정방법
JP2004311656A (ja) * 2003-04-04 2004-11-04 Nikon Corp 保持方法、保持装置及び露光装置
JP2007123316A (ja) * 2005-10-25 2007-05-17 Nikon Corp ステージ装置及び露光装置並びにデバイス製造方法
JP2007119895A (ja) * 2005-10-31 2007-05-17 Toshiba Matsushita Display Technology Co Ltd 蒸着装置
JP2008060299A (ja) * 2006-08-31 2008-03-13 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
WO2008139876A1 (ja) * 2007-05-10 2008-11-20 Ulvac, Inc. 位置合わせ装置、成膜装置
JP5297046B2 (ja) * 2008-01-16 2013-09-25 キヤノントッキ株式会社 成膜装置
JP2010118157A (ja) 2008-11-11 2010-05-27 Ulvac Japan Ltd フロントパネル製造方法
CN103201201B (zh) * 2011-02-28 2015-06-03 信越工程株式会社 薄板状工件的粘附保持方法和薄板状工件的粘附保持装置以及制造系统
JP2013247040A (ja) 2012-05-29 2013-12-09 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置及び有機ｅｌデバイス製造方法
JP2015074826A (ja) * 2013-10-11 2015-04-20 株式会社ブイ・テクノロジー 成膜マスク及びその製造方法
JP2015088526A (ja) * 2013-10-28 2015-05-07 株式会社堀甲製作所 金属製収納箱の樹脂製カバー

Also Published As

Publication number Publication date
CN107710397A (zh) 2018-02-16
SG11201710300SA (en) 2018-01-30
TWI632639B (zh) 2018-08-11
WO2016199759A1 (ja) 2016-12-15
TW201707128A (zh) 2017-02-16
KR20170122830A (ko) 2017-11-06
CN107710397B (zh) 2021-02-19
JPWO2016199759A1 (ja) 2018-01-25
KR102091560B1 (ko) 2020-03-20

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