JP6414946B2 - 薄膜トランジスタおよびそのための酸化亜鉛系スパッタリングターゲット - Google Patents
薄膜トランジスタおよびそのための酸化亜鉛系スパッタリングターゲット Download PDFInfo
- Publication number
- JP6414946B2 JP6414946B2 JP2013133661A JP2013133661A JP6414946B2 JP 6414946 B2 JP6414946 B2 JP 6414946B2 JP 2013133661 A JP2013133661 A JP 2013133661A JP 2013133661 A JP2013133661 A JP 2013133661A JP 6414946 B2 JP6414946 B2 JP 6414946B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- zinc oxide
- oxide
- film transistor
- metal electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 title claims description 112
- 239000011787 zinc oxide Substances 0.000 title claims description 56
- 239000010409 thin film Substances 0.000 title claims description 50
- 238000005477 sputtering target Methods 0.000 title description 24
- 239000010408 film Substances 0.000 claims description 35
- 229910003437 indium oxide Inorganic materials 0.000 claims description 34
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 34
- 230000004888 barrier function Effects 0.000 claims description 29
- 239000004065 semiconductor Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 11
- 230000000903 blocking effect Effects 0.000 claims description 8
- 238000004458 analytical method Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 4
- 229910021480 group 4 element Inorganic materials 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 238000002441 X-ray diffraction Methods 0.000 claims description 2
- 238000005259 measurement Methods 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 238000005530 etching Methods 0.000 description 31
- 238000004519 manufacturing process Methods 0.000 description 16
- 239000000203 mixture Substances 0.000 description 16
- 238000004544 sputter deposition Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 15
- 239000002245 particle Substances 0.000 description 15
- 230000008569 process Effects 0.000 description 11
- 239000002270 dispersing agent Substances 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- 238000000151 deposition Methods 0.000 description 8
- 238000005245 sintering Methods 0.000 description 8
- 238000001238 wet grinding Methods 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 238000007740 vapor deposition Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011268 mixed slurry Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000001747 exhibiting effect Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 238000001694 spray drying Methods 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000009694 cold isostatic pressing Methods 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910017566 Cu-Mn Inorganic materials 0.000 description 1
- 229910017871 Cu—Mn Inorganic materials 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 238000003917 TEM image Methods 0.000 description 1
- 229910007541 Zn O Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- -1 amine salt Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920005646 polycarboxylate Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
- H01L29/78693—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate the semiconducting oxide being amorphous
