JP6398318B2 - 光トランシーバ - Google Patents
光トランシーバ Download PDFInfo
- Publication number
- JP6398318B2 JP6398318B2 JP2014105067A JP2014105067A JP6398318B2 JP 6398318 B2 JP6398318 B2 JP 6398318B2 JP 2014105067 A JP2014105067 A JP 2014105067A JP 2014105067 A JP2014105067 A JP 2014105067A JP 6398318 B2 JP6398318 B2 JP 6398318B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- holder
- icr
- optical transceiver
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims description 101
- 239000000835 fiber Substances 0.000 description 39
- 230000010287 polarization Effects 0.000 description 36
- 230000005540 biological transmission Effects 0.000 description 11
- 238000005452 bending Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 210000000078 claw Anatomy 0.000 description 7
- 230000001427 coherent effect Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000010396 two-hybrid screening Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/44—Electric circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optical Couplings Of Light Guides (AREA)
Description
Claims (7)
- 信号光の送信または受信を行う光モジュールと、
前記光モジュールと電気的に接続された回路を搭載する回路基板と、
前記回路基板に搭載されて前記光モジュールを保持するホルダと、
前記光モジュールと前記回路とを接続する第1のフレキシブルプリント基板と、を備え、
前記第1のフレキシブルプリント基板は、前記ホルダと前記回路基板との間に形成された第1の隙間を通過して前記ホルダの外側に延在し、前記ホルダの外側において折り返されて前記第1の隙間の中で前記回路基板上の第1の電極に接続される、
光トランシーバ。 - さらに第2のフレキシブルプリント基板を備え、
前記第1のフレキシブルプリント基板は、前記光モジュールの一側方において前記光モジュールと電気的に接続され、前記一側方から前記第1の隙間を通過して前記光モジュールの他の側方の前記ホルダの外側に延在し、前記外側で折り曲げられた後前記第1の隙間に通されて前記第1の電極に接続され、
前記第2のフレキシブルプリント基板は、前記光モジュールの他の側方において前記光モジュールに電気的に接続され、前記光モジュールの他の側方の前記ホルダの外側で折り曲げられ前記第1のフレキシブルプリント基板と前記回路基板との間に形成された第2の隙間の中で前記回路基板上に形成された第2の電極に接続される、
請求項1に記載の光トランシーバ。 - 前記第1のフレキシブルプリント基板の前記ホルダの外側で折り曲げられた箇所の曲率は、前記第2のフレキシブルプリント基板の前記ホルダの外側で折り曲げられた箇所の曲率よりも小さい、
請求項2に記載の光トランシーバ。 - 前記回路基板は、第1の面を有し、
前記ホルダは、前記回路基板の前記第1の面に搭載され、
前記第1の電極及び前記第2の電極は、前記回路基板の前記第1の面上に形成されている、
請求項2又は3に記載の光トランシーバ。 - 前記ホルダは、前記光モジュールを保持するラッチと、前記回路基板に対する前記ホルダの位置を決める折り曲げ部と、を有する、
請求項1〜4のいずれか一項に記載の光トランシーバ。 - 前記ラッチは、前記光モジュールとは反対の側に突き出し前記回路基板との間に前記第1の隙間を形成する弾性部を有する、
請求項5に記載の光トランシーバ。 - 前記第2の電極は、前記第1の電極よりも前記光モジュールの他の側方の前記ホルダの外側に近い位置に配置されている、
請求項4に記載の光トランシーバ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014105067A JP6398318B2 (ja) | 2014-05-21 | 2014-05-21 | 光トランシーバ |
US14/715,776 US9743546B2 (en) | 2014-05-21 | 2015-05-19 | Optical transceiver and method to assemble the same |
CN201510262783.5A CN105093439B (zh) | 2014-05-21 | 2015-05-21 | 光收发器及其组装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014105067A JP6398318B2 (ja) | 2014-05-21 | 2014-05-21 | 光トランシーバ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015219478A JP2015219478A (ja) | 2015-12-07 |
JP6398318B2 true JP6398318B2 (ja) | 2018-10-03 |
Family
ID=54557088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014105067A Expired - Fee Related JP6398318B2 (ja) | 2014-05-21 | 2014-05-21 | 光トランシーバ |
Country Status (3)
Country | Link |
---|---|
US (1) | US9743546B2 (ja) |
JP (1) | JP6398318B2 (ja) |
CN (1) | CN105093439B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6295811B2 (ja) | 2014-05-08 | 2018-03-20 | 住友電気工業株式会社 | 光トランシーバ |
JP6398318B2 (ja) | 2014-05-21 | 2018-10-03 | 住友電気工業株式会社 | 光トランシーバ |
