KR102171893B1 - Lds 플라스틱용 첨가제 - Google Patents

Lds 플라스틱용 첨가제 Download PDF

Info

Publication number
KR102171893B1
KR102171893B1 KR1020157034593A KR20157034593A KR102171893B1 KR 102171893 B1 KR102171893 B1 KR 102171893B1 KR 1020157034593 A KR1020157034593 A KR 1020157034593A KR 20157034593 A KR20157034593 A KR 20157034593A KR 102171893 B1 KR102171893 B1 KR 102171893B1
Authority
KR
South Korea
Prior art keywords
core
coating
tio
composite pigment
lds
Prior art date
Application number
KR1020157034593A
Other languages
English (en)
Korean (ko)
Other versions
KR20160005742A (ko
Inventor
헬게 베티나 크니쓰
울리히 퀴트만
올리버 로베르트 피닝
실비아 로젠베르거
Original Assignee
메르크 파텐트 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 메르크 파텐트 게엠베하 filed Critical 메르크 파텐트 게엠베하
Publication of KR20160005742A publication Critical patent/KR20160005742A/ko
Application granted granted Critical
Publication of KR102171893B1 publication Critical patent/KR102171893B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2231—Oxides; Hydroxides of metals of tin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0227—Insulating particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
KR1020157034593A 2013-05-07 2014-05-05 Lds 플라스틱용 첨가제 KR102171893B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013007750.8A DE102013007750A1 (de) 2013-05-07 2013-05-07 Additiv für LDS-Kunststoffe
DE102013007750.8 2013-05-07
PCT/EP2014/001183 WO2014180550A1 (fr) 2013-05-07 2014-05-05 Additif pour matières plastiques à structuration directe par laser

Publications (2)

Publication Number Publication Date
KR20160005742A KR20160005742A (ko) 2016-01-15
KR102171893B1 true KR102171893B1 (ko) 2020-10-30

Family

ID=50828857

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157034593A KR102171893B1 (ko) 2013-05-07 2014-05-05 Lds 플라스틱용 첨가제

Country Status (7)

Country Link
EP (1) EP2995178A1 (fr)
JP (1) JP6423418B2 (fr)
KR (1) KR102171893B1 (fr)
CN (1) CN105230133B (fr)
DE (1) DE102013007750A1 (fr)
TW (1) TWI632205B (fr)
WO (1) WO2014180550A1 (fr)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9676927B2 (en) * 2014-04-09 2017-06-13 The Shepherd Color Company Core-shell composite inorganic metal oxides and method of preparing for prevention of thermal oxidative degradation in polymer and resin compositions
KR102079655B1 (ko) * 2014-12-12 2020-04-08 사빅 글로벌 테크놀러지스 비.브이. 폴리머 필름 및 시트의 레이저-직접 구조화 및 제조 방법
CN107001813A (zh) * 2014-12-12 2017-08-01 沙特基础工业全球技术公司 激光直接结构化材料及其制备方法
CN107849290B (zh) * 2015-07-28 2021-05-28 默克专利股份有限公司 可激光标记的聚合物和涂料
JP6441874B2 (ja) * 2015-12-24 2018-12-19 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング層形成用組成物、キット、およびメッキ層付樹脂成形品の製造方法
WO2018095834A1 (fr) * 2016-11-22 2018-05-31 Merck Patent Gmbh Additif pour matériaux polymères pouvant être marqués au laser et pouvant être soudés au laser
KR101970510B1 (ko) * 2016-11-30 2019-04-22 유림특수화학 주식회사 광반응성 필러를 이용한 코팅용 도료
CN106751389B (zh) * 2016-11-30 2019-03-26 上海中镭新材料科技有限公司 一种浅色的用于lds技术的工程塑料及其制备方法
EP3568432B1 (fr) * 2017-01-11 2024-03-20 SHPP Global Technologies B.V. Composition à conductivité thermique et efficacité de placage au laser par additif lds à structure noyau-enveloppe avec des composés métalliques enduits une sur surface de charge minérale
US11370911B2 (en) * 2017-01-11 2022-06-28 Shpp Global Technologies B.V. Laser platable thermoplastic compositions with a laser activatable metal compound and shaped articles therefrom
CN110268013A (zh) * 2017-01-11 2019-09-20 沙特基础工业全球技术公司 具有可激光活化金属化合物的可激光镀敷热塑性组合物及其成形制品
WO2019042906A1 (fr) * 2017-08-29 2019-03-07 Merck Patent Gmbh Additif sensible au laser et additif pour matières plastiques à structuration directe par laser
CN111670213A (zh) * 2018-02-02 2020-09-15 西万拓私人有限公司 用于制造助听器部件的组合物
EP3543291A1 (fr) 2018-03-21 2019-09-25 SABIC Global Technologies B.V. Compositions thermoplastiques plaquables par laser ayant une bonne ininflammabilité, une propriété thermique élevée et une bonne ductilité et articles moulés ainsi fabriqués
WO2019219557A1 (fr) * 2018-05-16 2019-11-21 Merck Patent Gmbh Additif laser et son utilisation dans des matériaux polymères
EP3898808B1 (fr) * 2018-12-19 2022-05-04 MEP Europe B.V. Composition de polycarbonate pour structuration directe au laser
US11258184B2 (en) 2019-08-21 2022-02-22 Ticona Llc Antenna system including a polymer composition having a low dissipation factor
US11637365B2 (en) 2019-08-21 2023-04-25 Ticona Llc Polymer composition for use in an antenna system
US11912817B2 (en) 2019-09-10 2024-02-27 Ticona Llc Polymer composition for laser direct structuring
US11555113B2 (en) 2019-09-10 2023-01-17 Ticona Llc Liquid crystalline polymer composition
US11917753B2 (en) 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies
US11646760B2 (en) 2019-09-23 2023-05-09 Ticona Llc RF filter for use at 5G frequencies
US11721888B2 (en) 2019-11-11 2023-08-08 Ticona Llc Antenna cover including a polymer composition having a low dielectric constant and dissipation factor
CN115700014A (zh) 2020-02-26 2023-02-03 提克纳有限责任公司 电路结构
JP7501131B2 (ja) 2020-06-11 2024-06-18 住友ベークライト株式会社 Ｌｄｓ用熱硬化性樹脂組成物および構造体
CN113831672B (zh) * 2020-06-24 2023-05-16 华为机器有限公司 共混的热塑性复合材料、天线支架及终端
JP6907393B1 (ja) 2020-08-05 2021-07-21 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
US11728559B2 (en) 2021-02-18 2023-08-15 Ticona Llc Polymer composition for use in an antenna system
CN115926521B (zh) * 2022-12-13 2024-02-13 惠州市日大实业有限公司 数字信号纳米涂料及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007505959A (ja) 2003-09-17 2007-03-15 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド レーザーマーキング可能な高分子組成物
WO2012126831A1 (fr) * 2011-03-18 2012-09-27 Mitsubishi Chemical Europe Gmbh Procédé de fabrication d'un support de circuit
JP2013144767A (ja) 2011-03-18 2013-07-25 Mitsubishi Engineering Plastics Corp 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
JP2014074160A (ja) 2012-09-14 2014-04-24 Mitsubishi Engineering Plastics Corp レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法
JP2014074161A (ja) 2012-09-14 2014-04-24 Mitsubishi Engineering Plastics Corp レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法
JP2014074162A (ja) 2012-09-14 2014-04-24 Mitsubishi Engineering Plastics Corp レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832560B2 (ja) * 1987-05-15 1996-03-29 テイカ株式会社 複合導電性粉末およびその製造法
JPH09249820A (ja) * 1996-03-15 1997-09-22 Titan Kogyo Kk 白色導電性粉末及びその製造方法
DE19723734C2 (de) 1997-06-06 2002-02-07 Gerhard Naundorf Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial und Verfahren zu ihrer Herstellung
DE10132092A1 (de) 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
US7507511B2 (en) * 2005-01-14 2009-03-24 Ricoh Company Ltd. Electrophotographic photoreceptor, and image forming apparatus and process cartridge therefor using the electrophotographic photoreceptor
US8309640B2 (en) 2008-05-23 2012-11-13 Sabic Innovative Plastics Ip B.V. High dielectric constant laser direct structuring materials
AU2010225226A1 (en) * 2009-03-18 2011-11-10 Merck Patent Gmbh Pigment for laser marking
JP2013545832A (ja) 2010-10-26 2013-12-26 サビック・イノベーティブ・プラスチックス・アイピー・ベスローテン・フェンノートシャップ すべての色特性を有するレーザダイレクトストラクチャリング材料
DE102011000138A1 (de) 2011-01-14 2012-07-19 Lpkf Laser & Electronics Ag Verfahren zur selektiven Metallisierung eines Substrats sowie ein nach diesem Verfahren hergestellter Schaltungsträger

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007505959A (ja) 2003-09-17 2007-03-15 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド レーザーマーキング可能な高分子組成物
WO2012126831A1 (fr) * 2011-03-18 2012-09-27 Mitsubishi Chemical Europe Gmbh Procédé de fabrication d'un support de circuit
JP2013144767A (ja) 2011-03-18 2013-07-25 Mitsubishi Engineering Plastics Corp 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
JP2014074160A (ja) 2012-09-14 2014-04-24 Mitsubishi Engineering Plastics Corp レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法
JP2014074161A (ja) 2012-09-14 2014-04-24 Mitsubishi Engineering Plastics Corp レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法
JP2014074162A (ja) 2012-09-14 2014-04-24 Mitsubishi Engineering Plastics Corp レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法

Also Published As

Publication number Publication date
TWI632205B (zh) 2018-08-11
JP6423418B2 (ja) 2018-11-14
EP2995178A1 (fr) 2016-03-16
CN105230133B (zh) 2019-01-15
KR20160005742A (ko) 2016-01-15
TW201510109A (zh) 2015-03-16
CN105230133A (zh) 2016-01-06
DE102013007750A1 (de) 2014-11-13
JP2016520139A (ja) 2016-07-11
WO2014180550A1 (fr) 2014-11-13

Similar Documents

Publication Publication Date Title
KR102171893B1 (ko) Lds 플라스틱용 첨가제
US9982113B2 (en) Additive for LDS plastics
KR102399145B1 (ko) 코어-쉘 복합물 무기 금속 산화물 및 중합체 및 수지 조성물에서 열 산화적 분해의 방지를 위한 제조 방법
WO2018100026A1 (fr) Composition thermoplastique
WO2015144630A1 (fr) Composition polymère, article l'utilisant et procédé de préparation correspondant
TWI507467B (zh) 用於形成導電圖案之組成物和方法、及其上具有導電圖案的樹脂結構體
EP3016109B1 (fr) Composition permettant de former des motifs conducteurs, procédé permettant de former des motifs conducteurs l'utilisant et structure de résine comportant des motifs conducteurs
CN101331191B (zh) 聚亚芳基硫醚树脂组合物
JP2017531053A (ja) 導電性パターン形成用組成物および導電性パターンを有する樹脂構造体
JP6224842B2 (ja) 導電性パターン形成用組成物および導電性パターンを有する樹脂構造体
KR101895510B1 (ko) 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
EP3139388B1 (fr) Composition pour formation de motif conducteur, procédé de formation de motif conducteur l'utilisant et structure de résine ayant un motif conducteur
KR101771664B1 (ko) 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
EP3154064B1 (fr) Composition pour formation de motif conducteur, procédé de formation de motif conducteur l'utilisant, et structure en résine avec motif conducteur
KR101983271B1 (ko) 도전성 패턴 형성용 조성물 및 도전성 패턴을 가지는 수지 구조체
EP3154066B1 (fr) Composition pour la formation d'un motif conducteur, et structure en résine possédant un motif conducteur

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant