JP6613524B2 - 光電気変換モジュール - Google Patents
光電気変換モジュール Download PDFInfo
- Publication number
- JP6613524B2 JP6613524B2 JP2016201678A JP2016201678A JP6613524B2 JP 6613524 B2 JP6613524 B2 JP 6613524B2 JP 2016201678 A JP2016201678 A JP 2016201678A JP 2016201678 A JP2016201678 A JP 2016201678A JP 6613524 B2 JP6613524 B2 JP 6613524B2
- Authority
- JP
- Japan
- Prior art keywords
- optical
- interposer
- photoelectric conversion
- conversion module
- lens array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
- G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4295—Coupling light guides with opto-electronic elements coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3873—Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
- G02B6/3885—Multicore or multichannel optical connectors, i.e. one single ferrule containing more than one fibre, e.g. ribbon type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
Description
101 光学ベンチ
101a くぼみ部分
101b くぼみ部分
102 くぼみ部分
102a くぼみ部分
103 レンズアレイ
104 レンズアレイ
105 鏡面
112 鏡面
106 ガイドピン
106a ガイド孔
106b ガイド孔
110 インターポーザ
110a インターポーザ
111 光導波路部分
113 V形溝
120 集積回路(IC)
130 集積回路(IC)
140 光源チップ
150 光受信素子
160 導電性トレース
161 導電性トレース
162 導電性トレース
163 導電性トレース
170 光学スリーブ
171 光ファイバ接続部分
172 光学ベンチ接続部分
180 光ファイバ素子
190 光ファイバ
Claims (5)
- インターポーザであって、該インターポーザ上に形成される導電性トレースと少なくとも一つの光学素子を有するインターポーザと、光学ベンチと、を含む光電気変換モジュールであって、
該光学素子はフリップチップ実装工程により該インターポーザ上に実装され、該インターポーザ上の該導電性トレースと電気的に接続され、
該光学ベンチは、射出成形工程によって、第1くぼみ部分、および、前記第1くぼみ部分に位置する第1レンズアレイが形成されており、
インターポーザ上の導電性トレースが、該インターポーザ外部の回路の端子と該インターポーザ表面と同一面上で接続できるように、該インターポーザを該光学ベンチに組み合わせるために、該インターポーザ全体が、該光学ベンチの該第1くぼみ部分内に嵌め込まれ付着されることを特徴とする光電気変換モジュール。 - さらに第2レンズアレイおよび鏡面を備え、該第1レンズアレイ、該第2レンズアレイ、および該鏡面が該光学ベンチを射出成形する工程によって形成されることを特徴とする、請求項1に記載の光電気変換モジュール。
- 該インターポーザ上に形成される少なくとも1つの集積回路チップをさらに含むことを特徴とする、請求項1に記載の光電気変換モジュール。
- 該インターポーザがさらに光導波路部分およびV形溝を含み、該光導波路部分および該V形溝が該インターポーザの内部に集積されていることを特徴とする、請求項1に記載の光電気変換モジュール。
- 該インターポーザ上に形成される少なくとも1つの集積回路チップをさらに含むことを特徴とする、請求項4に記載の光電気変換モジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104136083A TWI572935B (zh) | 2015-11-02 | 2015-11-02 | 光電轉換模組 |
TW104136083 | 2015-11-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017090900A JP2017090900A (ja) | 2017-05-25 |
JP6613524B2 true JP6613524B2 (ja) | 2019-12-04 |
Family
ID=56738034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016201678A Active JP6613524B2 (ja) | 2015-11-02 | 2016-10-13 | 光電気変換モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US9581776B1 (ja) |
EP (1) | EP3165953B1 (ja) |
JP (1) | JP6613524B2 (ja) |
CN (1) | CN106646772B (ja) |
TW (1) | TWI572935B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI579611B (zh) * | 2015-11-02 | 2017-04-21 | 峰川光電股份有限公司 | 光電轉換組件 |
TWI598653B (zh) * | 2016-03-16 | 2017-09-11 | 峰川光電股份有限公司 | 光電轉換組件 |
JP2018169551A (ja) * | 2017-03-30 | 2018-11-01 | 京セラ株式会社 | 光学部品、ならびにこれを備えた光コネクタおよび光モジュール |
TWI634357B (zh) * | 2017-07-04 | 2018-09-01 | 峰川光電股份有限公司 | 光電轉換模組 |
US10914901B2 (en) * | 2017-10-17 | 2021-02-09 | International Business Machines Corporation | Lateral mounting of optoelectronic chips on organic substrate |
US10903594B2 (en) * | 2018-10-01 | 2021-01-26 | Te Connectivity Corporation | Board-to-board connector assembly for add-in cards |
CA3117540A1 (en) | 2018-10-23 | 2020-04-30 | Cudoquanta Florida, Inc. | A demountable connection of an optical connector and an optical bench based connector using an alignment coupler |
