JP6465591B2 - 描画装置 - Google Patents

描画装置 Download PDF

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Publication number
JP6465591B2
JP6465591B2 JP2014172363A JP2014172363A JP6465591B2 JP 6465591 B2 JP6465591 B2 JP 6465591B2 JP 2014172363 A JP2014172363 A JP 2014172363A JP 2014172363 A JP2014172363 A JP 2014172363A JP 6465591 B2 JP6465591 B2 JP 6465591B2
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JP
Japan
Prior art keywords
substrate
mark
mark forming
alignment
cover plate
Prior art date
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Active
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JP2014172363A
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English (en)
Japanese (ja)
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JP2016048273A (ja
Inventor
山賀　勝
山賀　　勝
清水　修一
修一 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orc Manufacturing Co Ltd
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Orc Manufacturing Co Ltd
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Publication date
Application filed by Orc Manufacturing Co Ltd filed Critical Orc Manufacturing Co Ltd
Priority to JP2014172363A priority Critical patent/JP6465591B2/ja
Priority to TW104113472A priority patent/TWI660246B/zh
Priority to KR1020150088912A priority patent/KR102333949B1/ko
Priority to CN201510354272.6A priority patent/CN105388707B/zh
Publication of JP2016048273A publication Critical patent/JP2016048273A/ja
Application granted granted Critical
Publication of JP6465591B2 publication Critical patent/JP6465591B2/ja
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2014172363A 2014-08-27 2014-08-27 描画装置 Active JP6465591B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014172363A JP6465591B2 (ja) 2014-08-27 2014-08-27 描画装置
TW104113472A TWI660246B (zh) 2014-08-27 2015-04-28 描繪裝置
KR1020150088912A KR102333949B1 (ko) 2014-08-27 2015-06-23 묘화 장치
CN201510354272.6A CN105388707B (zh) 2014-08-27 2015-06-24 描绘装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014172363A JP6465591B2 (ja) 2014-08-27 2014-08-27 描画装置

Publications (2)

Publication Number Publication Date
JP2016048273A JP2016048273A (ja) 2016-04-07
JP6465591B2 true JP6465591B2 (ja) 2019-02-06

Family

ID=55421130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014172363A Active JP6465591B2 (ja) 2014-08-27 2014-08-27 描画装置

Country Status (4)

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JP (1) JP6465591B2 (zh)
KR (1) KR102333949B1 (zh)
CN (1) CN105388707B (zh)
TW (1) TWI660246B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106371298B (zh) * 2016-11-25 2018-09-14 天津津芯微电子科技有限公司 Ldi内层对位方法及系统
DE102018132001A1 (de) 2018-12-12 2020-06-18 Laser Imaging Systems Gmbh Vorrichtung zum Belichten von plattenförmigen Werkstücken mit hohem Durchsatz
KR102238691B1 (ko) * 2018-12-17 2021-04-12 주식회사 선익시스템 웨이퍼 크기 확장 장치 및 이를 포함하는 웨이퍼 정렬 장치
KR102214357B1 (ko) * 2018-12-18 2021-02-10 주식회사 선익시스템 웨이퍼 크기 확장 장치 및 이를 포함하는 웨이퍼 정렬 장치
WO2020124406A1 (zh) * 2018-12-19 2020-06-25 江苏影速集成电路装备股份有限公司 一种双面曝光的对准装置、方法及设备
CN109471337B (zh) * 2018-12-29 2023-12-05 源卓微纳科技(苏州)股份有限公司 一种用于pcb内层板曝光的曝光机以及对准曝光方法
CN112549170A (zh) * 2019-09-10 2021-03-26 昊佰电子科技（上海）有限公司 一种平板切割绘图机用加工方法
CN117082746B (zh) * 2023-10-12 2024-01-23 四川英创力电子科技股份有限公司 一种半蚀刻铜面文字的加工方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1116823A (ja) * 1997-06-27 1999-01-22 Nec Kagoshima Ltd 反射型露光装置のプリアライメント方法および装置
JP2004012903A (ja) * 2002-06-07 2004-01-15 Fuji Photo Film Co Ltd 露光装置
WO2006118134A1 (ja) * 2005-04-28 2006-11-09 Fujifilm Corporation 描画装置および描画方法
JP2006309021A (ja) * 2005-04-28 2006-11-09 Fuji Photo Film Co Ltd ワーク位置情報取得方法および装置
JP2006309022A (ja) * 2005-04-28 2006-11-09 Fuji Photo Film Co Ltd 描画装置および描画方法
JP2007034186A (ja) * 2005-07-29 2007-02-08 Fujifilm Corp 描画方法および装置
KR101372036B1 (ko) * 2007-01-18 2014-03-10 엘지전자 주식회사 노광용 기준 마크를 형성하는 장치
JP5452889B2 (ja) 2008-06-04 2014-03-26 株式会社オーク製作所 描画装置
CN102540781B (zh) * 2010-12-28 2015-09-30 上海微电子装备有限公司 一种背面对准装置及方法
JP5813555B2 (ja) * 2012-03-30 2015-11-17 株式会社アドテックエンジニアリング 露光描画装置及び露光描画方法
JP5813556B2 (ja) * 2012-03-30 2015-11-17 株式会社アドテックエンジニアリング 露光描画装置、プログラム及び露光描画方法
JP5961429B2 (ja) * 2012-03-30 2016-08-02 株式会社アドテックエンジニアリング 露光描画装置及び露光描画方法

Also Published As

Publication number Publication date
JP2016048273A (ja) 2016-04-07
TWI660246B (zh) 2019-05-21
KR20160025441A (ko) 2016-03-08
KR102333949B1 (ko) 2021-12-01
CN105388707A (zh) 2016-03-09
TW201608345A (zh) 2016-03-01
CN105388707B (zh) 2019-01-15

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