JP6162879B2 - 導電性パターン形成用組成物、これを用いた導電性パターンの形成方法と、導電性パターンを有する樹脂構造体 - Google Patents
導電性パターン形成用組成物、これを用いた導電性パターンの形成方法と、導電性パターンを有する樹脂構造体 Download PDFInfo
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- JP6162879B2 JP6162879B2 JP2016506260A JP2016506260A JP6162879B2 JP 6162879 B2 JP6162879 B2 JP 6162879B2 JP 2016506260 A JP2016506260 A JP 2016506260A JP 2016506260 A JP2016506260 A JP 2016506260A JP 6162879 B2 JP6162879 B2 JP 6162879B2
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- metal
- conductive pattern
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- layer
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- 229920005989 resin Polymers 0.000 title claims description 121
- 239000011347 resin Substances 0.000 title claims description 121
- 239000000203 mixture Substances 0.000 title claims description 78
- 238000000034 method Methods 0.000 title claims description 61
- 239000002184 metal Substances 0.000 claims description 177
- 229910052751 metal Inorganic materials 0.000 claims description 177
- 150000002736 metal compounds Chemical class 0.000 claims description 88
- 239000002952 polymeric resin Substances 0.000 claims description 64
- 229920003002 synthetic resin Polymers 0.000 claims description 64
- 239000000758 substrate Substances 0.000 claims description 47
- 238000007747 plating Methods 0.000 claims description 25
- 150000002739 metals Chemical class 0.000 claims description 21
- 150000002500 ions Chemical class 0.000 claims description 19
- 229920005668 polycarbonate resin Polymers 0.000 claims description 16
- 239000004431 polycarbonate resin Substances 0.000 claims description 16
- 229910021645 metal ion Inorganic materials 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 12
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- 238000006722 reduction reaction Methods 0.000 claims description 10
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- 238000007772 electroless plating Methods 0.000 claims description 9
- 230000007261 regionalization Effects 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 239000012744 reinforcing agent Substances 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 6
- HUQOFZLCQISTTJ-UHFFFAOYSA-N diethylaminoboron Chemical compound CCN([B])CC HUQOFZLCQISTTJ-UHFFFAOYSA-N 0.000 claims description 6
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 claims description 6
- 239000012963 UV stabilizer Substances 0.000 claims description 5
- 239000000314 lubricant Substances 0.000 claims description 5
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 4
- 239000012760 heat stabilizer Substances 0.000 claims description 4
- 229920001283 Polyalkylene terephthalate Polymers 0.000 claims description 3
- 239000004954 Polyphthalamide Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- 239000003929 acidic solution Substances 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 239000003637 basic solution Substances 0.000 claims description 3
- 239000003063 flame retardant Substances 0.000 claims description 3
- 239000011256 inorganic filler Substances 0.000 claims description 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 3
- 229920006375 polyphtalamide Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000011342 resin composition Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 description 35
- 238000000635 electron micrograph Methods 0.000 description 15
- 238000002441 X-ray diffraction Methods 0.000 description 14
- 239000000243 solution Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- 239000002585 base Substances 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000002310 reflectometry Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 5
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- 238000010561 standard procedure Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052596 spinel Inorganic materials 0.000 description 3
- 239000011029 spinel Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000011817 metal compound particle Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/123—Treatment by wave energy or particle radiation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0006—Apparatus or processes specially adapted for manufacturing conductors or cables for reducing the size of conductors or cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/22—Thermoplastic resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/24—Thermosetting resins
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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Description
第1および第2金属のうちの少なくとも1種の金属、およびXの原子が角を共有する八面体をなし、これらが互いに2次元的に連結された構造に配列されている複数の第1層(edge−shared octahedral layer)と、
前記第1層と異なる種類の金属を含み、互いに隣接する第1層の間で、当該金属が八面体の2次元的連結構造を互いに結合させている第2層とを含む立体構造を有してもよい。
第1金属および第2金属を含む非導電性金属化合物であって、
前記第1および第2金属のうちの少なくとも1種の金属を含み、角を共有する八面体が互いに2次元的に連結された構造を有する複数の第1層(edge−shared octahedral layer)と、前記第1層と異なる種類の金属を含み、互いに隣接する第1層の間に配列された第2層とを含む立体構造を有する非導電性金属化合物を含み、
電磁波の照射によって、前記非導電性金属化合物から前記第1または第2金属やそのイオンを含む金属核が形成される、電磁波の照射による導電性パターン形成用組成物が提供される。
原材料CuOとCr2O3を2:1のモル比率として、6時間ボールミリングすることにより互いに均一に混合した。以降、常圧および1050℃の条件下、2時間焼成して、CuCrO2の化学式を有する粉末を合成した。このような合成後には、追加の粉砕処理をして、以下の実施例で使用するCuCrO2粉末を製造した。該粉末の電子顕微鏡写真およびX線回折パターンは、それぞれ図5および図6に示された通りである。
製造例1で得られた非導電性金属酸化物粉末(CuCrO2)を、ポリカーボネート樹脂と共に使用した。追加的に、工程および安定化のための添加剤である熱安定化剤(IR1076、PEP36)、UV安定剤(UV329)、滑剤(EP184)、および衝撃補強剤(S2001)を共に用いて、電磁波の照射による導電性パターン形成用組成物を製造した。
実施例1で非導電性金属化合物粉末(CuCrO2)の含有量を3重量%にしたことを除いては、実施例1と同様の方法で導電性パターン形成用組成物を製造し、これから導電性パターンを有する樹脂構造体を製造した。実施例1と同様の方法で金属核の形成を確認し、実施例1と同様の方法で、ポリカーボネート樹脂基板上に接着性に優れた良好な導電性パターンが形成されたことを確認した(下記試験例および表1参照)。
実施例1で非導電性金属化合物粉末(CuCrO2)の含有量を2重量%にしたことを除いては、実施例1と同様の方法で導電性パターン形成用組成物を製造し、これから導電性パターンを有する樹脂構造体を製造した。実施例1と同様の方法で金属核の形成を確認した。また、前記樹脂構造体を用いて導電性パターンの形成された実製品を例示的に製造した後、その写真を図13に示した。これによって、ポリカーボネート樹脂基板上に接着性に優れた良好な導電性パターンが形成されたことが確認され、特に、銅メッキまたはニッケル/銅メッキされた良好な導電性パターンがレーザ照射部に均一に形成できることが確認された。
非導電性金属化合物として、CuCrO2の代わりにCuNiO2を使用し、レーザ照射条件をパワー10Wの代わりに3Wで異にして照射したことを除いては、実施例1と同様の方法で導電性パターン形成用組成物を製造し、これから導電性パターンを有する樹脂構造体を製造した。
