JP6457255B2 - 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法 - Google Patents

接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法 Download PDF

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JP6457255B2
JP6457255B2 JP2014250384A JP2014250384A JP6457255B2 JP 6457255 B2 JP6457255 B2 JP 6457255B2 JP 2014250384 A JP2014250384 A JP 2014250384A JP 2014250384 A JP2014250384 A JP 2014250384A JP 6457255 B2 JP6457255 B2 JP 6457255B2
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Prior art keywords
resin core
resin
connection terminal
conductive particles
anisotropic conductive
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JP2014250384A
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Japanese (ja)
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JP2016115399A5 (zh
JP2016115399A (ja
Inventor
雄太 荒木
雄太 荒木
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Dexerials Corp
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Dexerials Corp
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Priority to JP2014250384A priority Critical patent/JP6457255B2/ja
Priority to KR1020177014219A priority patent/KR101908876B1/ko
Priority to PCT/JP2015/084478 priority patent/WO2016093261A1/ja
Priority to CN201580064653.9A priority patent/CN107005012B/zh
Priority to TW104141229A priority patent/TWI694473B/zh
Publication of JP2016115399A publication Critical patent/JP2016115399A/ja
Publication of JP2016115399A5 publication Critical patent/JP2016115399A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8803—Visual inspection
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Liquid Crystal (AREA)
JP2014250384A 2014-12-10 2014-12-10 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法 Active JP6457255B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014250384A JP6457255B2 (ja) 2014-12-10 2014-12-10 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法
KR1020177014219A KR101908876B1 (ko) 2014-12-10 2015-12-09 접속체의 검사 방법, 접속체, 도전성 입자 및 이방성 도전 접착제
PCT/JP2015/084478 WO2016093261A1 (ja) 2014-12-10 2015-12-09 接続体の検査方法、接続体、導電性粒子及び異方性導電接着剤
CN201580064653.9A CN107005012B (zh) 2014-12-10 2015-12-09 连接体的检查方法、连接体、导电性粒子及各向异性导电粘接剂
TW104141229A TWI694473B (zh) 2014-12-10 2015-12-09 連接體之檢查方法、連接體、導電性粒子及異向性導電接著劑

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014250384A JP6457255B2 (ja) 2014-12-10 2014-12-10 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法

Publications (3)

Publication Number Publication Date
JP2016115399A JP2016115399A (ja) 2016-06-23
JP2016115399A5 JP2016115399A5 (zh) 2018-01-11
JP6457255B2 true JP6457255B2 (ja) 2019-01-23

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JP2014250384A Active JP6457255B2 (ja) 2014-12-10 2014-12-10 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法

Country Status (5)

Country Link
JP (1) JP6457255B2 (zh)
KR (1) KR101908876B1 (zh)
CN (1) CN107005012B (zh)
TW (1) TWI694473B (zh)
WO (1) WO2016093261A1 (zh)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3542611B2 (ja) * 1991-07-26 2004-07-14 積水化学工業株式会社 導電性微粒子、電極接続構造体及びその製造方法
CN1240527A (zh) * 1996-10-15 2000-01-05 西门子公司 带接点区的芯片卡以及制造这种芯片卡的方法
KR20010098662A (ko) * 2000-04-17 2001-11-08 가마이 고로 터치식 액정 표시 장치 및 입력 검출 방법
JP2005026577A (ja) 2003-07-04 2005-01-27 Matsushita Electric Ind Co Ltd 電子部品の実装方法
JP2006054109A (ja) * 2004-08-12 2006-02-23 Seiko Instruments Inc 異方性導電膜及びそれを用いた表示装置、並びに、表示装置の検査方法及び検査装置
KR100720895B1 (ko) * 2005-07-05 2007-05-22 제일모직주식회사 농도 구배를 갖는 이종(異種) 복합 금속층이 형성된 전도성미립자, 그 제조방법 및 이를 이용한 이방 전도성 접착제조성물
KR20070096572A (ko) * 2006-03-27 2007-10-02 삼성전자주식회사 표시 장치
KR101368836B1 (ko) * 2008-09-19 2014-02-28 가부시기가이샤 닛뽕쇼꾸바이 도전성 미립자 및 그것을 사용한 이방성 도전재료
JP5833809B2 (ja) * 2010-02-01 2015-12-16 デクセリアルズ株式会社 異方性導電フィルム、接合体及び接続方法
KR20130100950A (ko) * 2010-07-05 2013-09-12 디아이씨 가부시끼가이샤 투명 도전층 부착 기체 및 그의 제조 방법, 및 터치 패널용 투명 도전막 적층체, 터치 패널
GB201212489D0 (en) * 2012-07-13 2012-08-29 Conpart As Improvements in conductive adhesives
KR101477237B1 (ko) * 2012-12-27 2014-12-29 제일모직 주식회사 레이저를 이용한 접속 방법

Also Published As

Publication number Publication date
WO2016093261A1 (ja) 2016-06-16
KR101908876B1 (ko) 2018-10-16
KR20170077181A (ko) 2017-07-05
TW201628024A (zh) 2016-08-01
CN107005012B (zh) 2019-06-18
JP2016115399A (ja) 2016-06-23
TWI694473B (zh) 2020-05-21
CN107005012A (zh) 2017-08-01

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