CN105846309A (zh) * | 2016-05-23 | 2016-08-10 | 国神光电科技(上海)有限公司 | 一种光电器件 |
US10224660B2 (en) * | 2016-10-18 | 2019-03-05 | Microsoft Technology Licensing, Llc | Threaded circuit board |
JP7035321B2 (ja) * | 2017-03-01 | 2022-03-15 | 住友電気工業株式会社 | 光トランシーバ |
JP7069558B2 (ja) * | 2017-03-31 | 2022-05-18 | 住友大阪セメント株式会社 | 光通信モジュール及びそれに用いる光変調器 |
KR101992142B1 (ko) * | 2017-06-29 | 2019-06-24 | (주)파이버피아 | 이종 서비스를 결합하기 위한 광모듈 |
CN107230913B (zh) * | 2017-07-28 | 2023-08-15 | 安费诺电子装配(厦门)有限公司 | 多角度弯折超薄型高速连接器及其组装工艺 |
EP3796059B1 (en) * | 2019-09-20 | 2023-09-06 | Adtran Networks SE | Storage tray for protecting optical fibers mechanically coupled to an optoelectronic device |
CN115603824B (zh) * | 2022-11-29 | 2023-03-10 | 上海三菲半导体有限公司 | 一种快速提高模拟蝶形激光器增益的方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3905246B2 (ja) | 1999-05-06 | 2007-04-18 | 富士通株式会社 | マルチ波長安定化装置、マルチ定波長光源装置、波長分割多重方式用光源装置および波長判別装置 |
JP4515141B2 (ja) * | 2003-04-30 | 2010-07-28 | 株式会社フジクラ | 光トランシーバ |
US7209664B1 (en) | 2003-06-10 | 2007-04-24 | Nortel Networks Limited | Frequency agile transmitter and receiver architecture for DWDM systems |
JP4566089B2 (ja) * | 2005-08-08 | 2010-10-20 | 日本電信電話株式会社 | フレキシブル基板を使用した双方向光トランシーバ |
JP2007071980A (ja) * | 2005-09-05 | 2007-03-22 | Mitsubishi Electric Corp | 光モジュール |
JP2008071784A (ja) * | 2006-09-12 | 2008-03-27 | Mitsubishi Electric Corp | 光送受信器 |
US8545111B2 (en) * | 2007-06-28 | 2013-10-01 | Nippon Telegraph And Telephone Corporation | Optical module |
JP5223050B2 (ja) * | 2008-03-17 | 2013-06-26 | 独立行政法人産業技術総合研究所 | 光モジュール |
US8167505B2 (en) * | 2008-09-18 | 2012-05-01 | Sumitomo Electric Industries, Ltd. | Pluggable system between optical transceiver and host system |
US8380073B2 (en) * | 2011-05-24 | 2013-02-19 | Sumitomo Electric Industries, Ltd. | Optical transceiver implemented with tunable LD |
US9042735B2 (en) | 2011-12-13 | 2015-05-26 | Sumitomo Electric Industries, Ltd. | Optical transceiver having an extra area in circuit board for mounting electronic circuits |
JP2013156438A (ja) | 2012-01-30 | 2013-08-15 | Japan Oclaro Inc | 光送受信モジュール用ケージ |
US8849129B2 (en) | 2012-07-20 | 2014-09-30 | Finisar Corporation | Method and apparatus for stabilization of optical transmitter |
KR101512816B1 (ko) * | 2012-10-08 | 2015-04-17 | 한국전자통신연구원 | 플렉시블 인쇄회로기판 및 이를 포함하는 광통신 모듈 |
TWM459412U (zh) * | 2013-04-02 | 2013-08-11 | Luxnet Corp | 光連接器封裝結構 |
KR20150030098A (ko) * | 2013-09-11 | 2015-03-19 | 한국전자통신연구원 | 착탈형 광 트랜시버 |
TWM484713U (zh) * | 2014-03-10 | 2014-08-21 | Luxnet Corp | 可替換式光發射模組及搭載有可替換式光發射模組的光收發器 |
JP6295811B2 (ja) | 2014-05-08 | 2018-03-20 | 住友電気工業株式会社 | 光トランシーバ |
JP6398318B2 (ja) | 2014-05-21 | 2018-10-03 | 住友電気工業株式会社 | 光トランシーバ |
-
2014
- 2014-05-21 JP JP2014105067A patent/JP6398318B2/ja not_active Expired - Fee Related
-
2015
- 2015-05-19 US US14/715,776 patent/US9743546B2/en active Active
- 2015-05-21 CN CN201510262783.5A patent/CN105093439B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN105093439B (zh) | 2018-11-27 |
US9743546B2 (en) | 2017-08-22 |
CN105093439A (zh) | 2015-11-25 |
US20150342075A1 (en) | 2015-11-26 |
JP2015219478A (ja) | 2015-12-07 |
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