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
Description
また、本発明は、酸化インジウムがドーピングされた酸化亜鉛を含む薄膜トランジスタ遮断膜蒸着用の酸化亜鉛系スパッタリングターゲットであって、酸化インジウムの量は、
該酸化亜鉛系スパッタリングターゲットの重量に対して1〜50wt%であることを特徴とする酸化亜鉛系スパッタリングターゲットを提供する。
また、本発明の遮断膜は、金属電極と同時に一括エッチングすることができるので、製造工程の簡素化に寄与することができる。従来は、金属電極のエッチングと遮断膜のエッチングが別途に行われなければならず、その製造工程が非効率的であった。
また、本発明の遮断膜は、遮断膜(Barrier)の役割をする特徴の他に、非伝導性酸化物層および金属層との接触性を良くする機能を有することにより、TFT素子を構成するにおいて、金属と酸化物層との間でオーミックコンタクトとなるべき部位のどこにも使用することができる。
また、本発明のスパッタリングターゲットは、DCスパッタリングが可能であり、高密度での製造が可能である。
まず、酸化亜鉛を、蒸留水と分散剤の混合液と混ぜて、分散平均粒径が0.1〜0.8μmとなるように湿式ミリングを実施する。さらに好ましくは、0.2〜0.6μmの範囲となるように調節する。このとき、添加される分散剤は酸化亜鉛に対して0.1〜2wt%であってよく、これは分散させようとする粒径に依存する。また、分散剤は、懸濁液状であって、酸化インジウムおよび酸化亜鉛の表面に容易に吸着することのできる構造を有していることが好ましく、このために、クエン酸といった有機酸やポリカルボン酸等が使用されてよい。分散剤は、粒子の高分散特性を具現するために、懸濁液のpHを変化させないようにすることが好ましく、このために、ポリカルボン酸塩といった形態からなる分散剤を使用してよい。
酸化亜鉛系スパッタリングターゲットを製造するために、酸化亜鉛の重量に対して1.0wt%の分散剤が添加された蒸留水に、約0.5μmの平均粒径を有する酸化亜鉛をスパッタリングターゲットの全重量に対してそれぞれ65、70、75wt%となるように添加した後、分散された平均粒径が0.2μmとなるように湿式ミリング法により粉砕/分散させた。その後、酸化インジウムに対して0.5wt%の分散剤と1μmの平均粒径を有する酸化インジウムを添加して、最終分散粒径が0.5μmとなるように湿式ミリングした。このとき、分散剤は、ポリアクリル酸アミン塩を使用した。
Claims (5)
- 金属電極と、
前記金属電極から物質が拡散することを遮断する酸化亜鉛系遮断膜と、
酸化物半導体層
とを含む薄膜トランジスタであって、
前記酸化亜鉛系遮断膜は、実質的に酸化インジウムがドーピングされた酸化亜鉛のみからなる結晶質薄膜であり、
該酸化インジウムの量は、該酸化亜鉛系遮断膜の重量に対して1〜50wt%であり、
前記金属電極は、ソース電極およびドレイン電極のうちの少なくともいずれか一つであり、
前記金属電極は銅を含み、
前記酸化亜鉛系遮断膜は、前記金属電極と前記酸化物半導体層との間に配され、
前記酸化物半導体層は、インジウム‐ガリウム‐亜鉛複合酸化物(IGZO)を含むことを特徴とする、薄膜トランジスタ。 - 前記酸化亜鉛系遮断膜は、第3族元素および第4族元素のうち少なくとも一つがさらにドーピングされることを特徴とする、請求項1に記載の薄膜トランジスタ。
- 前記酸化亜鉛系遮断膜は、比抵抗値が100〜10‐4Ω・cmであることを特徴とする、請求項1又は2に記載の薄膜トランジスタ。
- 前記酸化亜鉛系遮断膜は、X線回折(XRD)測定による半値全幅(FWHM)分析で10〜5000Åの結晶サイズを有することを特徴とする、請求項1〜3のいずれか1項に記載の薄膜トランジスタ。
- 前記薄膜トランジスタは、液晶ディスプレイ装置用または有機発光素子用の薄膜トランジスタであることを特徴とする、請求項1〜4のいずれか1項に記載の薄膜トランジスタ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0070390 | 2012-06-29 | ||
KR1020120070390A KR101389911B1 (ko) | 2012-06-29 | 2012-06-29 | 박막트랜지스터 및 이를 위한 산화아연계 스퍼터링 타겟 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017081358A Division JP2017163149A (ja) | 2012-06-29 | 2017-04-17 | 薄膜トランジスタおよびそのための酸化亜鉛系スパッタリングターゲット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014011465A JP2014011465A (ja) | 2014-01-20 |
JP6414946B2 true JP6414946B2 (ja) | 2018-10-31 |
Family
ID=49777169
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013133661A Active JP6414946B2 (ja) | 2012-06-29 | 2013-06-26 | 薄膜トランジスタおよびそのための酸化亜鉛系スパッタリングターゲット |
JP2017081358A Pending JP2017163149A (ja) | 2012-06-29 | 2017-04-17 | 薄膜トランジスタおよびそのための酸化亜鉛系スパッタリングターゲット |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017081358A Pending JP2017163149A (ja) | 2012-06-29 | 2017-04-17 | 薄膜トランジスタおよびそのための酸化亜鉛系スパッタリングターゲット |
Country Status (5)
Country | Link |
---|---|
US (1) | US9035297B2 (ja) |
JP (2) | JP6414946B2 (ja) |
KR (1) | KR101389911B1 (ja) |
CN (1) | CN103531638A (ja) |
TW (1) | TWI624068B (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101895421B1 (ko) * | 2011-02-24 | 2018-09-07 | 삼성디스플레이 주식회사 | 배선, 박막 트랜지스터, 및 박막 트랜지스터 표시판과 이들을 제조하는 방법들 |
WO2013070679A1 (en) | 2011-11-08 | 2013-05-16 | Tosoh Smd, Inc. | Silicon sputtering target with special surface treatment and good particle performance and methods of making the same |
KR101512819B1 (ko) * | 2013-02-27 | 2015-04-16 | 삼성코닝어드밴스드글라스 유한회사 | 산화아연계 스퍼터링 타겟, 그 제조방법 및 이를 통해 증착된 차단막을 갖는 박막트랜지스터 |
CN106164014A (zh) * | 2014-04-17 | 2016-11-23 | 住友金属矿山株式会社 | 氧化物烧结体、溅射用靶以及用其得到的氧化物半导体薄膜 |
KR102254524B1 (ko) * | 2014-09-22 | 2021-05-21 | 엘지디스플레이 주식회사 | 유기전계발광 표시장치 |
TWI653686B (zh) | 2015-08-26 | 2019-03-11 | 聯華電子股份有限公司 | 半導體結構與其製作方法 |
TWI650817B (zh) | 2015-08-28 | 2019-02-11 | 聯華電子股份有限公司 | 半導體元件及其製作方法 |
KR102436641B1 (ko) * | 2015-10-23 | 2022-08-26 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조방법 |
CN105261636B (zh) * | 2015-11-05 | 2018-04-27 | 京东方科技集团股份有限公司 | 一种薄膜晶体管、其制备方法、阵列基板及显示装置 |
US9793409B2 (en) * | 2016-01-14 | 2017-10-17 | Hon Hai Precision Industry Co., Ltd. | Thin film transistor array panel |
CN108878445B (zh) * | 2018-06-11 | 2021-01-26 | Tcl华星光电技术有限公司 | Tft基板及其制作方法 |
CN116162908A (zh) * | 2022-12-15 | 2023-05-26 | 先导薄膜材料(广东)有限公司 | 一种氧化铟锌靶材及其制备方法 |
CN116219375A (zh) * | 2022-12-15 | 2023-06-06 | 先导薄膜材料(广东)有限公司 | 一种氧化铟锌靶材及其制备方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11302836A (ja) * | 1998-04-21 | 1999-11-02 | Sumitomo Metal Mining Co Ltd | ZnO系焼結体 |
KR101051015B1 (ko) | 2004-10-28 | 2011-07-21 | 삼성전자주식회사 | 금속 배선, 이의 제조 방법, 이를 포함하는 어레이 기판및 이를 포함하는 액정 표시 패널 |
JP2006186309A (ja) * | 2004-11-30 | 2006-07-13 | Asahi Glass Co Ltd | 導電性積層体、プラズマディスプレイ用電磁波遮蔽フィルムおよびプラズマディスプレイ用保護板 |
JP5244295B2 (ja) * | 2005-12-21 | 2013-07-24 | 出光興産株式会社 | Tft基板及びtft基板の製造方法 |
JP2008108985A (ja) * | 2006-10-26 | 2008-05-08 | Kochi Prefecture Sangyo Shinko Center | 半導体素子の製法 |
US7964479B2 (en) * | 2007-02-19 | 2011-06-21 | Imec | Low-temperature formation of layers of polycrystalline semiconductor material |
KR100858088B1 (ko) * | 2007-02-28 | 2008-09-10 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법 |
JP4998058B2 (ja) * | 2007-04-09 | 2012-08-15 | 凸版印刷株式会社 | 太陽電池および太陽電池モジュールの製造方法 |
WO2008136505A1 (ja) * | 2007-05-08 | 2008-11-13 | Idemitsu Kosan Co., Ltd. | 半導体デバイス及び薄膜トランジスタ、並びに、それらの製造方法 |
JP5096250B2 (ja) | 2008-07-18 | 2012-12-12 | 出光興産株式会社 | 酸化物焼結体の製造方法、酸化物焼結体、スパッタリングタ−ゲット、酸化物薄膜、薄膜トランジスタの製造方法及び半導体装置 |
CN101719493B (zh) * | 2008-10-08 | 2014-05-14 | 株式会社半导体能源研究所 | 显示装置 |
JP2010120803A (ja) * | 2008-11-19 | 2010-06-03 | Tosoh Corp | 複合酸化物焼結体 |
JP5564331B2 (ja) * | 2009-05-29 | 2014-07-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
KR101578694B1 (ko) * | 2009-06-02 | 2015-12-21 | 엘지디스플레이 주식회사 | 산화물 박막 트랜지스터의 제조방법 |
KR101944656B1 (ko) * | 2009-06-30 | 2019-04-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 제조 방법 |
JP2012015491A (ja) * | 2010-06-04 | 2012-01-19 | Semiconductor Energy Lab Co Ltd | 光電変換装置 |
JP2013214537A (ja) * | 2010-06-29 | 2013-10-17 | Hitachi Ltd | 半導体装置 |
KR20130030295A (ko) * | 2010-07-02 | 2013-03-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
KR20130099074A (ko) | 2010-09-03 | 2013-09-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 스퍼터링 타겟 및 반도체 장치의 제작 방법 |
US8803143B2 (en) * | 2010-10-20 | 2014-08-12 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor including buffer layers with high resistivity |
-
2012
- 2012-06-29 KR KR1020120070390A patent/KR101389911B1/ko active IP Right Grant
-
2013
- 2013-06-26 JP JP2013133661A patent/JP6414946B2/ja active Active
- 2013-06-28 TW TW102123229A patent/TWI624068B/zh active
- 2013-06-28 US US13/931,697 patent/US9035297B2/en active Active
- 2013-07-01 CN CN201310272148.6A patent/CN103531638A/zh active Pending
-
2017
- 2017-04-17 JP JP2017081358A patent/JP2017163149A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN103531638A (zh) | 2014-01-22 |
JP2017163149A (ja) | 2017-09-14 |
KR101389911B1 (ko) | 2014-04-29 |
TWI624068B (zh) | 2018-05-11 |
KR20140003027A (ko) | 2014-01-09 |
TW201405836A (zh) | 2014-02-01 |
JP2014011465A (ja) | 2014-01-20 |
US9035297B2 (en) | 2015-05-19 |
US20140001469A1 (en) | 2014-01-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6414946B2 (ja) | 薄膜トランジスタおよびそのための酸化亜鉛系スパッタリングターゲット | |
JP6006202B2 (ja) | In2O3−SnO2−ZnO系スパッタリングターゲット | |
TWI410509B (zh) | A-IGZO oxide film | |
US20130341181A1 (en) | Zinc oxide-based sputtering target, method of manufacturing the same, and thin-film transistor having barrier layer deposited using the same | |
WO2012153522A1 (ja) | In2O3-ZnO系スパッタリングターゲット | |
US20090211903A1 (en) | Indium zinc oxide based sputtering target, method of manufacturing the same, and indium zinc oxide based thin film | |
US20170092780A1 (en) | Oxide sintered body, sputtering target, and oxide semiconductor thin film obtained using sputtering target | |
JP2019038735A (ja) | 酸化物焼結体、酸化物焼結体の製造方法、スパッタリング用ターゲット、及び非晶質の酸化物半導体薄膜 | |
US20170076943A1 (en) | Oxide sintered body, sputtering target, and oxide semiconductor thin film obtained using sputtering target | |
TW201638013A (zh) | 氧化物燒結體、濺鍍用靶、及使用其而得之氧化物半導體薄膜 | |
WO2017188299A1 (ja) | 酸化物焼結体、スパッタリングターゲット及び酸化物半導体膜 | |
US9688580B2 (en) | Oxide sintered body, sputtering target, and oxide semiconductor thin film obtained using sputtering target | |
TW201404909A (zh) | 氧化鋅系濺鍍靶、其製造方法、具有使用其沉積之阻絕層之薄膜電晶體、以及製造薄膜電晶體之方法 | |
TWI547573B (zh) | 氧化物燒結體、濺鍍用靶、及使用其而獲得之氧化物半導體薄膜 | |
KR101512819B1 (ko) | 산화아연계 스퍼터링 타겟, 그 제조방법 및 이를 통해 증착된 차단막을 갖는 박막트랜지스터 | |
TW202100487A (zh) | 濺鍍靶以及濺鍍靶的製造方法 | |
TW201339332A (zh) | In-Ga-Zn-O系氧化物燒結體與其製造方法及濺鍍靶與氧化物半導體膜 | |
Itose et al. | In 2 O 3—SnO 2—ZnO sputtering target |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20141021 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150629 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20150629 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160407 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160412 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160711 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20161220 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170417 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20170425 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20170616 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180507 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20181001 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6414946 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |