JP6426152B2 - 黒化導電性パターンの形成方法および黒化導電性インク組成物 - Google Patents

黒化導電性パターンの形成方法および黒化導電性インク組成物 Download PDF

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Publication number
JP6426152B2
JP6426152B2 JP2016511680A JP2016511680A JP6426152B2 JP 6426152 B2 JP6426152 B2 JP 6426152B2 JP 2016511680 A JP2016511680 A JP 2016511680A JP 2016511680 A JP2016511680 A JP 2016511680A JP 6426152 B2 JP6426152 B2 JP 6426152B2
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Japan
Prior art keywords
manganese
blackening
ink composition
iii
conductive ink
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JP2016511680A
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English (en)
Japanese (ja)
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JP2016526278A (ja
Inventor
クヮン−チョン チュン，
クヮン−チョン チュン，
インスク イ，
インスク イ，
ミンヒ キム，
ミンヒ キム，
ジ−フン ヨ，
ジ−フン ヨ，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
InkTec Co Ltd
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InkTec Co Ltd
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Publication of JP2016526278A publication Critical patent/JP2016526278A/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0092—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive pigments, e.g. paint, ink, tampon printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2016511680A 2013-04-30 2014-04-30 黒化導電性パターンの形成方法および黒化導電性インク組成物 Active JP6426152B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2013-0047888 2013-04-30
KR1020130047888A KR101553439B1 (ko) 2013-04-30 2013-04-30 흑화 전도성 패턴의 형성방법
PCT/KR2014/003832 WO2014178640A1 (ko) 2013-04-30 2014-04-30 흑화 전도성 패턴의 형성방법 및 흑화 전도성 잉크 조성물

Publications (2)

Publication Number Publication Date
JP2016526278A JP2016526278A (ja) 2016-09-01
JP6426152B2 true JP6426152B2 (ja) 2018-11-21

Family

ID=51843693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016511680A Active JP6426152B2 (ja) 2013-04-30 2014-04-30 黒化導電性パターンの形成方法および黒化導電性インク組成物

Country Status (4)

Country Link
JP (1) JP6426152B2 (zh)
KR (1) KR101553439B1 (zh)
CN (1) CN105519242B (zh)
WO (1) WO2014178640A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107072039A (zh) * 2016-12-23 2017-08-18 中国科学院深圳先进技术研究院 制备导电线路的方法
JP7375294B2 (ja) * 2017-07-28 2023-11-08 Tdk株式会社 導電性基板、電子装置及び表示装置の製造方法
CN111511121A (zh) * 2020-05-15 2020-08-07 深圳市百柔新材料技术有限公司 立体导电线路及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3661244B2 (ja) * 1995-10-27 2005-06-15 旭硝子株式会社 導電膜、低反射性導電膜の形成方法
JP3641144B2 (ja) * 1998-09-11 2005-04-20 株式会社東芝 溝の埋め込み方法
JP2002314227A (ja) * 2001-04-19 2002-10-25 Toko Inc セラミック配線基板の製造方法
JP4266288B2 (ja) * 2001-12-25 2009-05-20 大日本印刷株式会社 電磁波遮蔽シートの製造方法および電磁波遮蔽シート
KR101097569B1 (ko) * 2005-03-10 2011-12-22 엘지디스플레이 주식회사 액정표시소자의 제조방법
KR100743891B1 (ko) * 2005-10-24 2007-07-30 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
KR100690929B1 (ko) * 2006-05-03 2007-03-09 한국기계연구원 건식필름레지스트를 이용하여 원하는 패턴두께 또는 높은종횡비를 가지는 고해상도패턴 형성 방법
KR100922810B1 (ko) 2007-12-11 2009-10-21 주식회사 잉크테크 흑화 전도성 패턴의 제조방법
US8383011B2 (en) * 2008-01-30 2013-02-26 Basf Se Conductive inks with metallo-organic modifiers
CN103748977A (zh) * 2011-08-23 2014-04-23 株式会社藤仓 部件安装印刷电路基板及其制造方法
KR101228904B1 (ko) * 2011-10-12 2013-02-01 아페리오(주) 마이크로 볼을 이용한 범프 제조방법

Also Published As

Publication number Publication date
KR101553439B1 (ko) 2015-10-01
KR20140130256A (ko) 2014-11-10
CN105519242B (zh) 2018-12-28
WO2014178640A1 (ko) 2014-11-06
CN105519242A (zh) 2016-04-20
JP2016526278A (ja) 2016-09-01

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