JP6477486B2 - ダイボンドシート及び半導体装置の製造方法 - Google Patents

ダイボンドシート及び半導体装置の製造方法 Download PDF

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Publication number
JP6477486B2
JP6477486B2 JP2015543884A JP2015543884A JP6477486B2 JP 6477486 B2 JP6477486 B2 JP 6477486B2 JP 2015543884 A JP2015543884 A JP 2015543884A JP 2015543884 A JP2015543884 A JP 2015543884A JP 6477486 B2 JP6477486 B2 JP 6477486B2
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Prior art keywords
die bond
sheet
die
bond sheet
silver
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Japanese (ja)
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JPWO2015060346A1 (ja
Inventor
偉夫 中子
偉夫 中子
田中　俊明
俊明 田中
名取　美智子
美智子 名取
正人 西村
正人 西村
石川　大
大 石川
祐貴 川名
祐貴 川名
松本　博
博 松本
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
JP2015543884A 2013-10-23 2014-10-22 ダイボンドシート及び半導体装置の製造方法 Active JP6477486B2 (ja)

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JP2013220395 2013-10-23
JP2013220395 2013-10-23
PCT/JP2014/078095 WO2015060346A1 (fr) 2013-10-23 2014-10-22 Feuille de fixation de puce et procédé de fabrication de dispositif à semi-conducteurs

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WO2017057428A1 (fr) * 2015-09-30 2017-04-06 日東電工株式会社 Feuille de liaison thermique, et feuille de liaison thermique avec ruban de découpage en dés
WO2017057429A1 (fr) * 2015-09-30 2017-04-06 日東電工株式会社 Feuille de liaison thermique, et feuille de liaison thermique avec ruban de découpage en dés
JP2017066485A (ja) 2015-09-30 2017-04-06 日東電工株式会社 シートおよび複合シート
JP6505572B2 (ja) * 2015-09-30 2019-04-24 日東電工株式会社 加熱接合用シート及びダイシングテープ付き加熱接合用シート
WO2017057485A1 (fr) * 2015-09-30 2017-04-06 日東電工株式会社 Feuille et feuille composite
JP6858520B2 (ja) 2015-09-30 2021-04-14 日東電工株式会社 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート
JP6870943B2 (ja) * 2015-09-30 2021-05-12 日東電工株式会社 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート
JP6704322B2 (ja) * 2015-09-30 2020-06-03 日東電工株式会社 シートおよび複合シート
JP2017069558A (ja) * 2015-09-30 2017-04-06 日東電工株式会社 パワー半導体装置の製造方法
JP2017069559A (ja) * 2015-09-30 2017-04-06 日東電工株式会社 パワー半導体装置の製造方法
JP6505571B2 (ja) 2015-09-30 2019-04-24 日東電工株式会社 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート
JP6677886B2 (ja) * 2016-02-29 2020-04-08 三菱マテリアル株式会社 半導体装置
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