JP6414899B2 - 負極およびその製造方法、電池 - Google Patents
負極およびその製造方法、電池 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 79
- 239000011889 copper foil Substances 0.000 claims description 63
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 41
- 239000011149 active material Substances 0.000 claims description 40
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 32
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 27
- 229910052710 silicon Inorganic materials 0.000 claims description 27
- 239000010703 silicon Substances 0.000 claims description 24
- 239000002002 slurry Substances 0.000 claims description 21
- 239000007789 gas Substances 0.000 claims description 17
- 238000009832 plasma treatment Methods 0.000 claims description 17
- 229910052786 argon Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 229910000765 intermetallic Inorganic materials 0.000 claims description 16
- JUZTWRXHHZRLED-UHFFFAOYSA-N [Si].[Cu].[Cu].[Cu].[Cu].[Cu] Chemical compound [Si].[Cu].[Cu].[Cu].[Cu].[Cu] JUZTWRXHHZRLED-UHFFFAOYSA-N 0.000 claims description 15
- 229910021360 copper silicide Inorganic materials 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 14
- 229910021529 ammonia Inorganic materials 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000011230 binding agent Substances 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical group [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims description 8
- 229910001416 lithium ion Inorganic materials 0.000 claims description 8
- 239000007773 negative electrode material Substances 0.000 description 29
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 229910052799 carbon Inorganic materials 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- 239000002131 composite material Substances 0.000 description 8
- 239000011888 foil Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000003993 interaction Effects 0.000 description 6
- 239000007774 positive electrode material Substances 0.000 description 6
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 5
- 229910052744 lithium Inorganic materials 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011856 silicon-based particle Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- -1 copper nitride Chemical class 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- 239000005001 laminate film Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 2
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 2
- 238000004299 exfoliation Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 238000009830 intercalation Methods 0.000 description 2
- 230000002687 intercalation Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910013870 LiPF 6 Inorganic materials 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000007806 chemical reaction intermediate Substances 0.000 description 1
- 238000009831 deintercalation Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 229910021385 hard carbon Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000011255 nonaqueous electrolyte Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- SBNFWQZLDJGRLK-UHFFFAOYSA-N phenothrin Chemical compound CC1(C)C(C=C(C)C)C1C(=O)OCC1=CC=CC(OC=2C=CC=CC=2)=C1 SBNFWQZLDJGRLK-UHFFFAOYSA-N 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000007581 slurry coating method Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/62—Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
- H01M4/628—Inhibitors, e.g. gassing inhibitors, corrosion inhibitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
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- H01M4/04—Processes of manufacture in general
- H01M4/0402—Methods of deposition of the material
- H01M4/0404—Methods of deposition of the material by coating on electrode collectors
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- H—ELECTRICITY
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- H01M4/04—Processes of manufacture in general
- H01M4/0471—Processes of manufacture in general involving thermal treatment, e.g. firing, sintering, backing particulate active material, thermal decomposition, pyrolysis
