JP6481154B2 - 粉粒体の塗布方法 - Google Patents

粉粒体の塗布方法 Download PDF

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Publication number
JP6481154B2
JP6481154B2 JP2014213252A JP2014213252A JP6481154B2 JP 6481154 B2 JP6481154 B2 JP 6481154B2 JP 2014213252 A JP2014213252 A JP 2014213252A JP 2014213252 A JP2014213252 A JP 2014213252A JP 6481154 B2 JP6481154 B2 JP 6481154B2
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granular material
applying
coated
substrate
led
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Japanese (ja)
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JP2016077982A5 (cg-RX-API-DMAC7.html
JP2016077982A (ja
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松永　正文
正文 松永
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Mtek Smart Corp
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Mtek Smart Corp
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Priority to JP2014213252A priority Critical patent/JP6481154B2/ja
Application filed by Mtek Smart Corp filed Critical Mtek Smart Corp
Priority to US15/319,870 priority patent/US10625297B2/en
Priority to CN202010442591.3A priority patent/CN111599979B/zh
Priority to CN201480080045.2A priority patent/CN106660065B/zh
Priority to PCT/JP2014/081877 priority patent/WO2016059732A1/ja
Priority to KR1020167034978A priority patent/KR102346145B1/ko
Publication of JP2016077982A publication Critical patent/JP2016077982A/ja
Publication of JP2016077982A5 publication Critical patent/JP2016077982A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B05D1/12—Applying particulate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/02—Coating starting from inorganic powder by application of pressure only
    • C23C24/04—Impact or kinetic deposition of particles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/034—Manufacture or treatment of coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
JP2014213252A 2014-10-18 2014-10-18 粉粒体の塗布方法 Active JP6481154B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2014213252A JP6481154B2 (ja) 2014-10-18 2014-10-18 粉粒体の塗布方法
CN202010442591.3A CN111599979B (zh) 2014-10-18 2014-12-02 二次电池的电极形成方法
CN201480080045.2A CN106660065B (zh) 2014-10-18 2014-12-02 粉粒体的涂布方法
PCT/JP2014/081877 WO2016059732A1 (ja) 2014-10-18 2014-12-02 粉粒体の塗布方法
US15/319,870 US10625297B2 (en) 2014-10-18 2014-12-02 Method of applying powder or granular material
KR1020167034978A KR102346145B1 (ko) 2014-10-18 2014-12-02 분립체의 도포방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014213252A JP6481154B2 (ja) 2014-10-18 2014-10-18 粉粒体の塗布方法

Publications (3)

Publication Number Publication Date
JP2016077982A JP2016077982A (ja) 2016-05-16
JP2016077982A5 JP2016077982A5 (cg-RX-API-DMAC7.html) 2017-11-09
JP6481154B2 true JP6481154B2 (ja) 2019-03-13

Family

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JP2014213252A Active JP6481154B2 (ja) 2014-10-18 2014-10-18 粉粒体の塗布方法

Country Status (5)

Country Link
US (1) US10625297B2 (cg-RX-API-DMAC7.html)
JP (1) JP6481154B2 (cg-RX-API-DMAC7.html)
KR (1) KR102346145B1 (cg-RX-API-DMAC7.html)
CN (2) CN111599979B (cg-RX-API-DMAC7.html)
WO (1) WO2016059732A1 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11426760B2 (en) 2017-02-03 2022-08-30 Hitachi Zosen Corporation Powder film forming method and powder film forming device
JP2020129495A (ja) * 2019-02-08 2020-08-27 エムテックスマート株式会社 全固体電池の製造方法
JP2021087905A (ja) * 2019-12-02 2021-06-10 エムテックスマート株式会社 粉粒体の塗布または成膜方法
CN111668455A (zh) * 2020-05-22 2020-09-15 宜春清陶能源科技有限公司 降低电池极片表面涂覆浆料过程中气泡量的方法及其在固态电解质涂布的应用
JP2022007837A (ja) * 2020-06-27 2022-01-13 正文 松永 粒子の製造方法、粒子またはスラリーの塗布方法、２次電池または２次電池の製造方法、全固体電池または全固体電池の製造方法、ｌｅｄまたはｌｅｄの製造方法、蛍光体シートまたは蛍光体シートの製造方法
JP2024054597A (ja) * 2022-10-05 2024-04-17 エムテックスマート株式会社 粉体の塗布方法、二次電池の製造方法、全固体電池の製造方法、二次電池、全固体電池

