JP6488640B2 - 電子デバイス、電子機器および移動体 - Google Patents

電子デバイス、電子機器および移動体 Download PDF

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Publication number
JP6488640B2
JP6488640B2 JP2014219775A JP2014219775A JP6488640B2 JP 6488640 B2 JP6488640 B2 JP 6488640B2 JP 2014219775 A JP2014219775 A JP 2014219775A JP 2014219775 A JP2014219775 A JP 2014219775A JP 6488640 B2 JP6488640 B2 JP 6488640B2
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JP
Japan
Prior art keywords
wiring
detection
vibration
electronic device
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014219775A
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English (en)
Japanese (ja)
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JP2016085182A5 (enrdf_load_stackoverflow
JP2016085182A (ja
Inventor
竜太 西澤
竜太 西澤
崇 野宮
崇 野宮
啓一 山口
啓一 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2014219775A priority Critical patent/JP6488640B2/ja
Priority to US14/886,591 priority patent/US9568313B2/en
Publication of JP2016085182A publication Critical patent/JP2016085182A/ja
Priority to US15/388,001 priority patent/US10302430B2/en
Publication of JP2016085182A5 publication Critical patent/JP2016085182A5/ja
Application granted granted Critical
Publication of JP6488640B2 publication Critical patent/JP6488640B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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JP2014219775A 2014-10-28 2014-10-28 電子デバイス、電子機器および移動体 Active JP6488640B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014219775A JP6488640B2 (ja) 2014-10-28 2014-10-28 電子デバイス、電子機器および移動体
US14/886,591 US9568313B2 (en) 2014-10-28 2015-10-19 Electronic device, electronic apparatus, and moving object
US15/388,001 US10302430B2 (en) 2014-10-28 2016-12-22 Electronic device, electronic apparatus, and moving object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014219775A JP6488640B2 (ja) 2014-10-28 2014-10-28 電子デバイス、電子機器および移動体

Publications (3)

Publication Number Publication Date
JP2016085182A JP2016085182A (ja) 2016-05-19
JP2016085182A5 JP2016085182A5 (enrdf_load_stackoverflow) 2017-12-14
JP6488640B2 true JP6488640B2 (ja) 2019-03-27

Family

ID=55972915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014219775A Active JP6488640B2 (ja) 2014-10-28 2014-10-28 電子デバイス、電子機器および移動体

Country Status (1)

Country Link
JP (1) JP6488640B2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6957921B2 (ja) * 2017-03-23 2021-11-02 セイコーエプソン株式会社 振動デバイス、角速度センサー、電子機器および移動体
JP7251383B2 (ja) * 2019-07-29 2023-04-04 セイコーエプソン株式会社 振動デバイス、電子機器および移動体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4386073B2 (ja) * 2004-04-07 2009-12-16 株式会社村田製作所 角速度計測装置
FI119729B (fi) * 2005-11-23 2009-02-27 Vti Technologies Oy Menetelmä mikroelektromekaanisen komponentin valmistamiseksi ja mikroelektromekaaninen komponentti
JP2012198099A (ja) * 2011-03-22 2012-10-18 Seiko Epson Corp 慣性センサー
JP6007541B2 (ja) * 2012-03-28 2016-10-12 セイコーエプソン株式会社 振動片およびその製造方法並びにジャイロセンサーおよび電子機器および移動体

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Publication number Publication date
JP2016085182A (ja) 2016-05-19

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