US11443998B2 (en) * | 2019-06-05 | 2022-09-13 | Te Connectivity Solutions Gmbh | Electronic assembly including optical modules |
US11886023B2 (en) * | 2019-08-15 | 2024-01-30 | Ii-Vi Delaware, Inc. | Photonic optoelectronic module packaging |
CN110568569A (zh) * | 2019-09-18 | 2019-12-13 | 杭州耀芯科技有限公司 | 一种集成封装的光引擎及其信号发射、接收方法 |
US11567274B2 (en) * | 2020-08-17 | 2023-01-31 | Molex, Llc | Optical module |
US20220342162A1 (en) * | 2021-04-23 | 2022-10-27 | US Conec, Ltd | Optical assembly |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6048265U (ja) * | 1983-09-08 | 1985-04-04 | 富士通株式会社 | レ−ザダイオ−ドアレイモジユ−ル |
JPH06334262A (ja) * | 1993-03-23 | 1994-12-02 | Mitsubishi Electric Corp | 半導体レーザアレイ装置,半導体レーザ装置,及びそれらの製造方法 |
JP2001127373A (ja) * | 1999-10-29 | 2001-05-11 | Kyocera Corp | 光モジュール |
JP2004246279A (ja) * | 2003-02-17 | 2004-09-02 | Seiko Epson Corp | 光モジュール及びその製造方法、光通信装置、光電気混載集積回路、回路基板、電子機器 |
JP4925584B2 (ja) * | 2005-01-05 | 2012-04-25 | 富士通コンポーネント株式会社 | 光学部品 |
US7399125B1 (en) * | 2006-07-26 | 2008-07-15 | Lockheed Martin Corporation | Lens array with integrated folding mirror |
JP4690963B2 (ja) * | 2006-08-09 | 2011-06-01 | 株式会社日立製作所 | 多チャンネル光モジュールの製造方法 |
US7622708B2 (en) * | 2007-05-02 | 2009-11-24 | Hoya Corporation Usa | Optical element for free-space propagation between an optical waveguide and another optical waveguide, component, or device |
JP2010122312A (ja) * | 2008-11-17 | 2010-06-03 | Hitachi Cable Ltd | 送受信レンズブロック及びそれを用いた光モジュール |
CN102129102B (zh) * | 2010-01-14 | 2013-02-27 | 欣兴电子股份有限公司 | 线路基板及其制作方法 |
JP2013020027A (ja) * | 2011-07-08 | 2013-01-31 | Fujitsu Ltd | 光伝送路及び光伝送路の製造方法 |
JP5700297B2 (ja) * | 2011-09-13 | 2015-04-15 | 日立金属株式会社 | 光電変換モジュール付きケーブル |
EP2581776A1 (en) * | 2011-10-13 | 2013-04-17 | Tyco Electronics Svenska Holdings AB | Optical connector with alignment element, optical unit and assembly method |
US8548288B2 (en) * | 2011-12-20 | 2013-10-01 | Oracle International Corporation | Efficient inter-chip optical coupling |
JP5314119B2 (ja) * | 2011-12-26 | 2013-10-16 | 株式会社フジクラ | 光モジュール |
CN103185932A (zh) * | 2011-12-30 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | 光纤连接器 |
CN202815279U (zh) * | 2012-09-05 | 2013-03-20 | 开曼群岛商众达电子股份有限公司 | 透镜模块与光收发装置 |
TWI572927B (zh) * | 2013-01-17 | 2017-03-01 | 鴻海精密工業股份有限公司 | 光通訊模組 |
US10606003B2 (en) * | 2013-08-02 | 2020-03-31 | Luxtera, Inc. | Method and system for an optical coupler for silicon photonics devices |
CN104576674B (zh) * | 2014-12-25 | 2017-07-11 | 南昌欧菲光电技术有限公司 | 摄像头模组及其影像感测晶片封装结构 |
-
2015
- 2015-11-02 TW TW104136083A patent/TWI572935B/zh not_active IP Right Cessation
- 2015-11-02 US US14/929,617 patent/US9581776B1/en active Active
-
2016
- 2016-08-16 CN CN201610670941.5A patent/CN106646772B/zh not_active Expired - Fee Related
- 2016-08-18 EP EP16184721.5A patent/EP3165953B1/en active Active
- 2016-10-13 JP JP2016201678A patent/JP6613524B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN106646772B (zh) | 2021-04-20 |
CN106646772A (zh) | 2017-05-10 |
TW201716814A (zh) | 2017-05-16 |
TWI572935B (zh) | 2017-03-01 |
EP3165953A1 (en) | 2017-05-10 |
US9581776B1 (en) | 2017-02-28 |
EP3165953B1 (en) | 2021-09-01 |
JP2017090900A (ja) | 2017-05-25 |
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