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- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
- H01M4/134—Electrodes based on metals, Si or alloys
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- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
- H01M4/139—Processes of manufacture
- H01M4/1395—Processes of manufacture of electrodes based on metals, Si or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/36—Selection of substances as active materials, active masses, active liquids
- H01M4/362—Composites
- H01M4/366—Composites as layered products
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- H—ELECTRICITY
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- H01M4/36—Selection of substances as active materials, active masses, active liquids
- H01M4/38—Selection of substances as active materials, active masses, active liquids of elements or alloys
- H01M4/386—Silicon or alloys based on silicon
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
また、特許文献3には、突起部を有する負極集電体上に、負極集電体との界面で負極集電体と合金化しケイ素の単体および化合物のうちの少なくとも一種を含む負極活物質層を設けた負極が開示されている。
また、特許文献3の手法では、蒸着、焼結、塗布などにより負極活物質層を形成しているため、リチウムのインターカレーション、脱インターカレーションにより負極活物質層の体積の膨張・収縮が起こる。これに伴い、負極活物質と負極集電体(箔)を結着していたバインダにもズリ応力がかかり、最終的には負極集電体から負極活物質が剥がれるようになる。このように特許文献3の手法では、負極集電体と負極集電体層の接着性が不十分という課題があった。
銅箔をプラズマ処理する工程と、
プラズマ処理後の銅箔上に、シリコン原子を含有する活物質を含むスラリを塗布する工程と、
スラリを塗布した銅箔に熱処理を行い、前記銅箔と活物質の界面に銅とケイ素の金属間化合物を形成する工程と、
を有する負極の製造方法に関する。
銅箔と、
前記銅箔上に、シリコン原子を含有する活物質を含む活物質層と、
前記銅箔と前記活物質の界面に銅シリサイドと、
を有する負極に関する。
一実施形態の負極の製造方法は 銅箔をプラズマ処理する工程と、プラズマ処理後の銅箔上にシリコン原子を含有する活物質を含むスラリを塗布する工程と、スラリを塗布した銅箔に熱処理を行い銅箔と活物質の界面に銅とケイ素の金属間化合物を形成する工程を有する。
一実施形態の電池は、銅箔と、銅箔上にシリコン原子を含有する活物質を含む活物質層と、銅箔と活物質の界面に銅シリサイドと、を有する負極を有する。本実施形態の電池を構成する負極では、この銅シリサイド粒子の界面に存在する銅原子と銅箔を構成する銅原子との間、および銅シリサイド粒子の界面に存在するシリコン原子と活物質を構成するシリコン原子との間の相互作用が生じる。この相互作用により、充放電サイクル初期時の充放電に伴う活物質の膨張が起こっても、活物質と銅箔との密着性が向上する。従って、活物質の銅箔からの剥離が抑制され、電極抵抗の増大を抑制して充放電サイクル初期時に起こる電極容量の低下を抑制することができる。
まず、銅箔にプラズマを照射してプラズマ処理を行う。この場合のプラズマ照射装置は一般の大気圧環境でプラズマを発生するものであれば良いが、アンモニアやアルゴンガスの混合ガスを用いる場合、一般の大気に対し陰圧となるエアカーテン内で行うことが望ましい。プラズマ処理の方法としては、プラズマ源と箔との距離を20mmとし、まず、アルゴンのみを200sccmの流量で流した雰囲気下において下記表1に示す出力・温度でプラズマを5秒、照射した。この後、プラズマ照射の条件を維持したまま、アルゴンガスをアルゴンとアンモニアの混合ガスに連続的に切り替え、プラズマの照射を続けた。
2 バインダ
3 シリコン粒子
4 銅シリサイド
6 負極活物質層
7 負極集電体
8 負極
9 正極活物質層
10 正極集電体
11 正極
12 セパレータ
13 外装フィルム
14 負極リードタブ
15 正極リードタブ
Claims (7)
- 銅箔をプラズマ処理する工程と、
プラズマ処理後の銅箔上に、シリコン原子を含有する活物質を含むスラリを塗布する工程と、
スラリを塗布した銅箔に熱処理を行い、前記銅箔と活物質の界面に銅とケイ素の金属間化合物を形成する工程と、
を有し、
前記プラズマ処理は、アルゴン及びアンモニアを含有する混合ガスを用いて行い、前記混合ガス中のアルゴンとアンモニアの流量比である、アルゴン/アンモニアが2〜5であり、
前記熱処理を200〜330℃で行うことを特徴する負極の製造方法。 - 前記活物質は、シリコンおよび酸化シリコンからなる群から選択された少なくとも一種の材料を含み、
前記金属間化合物が銅シリサイドである、請求項1に記載の負極の製造方法。 - 混合ガスの流量を200〜300sccm、プラズマ出力電圧を1〜5kW、プラズマ源と前記銅箔の距離を10〜30mmとした条件下で前記プラズマ処理を行う、請求項1又は2に記載の負極の製造方法。
- 温度が250〜330℃、加熱時間が30分〜2時間の条件下で前記熱処理を行う、請求項1〜3の何れか1項に記載の負極の製造方法。
- 前記スラリは、更に、バインダと、導電付与材とを含む、請求項1〜4の何れか1項に記載の負極の製造方法。
- 請求項1〜5の何れか1項に記載の負極の製造方法を含む電池の製造方法。
- 前記電池は、リチウムイオン二次電池である請求項6に記載の電池の製造方法。
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WO2001031722A1 (fr) | 1999-10-22 | 2001-05-03 | Sanyo Electric Co., Ltd. | Electrode pour pile au lithium et accumulateur au lithium |
JP4245270B2 (ja) * | 2000-12-22 | 2009-03-25 | 三洋電機株式会社 | 二次電池用電極の製造方法 |
JP2002237294A (ja) * | 2001-02-08 | 2002-08-23 | Tokuyama Corp | リチウム二次電池用負極 |
JP3935067B2 (ja) | 2002-12-26 | 2007-06-20 | ソニー株式会社 | 二次電池用負極およびそれを用いた二次電池 |
JP4140425B2 (ja) * | 2003-04-10 | 2008-08-27 | ソニー株式会社 | 二次電池 |
JP4186115B2 (ja) * | 2003-06-11 | 2008-11-26 | ソニー株式会社 | リチウムイオン二次電池 |
JP2006004634A (ja) * | 2004-06-15 | 2006-01-05 | Matsushita Electric Ind Co Ltd | 非水電解質二次電池の製造方法およびこの方法によって作製された非水電解質二次電池 |
EP2065927B1 (en) * | 2007-11-27 | 2013-10-02 | Imec | Integration and manufacturing method of Cu germanide and Cu silicide as Cu capping layer |
JP2014199715A (ja) * | 2011-08-10 | 2014-10-23 | パナソニック株式会社 | リチウムイオン電池用負極とその製造方法及びリチウムイオン電池 |
US8841030B2 (en) * | 2012-01-24 | 2014-09-23 | Enovix Corporation | Microstructured electrode structures |
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