JP2016077982A5 - - Google Patents

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Publication number
JP2016077982A5
JP2016077982A5 JP2014213252A JP2014213252A JP2016077982A5 JP 2016077982 A5 JP2016077982 A5 JP 2016077982A5 JP 2014213252 A JP2014213252 A JP 2014213252A JP 2014213252 A JP2014213252 A JP 2014213252A JP 2016077982 A5 JP2016077982 A5 JP 2016077982A5
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JP
Japan
Prior art keywords
granular material
applying
coated
port
substrate
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JP2014213252A
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English (en)
Japanese (ja)
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JP2016077982A (ja
JP6481154B2 (ja
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Priority claimed from JP2014213252A external-priority patent/JP6481154B2/ja
Priority to JP2014213252A priority Critical patent/JP6481154B2/ja
Priority to US15/319,870 priority patent/US10625297B2/en
Priority to CN201480080045.2A priority patent/CN106660065B/zh
Priority to PCT/JP2014/081877 priority patent/WO2016059732A1/ja
Priority to CN202010442591.3A priority patent/CN111599979B/zh
Priority to KR1020167034978A priority patent/KR102346145B1/ko
Publication of JP2016077982A publication Critical patent/JP2016077982A/ja
Publication of JP2016077982A5 publication Critical patent/JP2016077982A5/ja
Publication of JP6481154B2 publication Critical patent/JP6481154B2/ja
Application granted granted Critical
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JP2014213252A 2014-10-18 2014-10-18 粉粒体の塗布方法 Active JP6481154B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2014213252A JP6481154B2 (ja) 2014-10-18 2014-10-18 粉粒体の塗布方法
CN202010442591.3A CN111599979B (zh) 2014-10-18 2014-12-02 二次电池的电极形成方法
CN201480080045.2A CN106660065B (zh) 2014-10-18 2014-12-02 粉粒体的涂布方法
PCT/JP2014/081877 WO2016059732A1 (ja) 2014-10-18 2014-12-02 粉粒体の塗布方法
US15/319,870 US10625297B2 (en) 2014-10-18 2014-12-02 Method of applying powder or granular material
KR1020167034978A KR102346145B1 (ko) 2014-10-18 2014-12-02 분립체의 도포방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014213252A JP6481154B2 (ja) 2014-10-18 2014-10-18 粉粒体の塗布方法

Publications (3)

Publication Number Publication Date
JP2016077982A JP2016077982A (ja) 2016-05-16
JP2016077982A5 true JP2016077982A5 (cg-RX-API-DMAC7.html) 2017-11-09
JP6481154B2 JP6481154B2 (ja) 2019-03-13

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ID=55746299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014213252A Active JP6481154B2 (ja) 2014-10-18 2014-10-18 粉粒体の塗布方法

Country Status (5)

Country Link
US (1) US10625297B2 (cg-RX-API-DMAC7.html)
JP (1) JP6481154B2 (cg-RX-API-DMAC7.html)
KR (1) KR102346145B1 (cg-RX-API-DMAC7.html)
CN (2) CN111599979B (cg-RX-API-DMAC7.html)
WO (1) WO2016059732A1 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11426760B2 (en) 2017-02-03 2022-08-30 Hitachi Zosen Corporation Powder film forming method and powder film forming device
JP2020129495A (ja) * 2019-02-08 2020-08-27 エムテックスマート株式会社 全固体電池の製造方法
JP2021087905A (ja) * 2019-12-02 2021-06-10 エムテックスマート株式会社 粉粒体の塗布または成膜方法
CN111668455A (zh) * 2020-05-22 2020-09-15 宜春清陶能源科技有限公司 降低电池极片表面涂覆浆料过程中气泡量的方法及其在固态电解质涂布的应用
JP2022007837A (ja) * 2020-06-27 2022-01-13 正文 松永 粒子の製造方法、粒子またはスラリーの塗布方法、２次電池または２次電池の製造方法、全固体電池または全固体電池の製造方法、ｌｅｄまたはｌｅｄの製造方法、蛍光体シートまたは蛍光体シートの製造方法
JP2024054597A (ja) * 2022-10-05 2024-04-17 エムテックスマート株式会社 粉体の塗布方法、二次電池の製造方法、全固体電池の製造方法、二次電池、全固体電池

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