DE102013007750A1 - Additiv für LDS-Kunststoffe - Google Patents

Additiv für LDS-Kunststoffe Download PDF

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Publication number
DE102013007750A1
DE102013007750A1 DE102013007750.8A DE102013007750A DE102013007750A1 DE 102013007750 A1 DE102013007750 A1 DE 102013007750A1 DE 102013007750 A DE102013007750 A DE 102013007750A DE 102013007750 A1 DE102013007750 A1 DE 102013007750A1
Authority
DE
Germany
Prior art keywords
core
lds
coating
use according
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102013007750.8A
Other languages
German (de)
English (en)
Inventor
Helge Bettina Kniess
Ulrich Quittmann
Oliver Robert Piening
Silvia Rosenberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Merck Patent GmbH
Original Assignee
Merck Patent GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Priority to DE102013007750.8A priority Critical patent/DE102013007750A1/de
Priority to JP2016512243A priority patent/JP6423418B2/ja
Priority to PCT/EP2014/001183 priority patent/WO2014180550A1/fr
Priority to CN201480025992.1A priority patent/CN105230133B/zh
Priority to EP14726515.1A priority patent/EP2995178A1/fr
Priority to KR1020157034593A priority patent/KR102171893B1/ko
Priority to TW103116099A priority patent/TWI632205B/zh
Publication of DE102013007750A1 publication Critical patent/DE102013007750A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2231—Oxides; Hydroxides of metals of tin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0227—Insulating particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Paints Or Removers (AREA)
DE102013007750.8A 2013-05-07 2013-05-07 Additiv für LDS-Kunststoffe Withdrawn DE102013007750A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102013007750.8A DE102013007750A1 (de) 2013-05-07 2013-05-07 Additiv für LDS-Kunststoffe
JP2016512243A JP6423418B2 (ja) 2013-05-07 2014-05-05 Ｌｄｓプラスチック用添加剤
PCT/EP2014/001183 WO2014180550A1 (fr) 2013-05-07 2014-05-05 Additif pour matières plastiques à structuration directe par laser
CN201480025992.1A CN105230133B (zh) 2013-05-07 2014-05-05 用于lds-塑料的添加剂
EP14726515.1A EP2995178A1 (fr) 2013-05-07 2014-05-05 Additif pour matières plastiques à structuration directe par laser
KR1020157034593A KR102171893B1 (ko) 2013-05-07 2014-05-05 Lds 플라스틱용 첨가제
TW103116099A TWI632205B (zh) 2013-05-07 2014-05-06 用於ｌｄｓ（雷射直接成型）塑料中之添加劑

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102013007750.8A DE102013007750A1 (de) 2013-05-07 2013-05-07 Additiv für LDS-Kunststoffe

Publications (1)

Publication Number Publication Date
DE102013007750A1 true DE102013007750A1 (de) 2014-11-13

Family

ID=50828857

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102013007750.8A Withdrawn DE102013007750A1 (de) 2013-05-07 2013-05-07 Additiv für LDS-Kunststoffe

Country Status (7)

Country Link
EP (1) EP2995178A1 (fr)
JP (1) JP6423418B2 (fr)
KR (1) KR102171893B1 (fr)
CN (1) CN105230133B (fr)
DE (1) DE102013007750A1 (fr)
TW (1) TWI632205B (fr)
WO (1) WO2014180550A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016092473A1 (fr) * 2014-12-12 2016-06-16 Sabic Global Technologies B.V. Matériaux à structuration directe par laser et leurs procédés de fabrication
WO2017016645A1 (fr) * 2015-07-28 2017-02-02 Merck Patent Gmbh Polymères et revêtements pouvant être marqués au laser
WO2019042906A1 (fr) * 2017-08-29 2019-03-07 Merck Patent Gmbh Additif sensible au laser et additif pour matières plastiques à structuration directe par laser
WO2019149900A1 (fr) * 2018-02-02 2019-08-08 Sivantos Pte. Ltd. Composition de fabrication de composants de prothèse auditive
WO2019219557A1 (fr) * 2018-05-16 2019-11-21 Merck Patent Gmbh Additif laser et son utilisation dans des matériaux polymères
WO2020126189A1 (fr) * 2018-12-19 2020-06-25 Mep Europe B.V. Composition de polycarbonate pour structuration directe par laser
US11370911B2 (en) * 2017-01-11 2022-06-28 Shpp Global Technologies B.V. Laser platable thermoplastic compositions with a laser activatable metal compound and shaped articles therefrom

