JP6392163B2 - 配線基板及びその製造方法、半導体装置 - Google Patents

配線基板及びその製造方法、半導体装置 Download PDF

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Publication number
JP6392163B2
JP6392163B2 JP2015085102A JP2015085102A JP6392163B2 JP 6392163 B2 JP6392163 B2 JP 6392163B2 JP 2015085102 A JP2015085102 A JP 2015085102A JP 2015085102 A JP2015085102 A JP 2015085102A JP 6392163 B2 JP6392163 B2 JP 6392163B2
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wiring
adhesive layer
opening
substrate
semiconductor element
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Japanese (ja)
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JP2016207743A (ja
JP2016207743A5 (enExample
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小林　和貴
和貴 小林
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2015085102A priority Critical patent/JP6392163B2/ja
Priority to US15/090,791 priority patent/US9685391B2/en
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    • H01L23/367—Cooling facilitated by shape of device
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2015085102A 2015-04-17 2015-04-17 配線基板及びその製造方法、半導体装置 Active JP6392163B2 (ja)

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JP2015085102A JP6392163B2 (ja) 2015-04-17 2015-04-17 配線基板及びその製造方法、半導体装置
US15/090,791 US9685391B2 (en) 2015-04-17 2016-04-05 Wiring board and semiconductor package

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US10629557B2 (en) 2016-12-30 2020-04-21 Intel Corporation Improving mechanical and thermal reliability in varying form factors
FR3065319B1 (fr) * 2017-04-13 2019-04-26 Institut Vedecom Module electronique de puissance et convertisseur electrique de puissance l’incorporant
WO2020196752A1 (ja) 2019-03-28 2020-10-01 株式会社村田製作所 モジュール
TWI851818B (zh) * 2019-09-26 2024-08-11 日商富士軟片股份有限公司 導熱層的製造方法、積層體的製造方法及半導體器件的製造方法
WO2022009300A1 (ja) * 2020-07-07 2022-01-13 株式会社メイコー 絶縁性放熱ブロック付き基板及びその製造方法
CN113380753B (zh) * 2021-05-21 2025-09-12 日月光半导体制造股份有限公司 半导体封装装置
US20230227959A1 (en) * 2022-01-17 2023-07-20 Amulaire Thermal Technology, Inc. Method for manufacturing patterned surface coating and automobile heat dissipation device having patterned surface coating

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