まず、前記実施例1〜3および比較例1において、レーザ照射直前の樹脂基板に対して1064nmの波長を有するレーザに対する反射度を、UVvis−NIR spectrometerを用いて測定した。このような測定結果を下記表1にまとめて示した。
Claims (14)
- 高分子樹脂;および
第1金属および第2金属を含む非導電性金属化合物であって、
前記第1および第2金属のうちの少なくとも1種の金属を含み、角を共有する八面体が互いに2次元的に連結された構造を有する複数の第1層(edge−shared octahedral layer)と、前記第1層と異なる種類の金属を含み、互いに隣接する第1層の間に配列された第2層とを含む立体構造を有する非導電性金属化合物を含み、
1000nm〜1200nmの波長を有するレーザ電磁波が5〜20Wの平均パワーで照射され、前記非導電性金属化合物から前記第1または第2金属やそのイオンを含む金属核が形成され、
1000nm〜1200nmの波長を有するレーザ電磁波に対して25%以下の反射度を示す、電磁波の照射による導電性パターン形成用組成物。 - 請求項1において、
前記非導電性金属化合物は、下記のあるいはP63/mmcの空間群構造を有する導電性パターン形成用組成物。
- 請求項1において、
前記非導電性金属化合物は、第1および第2金属と、X(酸素、窒素、または硫黄)とを含む化合物であって、
第1および第2金属のうちの少なくとも1種の金属、およびXの原子が角を共有する八面体をなし、これらが互いに2次元的に連結された構造に配列されている複数の第1層(edge−shared octahedral layer)と、
前記第1層と異なる種類の金属を含み、互いに隣接する第1層の間で、当該金属が八面体の2次元的連結構造を互いに結合させている第2層とを含む立体構造を有する、電磁波の照射による導電性パターン形成用組成物。 - 請求項1において、
前記非導電性金属化合物は、CuCrO2、NiCrO2、AgCrO2、CuMoO2、NiMoO2、AgMoO2、NiMnO2、AgMnO2、NiFeO2、AgFeO2、CuWO2、AgWO2、NiWO2、AgSnO2、NiSnO2、およびCuSnO2からなる群より選択された化合物を1種以上含む、電磁波の照射による導電性パターン形成用組成物。 - 請求項1において、
前記高分子樹脂は、熱硬化性樹脂または熱可塑性樹脂を含む、電磁波の照射による導電性パターン形成用組成物。 - 請求項5において、
前記高分子樹脂は、ABS樹脂、ポリアルキレンテレフタレート樹脂、ポリカーボネート樹脂、ポリプロピレン樹脂、およびポリフタルアミド樹脂からなる群より選択された1種以上を含む、電磁波の照射による導電性パターン形成用組成物。 - 請求項1において、
前記非導電性金属化合物は、全体組成物に対して1〜10重量%で含まれる、電磁波の照射による導電性パターン形成用組成物。 - 請求項1において、
熱安定剤、UV安定剤、難燃剤、滑剤、抗酸化剤、無機充填剤、色添加剤、衝撃補強剤、および機能性補強剤からなる群より選択された1種以上の添加剤をさらに含む、電磁波の照射による導電性パターン形成用組成物。 - 請求項1〜8のいずれか1項に記載の導電性パターン形成用組成物を樹脂製品に成形したり、他の製品に塗布して樹脂層を形成する段階と、
前記樹脂製品または樹脂層の所定領域に電磁波を照射して、前記非導電性金属化合物から第1または第2金属やそのイオンを含む金属核を発生させる段階と、
前記金属核を発生させた領域を化学的に還元またはメッキさせて、導電性金属層を形成する段階とを含み、
前記金属核発生段階において、1000nm〜1200nmの波長を有するレーザ電磁波が5〜20Wの平均パワーで照射される、電磁波の直接照射による導電性パターンの形成方法。 - 請求項9において、
前記金属核発生段階を行うと、前記非導電性金属化合物の一部が前記樹脂製品または樹脂層の所定領域の表面に露出しながら、これから金属核が発生し、より高い接着性を有するように活性化した接着活性表面を形成する、電磁波の直接照射による導電性パターンの形成方法。 - 請求項10において、
前記導電性金属層は、前記金属核に含まれている第1または第2金属イオンの化学的還元、またはこれに対する無電解メッキによって、前記接着活性表面上に形成される、電磁波の直接照射による導電性パターンの形成方法。 - 請求項9において、
前記還元またはメッキ段階では、前記金属核を発生させた領域を、還元剤を含む酸性または塩基性溶液で処理する、電磁波の直接照射による導電性パターンの形成方法。 - 請求項12において、
前記還元剤は、ホルムアルデヒド、次亜リン酸塩、ジメチルアミノボラン(DMAB)、ジエチルアミノボラン(DEAB)、およびヒドラジンからなる群より選択された1種以上を含む、電磁波の直接照射による導電性パターンの形成方法。 - 高分子樹脂基材;
第1金属および第2金属を含み、高分子樹脂基材に分散している非導電性金属化合物であって、
前記第1および第2金属のうちの少なくとも1種の金属を含み、角を共有する八面体が互いに2次元的に連結された構造を有する複数の第1層(edge−shared octahedral layer)と、前記第1層と異なる種類の金属を含み、互いに隣接する第1層の間に配列された第2層とを含む立体構造を有する非導電性金属化合物;
所定領域の高分子樹脂基材の表面に露出した第1または第2金属やそのイオンを含む金属核を含む接着活性表面;および
前記接着活性表面上に形成された導電性金属層を含み、
前記接着活性表面が形成されていない領域が、1000nm〜1200nmの波長を有するレーザ電磁波に対して25%以下の反射度を示す樹脂構造体であって、
前記接着活性表面および導電性金属層が形成された所定領域は、前記高分子樹脂基材に1000nm〜1200nmの波長を有するレーザ電磁波が5〜20Wの平均パワーで照射された領域に対応する導電性パターンを有する樹脂構造体。
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US9967974B2 (en) | 2018-05-08 |
CN105190781B (zh) | 2018-03-06 |
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CN105190781A (zh) | 2015-12-23 |
EP2958112A4 (en) | 2016-09-07 |
EP2958112B1 (en) | 2019-11-27 |
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