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US9676927B2 (en) 2014-04-09 2017-06-13 The Shepherd Color Company Core-shell composite inorganic metal oxides and method of preparing for prevention of thermal oxidative degradation in polymer and resin compositions
CN107001687B (zh) * 2014-12-12 2019-07-12 沙特基础工业全球技术公司 聚合物膜和片材的激光直接成型和制备方法
JP6441874B2 (ja) * 2015-12-24 2018-12-19 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング層形成用組成物、キット、およびメッキ層付樹脂成形品の製造方法
US11618221B2 (en) * 2016-11-22 2023-04-04 Merck Patent Gmbh Additive for laser-markable and laser-weldable polymer materials
KR101970510B1 (ko) * 2016-11-30 2019-04-22 유림특수화학 주식회사 광반응성 필러를 이용한 코팅용 도료
CN106751389B (zh) * 2016-11-30 2019-03-26 上海中镭新材料科技有限公司 一种浅色的用于lds技术的工程塑料及其制备方法
US11028250B2 (en) * 2017-01-11 2021-06-08 Shpp Global Technologies B.V. Composition with thermal conductivity and laser plating performance by core-shell structure LDS additive with metal compounds coated on mineral filler surface
CN110268013A (zh) * 2017-01-11 2019-09-20 沙特基础工业全球技术公司 具有可激光活化金属化合物的可激光镀敷热塑性组合物及其成形制品
EP3543291A1 (fr) 2018-03-21 2019-09-25 SABIC Global Technologies B.V. Compositions thermoplastiques plaquables par laser ayant une bonne ininflammabilité, une propriété thermique élevée et une bonne ductilité et articles moulés ainsi fabriqués
US11637365B2 (en) 2019-08-21 2023-04-25 Ticona Llc Polymer composition for use in an antenna system
US11258184B2 (en) 2019-08-21 2022-02-22 Ticona Llc Antenna system including a polymer composition having a low dissipation factor
US11912817B2 (en) 2019-09-10 2024-02-27 Ticona Llc Polymer composition for laser direct structuring
US11555113B2 (en) 2019-09-10 2023-01-17 Ticona Llc Liquid crystalline polymer composition
US11646760B2 (en) 2019-09-23 2023-05-09 Ticona Llc RF filter for use at 5G frequencies
US11917753B2 (en) 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies
US11721888B2 (en) 2019-11-11 2023-08-08 Ticona Llc Antenna cover including a polymer composition having a low dielectric constant and dissipation factor
WO2021173412A1 (fr) 2020-02-26 2021-09-02 Ticona Llc Structure de circuit
JP7501131B2 (ja) 2020-06-11 2024-06-18 住友ベークライト株式会社 Ｌｄｓ用熱硬化性樹脂組成物および構造体
CN113831672B (zh) * 2020-06-24 2023-05-16 华为机器有限公司 共混的热塑性复合材料、天线支架及终端
JP6907393B1 (ja) 2020-08-05 2021-07-21 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
US11728559B2 (en) 2021-02-18 2023-08-15 Ticona Llc Polymer composition for use in an antenna system
CN115926521B (zh) * 2022-12-13 2024-02-13 惠州市日大实业有限公司 数字信号纳米涂料及其制备方法

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EP1274288B1 (fr) 2001-07-05 2005-03-09 LPKF Laser & Electronics Aktiengesellschaft Structures de traces conductrices et procédé de fabrication
WO2012056416A1 (fr) 2010-10-26 2012-05-03 Sabic Innovative Plastics Ip B.V Matériaux de structuration directe au laser avec prise en compte de toutes les couleurs
EP2476723A1 (fr) 2011-01-14 2012-07-18 LPKF Laser & Electronics AG Procédé de métallisation sélective d'un substrat ainsi que support de commutation fabriqué selon ce procédé
WO2012126831A1 (fr) 2011-03-18 2012-09-27 Mitsubishi Chemical Europe Gmbh Procédé de fabrication d'un support de circuit
US8309640B2 (en) 2008-05-23 2012-11-13 Sabic Innovative Plastics Ip B.V. High dielectric constant laser direct structuring materials

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EP0917597B1 (fr) 1997-06-06 2003-01-15 LPKF Laser & Electronics Aktiengesellschaft Procede de production de structures de pistes conductrices, en particulier de structures fines de pistes conductrices, disposees sur un materiau support non conducteur
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WO2012056416A1 (fr) 2010-10-26 2012-05-03 Sabic Innovative Plastics Ip B.V Matériaux de structuration directe au laser avec prise en compte de toutes les couleurs
EP2476723A1 (fr) 2011-01-14 2012-07-18 LPKF Laser & Electronics AG Procédé de métallisation sélective d'un substrat ainsi que support de commutation fabriqué selon ce procédé
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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016092473A1 (fr) * 2014-12-12 2016-06-16 Sabic Global Technologies B.V. Matériaux à structuration directe par laser et leurs procédés de fabrication
US10822505B2 (en) 2015-07-28 2020-11-03 Merck Patent Gmbh Laser-markable polymers and coatings
WO2017016645A1 (fr) * 2015-07-28 2017-02-02 Merck Patent Gmbh Polymères et revêtements pouvant être marqués au laser
CN107849290A (zh) * 2015-07-28 2018-03-27 默克专利股份有限公司 可激光标记的聚合物和涂料
CN107849290B (zh) * 2015-07-28 2021-05-28 默克专利股份有限公司 可激光标记的聚合物和涂料
US11370911B2 (en) * 2017-01-11 2022-06-28 Shpp Global Technologies B.V. Laser platable thermoplastic compositions with a laser activatable metal compound and shaped articles therefrom
WO2019042906A1 (fr) * 2017-08-29 2019-03-07 Merck Patent Gmbh Additif sensible au laser et additif pour matières plastiques à structuration directe par laser
WO2019149900A1 (fr) * 2018-02-02 2019-08-08 Sivantos Pte. Ltd. Composition de fabrication de composants de prothèse auditive
CN112119128A (zh) * 2018-05-16 2020-12-22 默克专利股份有限公司 激光添加剂及其在聚合物材料中的用途
CN112119128B (zh) * 2018-05-16 2022-03-01 默克专利股份有限公司 激光添加剂及其在聚合物材料中的用途
WO2019219557A1 (fr) * 2018-05-16 2019-11-21 Merck Patent Gmbh Additif laser et son utilisation dans des matériaux polymères
US11999858B2 (en) 2018-05-16 2024-06-04 Merck Patent Gmbh Laser additive and its use in polymer materials
WO2020126188A1 (fr) * 2018-12-19 2020-06-25 Mep Europe B.V. Composition thermoplastique pour structuration directe au laser
WO2020126189A1 (fr) * 2018-12-19 2020-06-25 Mep Europe B.V. Composition de polycarbonate pour structuration directe par laser
US11912863B2 (en) 2018-12-19 2024-02-27 Mep Europe B.V. Thermoplastic composition for laser direct structuring

Also Published As

Publication number Publication date
CN105230133A (zh) 2016-01-06
CN105230133B (zh) 2019-01-15
TWI632205B (zh) 2018-08-11
TW201510109A (zh) 2015-03-16
JP6423418B2 (ja) 2018-11-14
KR20160005742A (ko) 2016-01-15
JP2016520139A (ja) 2016-07-11
KR102171893B1 (ko) 2020-10-30
EP2995178A1 (fr) 2016-03-16
WO2014180550A1 (fr) 2014-11-13

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