JP6399365B2 - 光電変換アセンブリの構造 - Google Patents
光電変換アセンブリの構造 Download PDFInfo
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- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
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- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
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- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2924/11—Device type
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- H01L2924/14—Integrated circuits
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- Engineering & Computer Science (AREA)
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- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
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Description
110 光電混合ケーブル
120 第1光電変換アセンブリ
130 第2光電変換アセンブリ
200 光学ベンチ
200a 光学ベンチ
200b くぼみ構造
201 第1配置領域(ベンチ)
202 第2配置領域(ベンチ)
203 第3くぼみ部分
204 レンズアレイ
205 レンズアレイ
204a 第4くぼみ部分
206 鏡面
210d 鏡面
207 ガイドピン
210 インターポーザ
210a インターポーザ
210b 光導波路部分
210c クラッド部分
210e V形溝
211 光受信素子
212 光源チップ
213 集積回路(IC)
214 集積回路(IC)
221 集積回路(IC)
215 導電性トレース
216 導電性トレース
217 導電性トレース
218 導電性トレース
220 プリント基板
220a 貫通孔
222 受動素子
224 電線ボンディングパッド
224a 電線ボンディングパッド
225 ボンディングパッド
230 プラグ
231 導電端
240a 電線
240b 電線
250 光学スリーブ
260 光ファイバ素子
261 光ファイバ
Claims (5)
- 光電変換アセンブリの構造であって、
光電変換モジュールと;
該光電変換モジュールに連結されるプリント基板と;
光を伝送する光ファイバ素子と;
該光電変換モジュールおよび該光ファイバ素子を接合する光学スリーブと;を含み、
このうち該光電変換モジュールの構造が、
導電性トレースが形成される回路基板と;
フリップチップにより該回路基板上に実装され、該回路基板上の該導電性トレースと電気的に接続される少なくとも1つの光学素子と;
第1くぼみ部及び第2くぼみ部を有する光学ベンチと;を含み、
該プリント基板の凹形状になっている端部が、該光学ベンチの両側に形成されている該第1くぼみ部上に配置され、該光電変換アセンブリの高さを削減するために、該回路基板は該光学ベンチの該第2くぼみ部に嵌め込まれ;
該プリント基板のボンディングパッドは、ワイヤボンディング工程によって該回路基板の該導電性トレースに電気的に接続される、
ことを特徴とする光電変換アセンブリの構造。 - 該プリント基板に連結される電線と;該プリント基板に電気的に接続されるボンディングパッドと;該回路基板上に形成されて、該少なくとも1つの光学素子に連結される導電性トレースと;該光学スリーブおよび該光学ベンチを接合するガイドピンと;をさらに含むことを特徴とする、請求項1に記載の光電変換アセンブリの構造。
- 該回路基板上に配置される少なくとも1つの集積回路チップをさらに含み、このうち該回路基板が、該回路基板の上表面から該回路基板の底部表面まで貫通する貫通孔を有することを特徴とする、請求項1に記載の光電変換アセンブリの構造。
- 光電変換アセンブリの構造であって、
光電変換モジュールと;
該光電変換モジュールに連結されるプリント基板と;
光を伝送する光ファイバ素子と;
該光電変換モジュールおよび該光ファイバ素子を接合する光学スリーブと;を含み、
このうち該光電変換モジュールの構造が、
導電性トレースが形成され、光導波路部分とV形溝を有し、該光導波路部分と該V形溝が中に形成されている、回路基板と;
フリップチップにより該回路基板上に実装され、該回路基板上の該導電性トレースと電気的に接続される少なくとも1つの光学素子と;
第1くぼみ部及び第2くぼみ部を有する光学ベンチと;を含み、
該プリント基板の凹形状になっている端部が該光学ベンチの両側に形成されている該第1くぼみ部上に配置され、該光電変換アセンブリの高さを削減するために、該回路基板は該光学ベンチの該第2くぼみ部に嵌め込まれ;
該プリント基板のボンディングパッドは、ワイヤボンディング工程によって該回路基板の該導電性トレースに電気的に接続される、
ことを特徴とする光電変換アセンブリの構造。 - 該回路基板上に配置される少なくとも1つの集積回路チップと;該プリント基板に連結される電線と;該プリント基板に電気的に接続されるボンディングパッドと;該回路基板上に形成されて、該少なくとも1つの光学素子に連結される導電性トレースと;該光学スリーブおよび該光学ベンチを接合するガイドピンと;をさらに含むことを特徴とする、請求項4に記載の光電変換アセンブリの構造。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104136084A TWI579611B (zh) | 2015-11-02 | 2015-11-02 | 光電轉換組件 |
TW104136084 | 2015-11-02 |
Publications (2)
Publication Number | Publication Date |
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JP2017090909A JP2017090909A (ja) | 2017-05-25 |
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TW (1) | TWI579611B (ja) |
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KR20210140726A (ko) | 2019-03-26 | 2021-11-23 | 닛토덴코 가부시키가이샤 | 커넥터 |
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KR20210140726A (ko) | 2019-03-26 | 2021-11-23 | 닛토덴코 가부시키가이샤 | 커넥터 |
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US20170126318A1 (en) | 2017-05-04 |
TWI579611B (zh) | 2017-04-21 |
CN106646773A (zh) | 2017-05-10 |
US10069566B2 (en) | 2018-09-04 |
TW201716815A (zh) | 2017-05-16 |
EP3163342A1 (en) | 2017-05-03 |
JP2017090909A (ja) | 2017-05-25 |
CN106646773B (zh) | 2020-12-15 |
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