JP6417345B2 - 電気接続箱およびワイヤハーネス - Google Patents

電気接続箱およびワイヤハーネス Download PDF

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Publication number
JP6417345B2
JP6417345B2 JP2016030394A JP2016030394A JP6417345B2 JP 6417345 B2 JP6417345 B2 JP 6417345B2 JP 2016030394 A JP2016030394 A JP 2016030394A JP 2016030394 A JP2016030394 A JP 2016030394A JP 6417345 B2 JP6417345 B2 JP 6417345B2
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JP
Japan
Prior art keywords
bus bar
semiconductor relay
substrate
input bus
output bus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016030394A
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English (en)
Japanese (ja)
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JP2017147914A (ja
JP2017147914A5 (enExample
Inventor
景亮 木村
景亮 木村
池田　直幸
直幸 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP2016030394A priority Critical patent/JP6417345B2/ja
Publication of JP2017147914A publication Critical patent/JP2017147914A/ja
Publication of JP2017147914A5 publication Critical patent/JP2017147914A5/ja
Application granted granted Critical
Publication of JP6417345B2 publication Critical patent/JP6417345B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Connection Or Junction Boxes (AREA)
JP2016030394A 2016-02-19 2016-02-19 電気接続箱およびワイヤハーネス Active JP6417345B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016030394A JP6417345B2 (ja) 2016-02-19 2016-02-19 電気接続箱およびワイヤハーネス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016030394A JP6417345B2 (ja) 2016-02-19 2016-02-19 電気接続箱およびワイヤハーネス

Publications (3)

Publication Number Publication Date
JP2017147914A JP2017147914A (ja) 2017-08-24
JP2017147914A5 JP2017147914A5 (enExample) 2017-10-05
JP6417345B2 true JP6417345B2 (ja) 2018-11-07

Family

ID=59682446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016030394A Active JP6417345B2 (ja) 2016-02-19 2016-02-19 電気接続箱およびワイヤハーネス

Country Status (1)

Country Link
JP (1) JP6417345B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7136563B2 (ja) * 2018-02-05 2022-09-13 矢崎総業株式会社 パワー半導体デバイス、及びそのパワー半導体デバイスを備える車両用電源供給システム
WO2019215977A1 (ja) * 2018-05-09 2019-11-14 日立オートモティブシステムズ株式会社 電子制御装置
WO2021002006A1 (ja) * 2019-07-04 2021-01-07 三菱電機株式会社 半導体装置、電力変換装置および半導体装置の製造方法
KR102856144B1 (ko) * 2021-07-15 2025-09-04 주식회사 엘지에너지솔루션 배터리 팩 및 이를 포함하는 자동차

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002027634A (ja) * 2000-07-03 2002-01-25 Yazaki Corp 配線板の接続構造
JP4002074B2 (ja) * 2001-03-30 2007-10-31 矢崎総業株式会社 車載用電装ユニット
JP5012401B2 (ja) * 2007-10-19 2012-08-29 住友電装株式会社 電気接続箱

Also Published As

Publication number Publication date
JP2017147914A (ja) 2017-08-24

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