JP6423418B2 - Ｌｄｓプラスチック用添加剤 - Google Patents

Ｌｄｓプラスチック用添加剤 Download PDF

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Publication number
JP6423418B2
JP6423418B2 JP2016512243A JP2016512243A JP6423418B2 JP 6423418 B2 JP6423418 B2 JP 6423418B2 JP 2016512243 A JP2016512243 A JP 2016512243A JP 2016512243 A JP2016512243 A JP 2016512243A JP 6423418 B2 JP6423418 B2 JP 6423418B2
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JP
Japan
Prior art keywords
core
composite pigment
coating
lds
polymer composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016512243A
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English (en)
Japanese (ja)
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JP2016520139A (ja
JP2016520139A5 (fr
Inventor
ヘルゲ ベティーナ ニース、
ヘルゲ ベティーナ ニース、
ウルリッヒ クイットマン、
ウルリッヒ クイットマン、
オリバー ロベルト ピーニク、
オリバー ロベルト ピーニク、
シルヴィア ローゼンバーガー、
シルヴィア ローゼンバーガー、
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Merck Patent GmbH
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Merck Patent GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Publication of JP2016520139A publication Critical patent/JP2016520139A/ja
Publication of JP2016520139A5 publication Critical patent/JP2016520139A5/ja
Application granted granted Critical
Publication of JP6423418B2 publication Critical patent/JP6423418B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2231—Oxides; Hydroxides of metals of tin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0227—Insulating particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Paints Or Removers (AREA)
JP2016512243A 2013-05-07 2014-05-05 Ｌｄｓプラスチック用添加剤 Expired - Fee Related JP6423418B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013007750.8 2013-05-07
DE102013007750.8A DE102013007750A1 (de) 2013-05-07 2013-05-07 Additiv für LDS-Kunststoffe
PCT/EP2014/001183 WO2014180550A1 (fr) 2013-05-07 2014-05-05 Additif pour matières plastiques à structuration directe par laser

Publications (3)

Publication Number Publication Date
JP2016520139A JP2016520139A (ja) 2016-07-11
JP2016520139A5 JP2016520139A5 (fr) 2017-11-24
JP6423418B2 true JP6423418B2 (ja) 2018-11-14

Family

ID=50828857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016512243A Expired - Fee Related JP6423418B2 (ja) 2013-05-07 2014-05-05 Ｌｄｓプラスチック用添加剤

Country Status (7)

Country Link
EP (1) EP2995178A1 (fr)
JP (1) JP6423418B2 (fr)
KR (1) KR102171893B1 (fr)
CN (1) CN105230133B (fr)
DE (1) DE102013007750A1 (fr)
TW (1) TWI632205B (fr)
WO (1) WO2014180550A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022030370A1 (fr) 2020-08-05 2022-02-10 信越化学工業株式会社 Composition de résine thermodurcissable et dispositif à semi-conducteur

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9676927B2 (en) 2014-04-09 2017-06-13 The Shepherd Color Company Core-shell composite inorganic metal oxides and method of preparing for prevention of thermal oxidative degradation in polymer and resin compositions
CN107001813A (zh) * 2014-12-12 2017-08-01 沙特基础工业全球技术公司 激光直接结构化材料及其制备方法
EP3230060B1 (fr) * 2014-12-12 2021-09-01 SHPP Global Technologies B.V. Structuration directe au laser de films et feuilles polymères et procédés de fabrication
MX2018001103A (es) * 2015-07-28 2018-03-26 Merck Patent Gmbh Polimeros y recubrimientos marcables con laser.
JP6441874B2 (ja) * 2015-12-24 2018-12-19 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング層形成用組成物、キット、およびメッキ層付樹脂成形品の製造方法
KR102487138B1 (ko) * 2016-11-22 2023-01-10 메르크 파텐트 게엠베하 레이저-마킹가능한 및 레이저-용접가능한 중합체 물질을 위한 첨가제
CN106751389B (zh) * 2016-11-30 2019-03-26 上海中镭新材料科技有限公司 一种浅色的用于lds技术的工程塑料及其制备方法
KR101970510B1 (ko) * 2016-11-30 2019-04-22 유림특수화학 주식회사 광반응성 필러를 이용한 코팅용 도료
WO2018130952A1 (fr) * 2017-01-11 2018-07-19 Sabic Global Technologies B.V. Compositions thermoplastiques recouvrables par laser avec un composé métallique activable par laser, et articles façonnés obtenus à partir d'elles
EP3568432B1 (fr) * 2017-01-11 2024-03-20 SHPP Global Technologies B.V. Composition à conductivité thermique et efficacité de placage au laser par additif lds à structure noyau-enveloppe avec des composés métalliques enduits une sur surface de charge minérale
CN110268013A (zh) * 2017-01-11 2019-09-20 沙特基础工业全球技术公司 具有可激光活化金属化合物的可激光镀敷热塑性组合物及其成形制品
WO2019042906A1 (fr) * 2017-08-29 2019-03-07 Merck Patent Gmbh Additif sensible au laser et additif pour matières plastiques à structuration directe par laser
EP3746501A1 (fr) * 2018-02-02 2020-12-09 Sivantos Pte. Ltd. Composition de fabrication de composants de prothèse auditive
EP3543291A1 (fr) 2018-03-21 2019-09-25 SABIC Global Technologies B.V. Compositions thermoplastiques plaquables par laser ayant une bonne ininflammabilité, une propriété thermique élevée et une bonne ductilité et articles moulés ainsi fabriqués
KR20210009335A (ko) * 2018-05-16 2021-01-26 메르크 파텐트 게엠베하 레이저 첨가제 및 중합체 재료에서의 그 용도
CN113423774B (zh) * 2018-12-19 2023-12-15 Mep欧洲有限公司 用于激光直接结构化的热塑性组合物
US11637365B2 (en) 2019-08-21 2023-04-25 Ticona Llc Polymer composition for use in an antenna system
US11258184B2 (en) 2019-08-21 2022-02-22 Ticona Llc Antenna system including a polymer composition having a low dissipation factor
US11912817B2 (en) 2019-09-10 2024-02-27 Ticona Llc Polymer composition for laser direct structuring
US11555113B2 (en) 2019-09-10 2023-01-17 Ticona Llc Liquid crystalline polymer composition
US11646760B2 (en) 2019-09-23 2023-05-09 Ticona Llc RF filter for use at 5G frequencies
US11917753B2 (en) 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies
US11721888B2 (en) 2019-11-11 2023-08-08 Ticona Llc Antenna cover including a polymer composition having a low dielectric constant and dissipation factor
JP2023515976A (ja) 2020-02-26 2023-04-17 ティコナ・エルエルシー 回路構造体
JP7562989B2 (ja) 2020-03-12 2024-10-08 住友ベークライト株式会社 電子装置
JP7501131B2 (ja) 2020-06-11 2024-06-18 住友ベークライト株式会社 Ｌｄｓ用熱硬化性樹脂組成物および構造体
CN113831672B (zh) * 2020-06-24 2023-05-16 华为机器有限公司 共混的热塑性复合材料、天线支架及终端
US11728559B2 (en) 2021-02-18 2023-08-15 Ticona Llc Polymer composition for use in an antenna system
CN115926521B (zh) * 2022-12-13 2024-02-13 惠州市日大实业有限公司 数字信号纳米涂料及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832560B2 (ja) * 1987-05-15 1996-03-29 テイカ株式会社 複合導電性粉末およびその製造法
JPH09249820A (ja) * 1996-03-15 1997-09-22 Titan Kogyo Kk 白色導電性粉末及びその製造方法
DE19723734C2 (de) 1997-06-06 2002-02-07 Gerhard Naundorf Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial und Verfahren zu ihrer Herstellung
DE10132092A1 (de) 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
US20070032569A1 (en) 2003-09-17 2007-02-08 Langdon Donald R Laser markable polymeric compositions
US7507511B2 (en) * 2005-01-14 2009-03-24 Ricoh Company Ltd. Electrophotographic photoreceptor, and image forming apparatus and process cartridge therefor using the electrophotographic photoreceptor
US8309640B2 (en) 2008-05-23 2012-11-13 Sabic Innovative Plastics Ip B.V. High dielectric constant laser direct structuring materials
BRPI1013619A2 (pt) * 2009-03-18 2016-04-19 Merck Patent Gmbh pigmento para marcação a laser
WO2012056416A1 (fr) 2010-10-26 2012-05-03 Sabic Innovative Plastics Ip B.V Matériaux de structuration directe au laser avec prise en compte de toutes les couleurs
DE102011000138A1 (de) 2011-01-14 2012-07-19 Lpkf Laser & Electronics Ag Verfahren zur selektiven Metallisierung eines Substrats sowie ein nach diesem Verfahren hergestellter Schaltungsträger
JP5912704B2 (ja) 2011-03-18 2016-04-27 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
JP5437539B2 (ja) 2011-03-18 2014-03-12 ミツビシ ケミカル ヨーロッパ ゲーエムベーハー 回路基板の製造方法
JP5675920B2 (ja) 2012-09-14 2015-02-25 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法
JP5675919B2 (ja) 2012-09-14 2015-02-25 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法
JP5579909B2 (ja) * 2012-09-14 2014-08-27 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022030370A1 (fr) 2020-08-05 2022-02-10 信越化学工業株式会社 Composition de résine thermodurcissable et dispositif à semi-conducteur

Also Published As

Publication number Publication date
TWI632205B (zh) 2018-08-11
JP2016520139A (ja) 2016-07-11
KR102171893B1 (ko) 2020-10-30
KR20160005742A (ko) 2016-01-15
CN105230133A (zh) 2016-01-06
TW201510109A (zh) 2015-03-16
EP2995178A1 (fr) 2016-03-16
WO2014180550A1 (fr) 2014-11-13
DE102013007750A1 (de) 2014-11-13
CN105230133B (zh) 2019-01-15

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