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8627308D0 (en) * 1986-11-14 1986-12-17 Alcan Int Ltd Composite metal deposit
US4940185A (en) * 1988-12-09 1990-07-10 Fu Hsueh Chin Safety exhaust valve equipped spray gun
JP3106588B2 (ja) 1991-09-24 2000-11-06 松下電器産業株式会社 濾過器
JPH07172575A (ja) * 1993-12-17 1995-07-11 Nordson Kk 粉粒体の供給搬送方法
JPH09184080A (ja) * 1995-12-27 1997-07-15 Vacuum Metallurgical Co Ltd 超微粒子による薄膜形成方法、およびその薄膜形成装置
US6375094B1 (en) * 1997-08-29 2002-04-23 Nordson Corporation Spray gun handle and trigger mechanism
US6402500B1 (en) * 1997-11-06 2002-06-11 Matsys Fluidized fillshoe system
EP1021583A4 (en) * 1998-06-10 2003-04-02 Us Nanocorp THERMALLY SPRAYED ELECTRODES
JP2000301052A (ja) * 1999-04-16 2000-10-31 Anest Iwata Corp 粉体塗料の定量供給方法
JP4605413B2 (ja) * 1999-12-15 2011-01-05 ノードソン株式会社 粉体塗装における粉体の微量搬送方法
US6576488B2 (en) * 2001-06-11 2003-06-10 Lumileds Lighting U.S., Llc Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor
US6875278B2 (en) * 2001-09-07 2005-04-05 Material Sciences Corporation Modular powder application system
WO2003034508A1 (fr) * 2001-10-12 2003-04-24 Nichia Corporation Dispositif d'emission de lumiere et procede de fabrication de celui-ci
JP3863029B2 (ja) * 2002-02-07 2006-12-27 大成化工株式会社 肩部を有する容器内面への粉体塗装装置並びに粉体塗装方法
DE10224780A1 (de) * 2002-06-04 2003-12-18 Linde Ag Verfahren und Vorrichtung zum Kaltgasspritzen
TWI331345B (en) * 2003-09-12 2010-10-01 Nat Inst Of Advanced Ind Scien A dispersion of nano-size metal particles and a process for forming a layer of an electric conductor with use thereof
EP1769557A4 (en) * 2004-06-10 2010-11-03 California Inst Of Techn PROCESSING TECHNIQUES FOR THE MANUFACTURE OF FATTY ACID FUEL CELL MEMBRANE ELECTRODE ASSEMBLIES
JP2006313829A (ja) * 2005-05-09 2006-11-16 Konica Minolta Opto Inc 白色発光ダイオード及びその製造方法
JP2007050371A (ja) * 2005-08-19 2007-03-01 Matsushita Electric Ind Co Ltd 標準粒子塗布装置及び標準粒子塗布方法
US20080020923A1 (en) * 2005-09-13 2008-01-24 Debe Mark K Multilayered nanostructured films
JP2009028709A (ja) * 2007-06-29 2009-02-12 Brother Ind Ltd エアロゾル生成装置およびエアロゾル生成方法
JP4687695B2 (ja) * 2007-07-23 2011-05-25 トヨタ自動車株式会社 膜電極接合体製造方法
JP2009101285A (ja) 2007-10-23 2009-05-14 Nidec-Kyori Corp 液体塗布装置
US9099738B2 (en) * 2008-11-03 2015-08-04 Basvah Llc Lithium secondary batteries with positive electrode compositions and their methods of manufacturing
EP2218514B1 (de) * 2009-02-09 2017-04-26 J. Wagner AG Beschichtungspulver-Versorgungs-vorrichtung
US9676955B2 (en) * 2011-08-31 2017-06-13 Sumitomo Chemical Company, Limited Coating liquid, laminated porous film, and method for producing laminated porous film
CN103084315A (zh) * 2011-10-30 2013-05-08 湖南晟通科技集团有限公司 一种阳极钢爪的石墨糊喷涂物及其喷涂方法
JP5488761B2 (ja) * 2011-12-13 2014-05-14 東レ株式会社 積層体および波長変換層付き発光ダイオードの製造方法
WO2013096220A1 (en) * 2011-12-20 2013-06-27 Applied Materials, Inc. Apparatus and method for hot coating electrodes of lithium-ion batteries
JP5840959B2 (ja) 2012-01-16 2016-01-06 エムテックスマート株式会社 塗布方法及び装置
US20160074903A1 (en) 2013-04-20 2016-03-17 Mtek-Smart Corporation Applying or dispensing method for powder or granular material
CN103817052B (zh) * 2014-02-21 2016-06-22 华南理工大学 全自动led荧光粉涂覆设备及其控制方法

Also Published As

Publication number Publication date
CN106660065B (zh) 2020-09-22
WO2016059732A1 (ja) 2016-04-21
KR20170072833A (ko) 2017-06-27
US10625297B2 (en) 2020-04-21
CN106660065A (zh) 2017-05-10
JP2016077982A (ja) 2016-05-16
CN111599979A (zh) 2020-08-28
KR102346145B1 (ko) 2021-12-30
US20170136492A1 (en) 2017-05-18
CN111599979B (zh) 2022-11-18

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