JP6392015B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP6392015B2
JP6392015B2 JP2014147442A JP2014147442A JP6392015B2 JP 6392015 B2 JP6392015 B2 JP 6392015B2 JP 2014147442 A JP2014147442 A JP 2014147442A JP 2014147442 A JP2014147442 A JP 2014147442A JP 6392015 B2 JP6392015 B2 JP 6392015B2
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JP
Japan
Prior art keywords
heat
bottom wall
housing
circuit component
heat absorbing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014147442A
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English (en)
Japanese (ja)
Other versions
JP2016024575A (ja
JP2016024575A5 (enExample
Inventor
由喜彦 畑
由喜彦 畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2014147442A priority Critical patent/JP6392015B2/ja
Priority to US14/688,850 priority patent/US20160021786A1/en
Publication of JP2016024575A publication Critical patent/JP2016024575A/ja
Publication of JP2016024575A5 publication Critical patent/JP2016024575A5/ja
Application granted granted Critical
Publication of JP6392015B2 publication Critical patent/JP6392015B2/ja
Active legal-status Critical Current
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
JP2014147442A 2014-07-18 2014-07-18 電子機器 Active JP6392015B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014147442A JP6392015B2 (ja) 2014-07-18 2014-07-18 電子機器
US14/688,850 US20160021786A1 (en) 2014-07-18 2015-04-16 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014147442A JP6392015B2 (ja) 2014-07-18 2014-07-18 電子機器

Publications (3)

Publication Number Publication Date
JP2016024575A JP2016024575A (ja) 2016-02-08
JP2016024575A5 JP2016024575A5 (enExample) 2017-08-24
JP6392015B2 true JP6392015B2 (ja) 2018-09-19

Family

ID=55075845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014147442A Active JP6392015B2 (ja) 2014-07-18 2014-07-18 電子機器

Country Status (2)

Country Link
US (1) US20160021786A1 (enExample)
JP (1) JP6392015B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9965003B2 (en) * 2015-07-09 2018-05-08 Htc Corporation Electronic assembly and electronic device
ES2939610T3 (es) * 2016-12-29 2023-04-25 Huawei Tech Co Ltd Aparato terminal que comprende un dispositivo de disipación de calor
TWI626877B (zh) * 2017-04-28 2018-06-11 廣達電腦股份有限公司 電子裝置及其散熱模組
US10276248B1 (en) 2017-12-20 2019-04-30 Sandisk Technologies Llc Early ramp down of dummy word line voltage during read to suppress select gate transistor downshift
JP2020030694A (ja) * 2018-08-23 2020-02-27 レノボ・シンガポール・プライベート・リミテッド 電子機器
US20200236806A1 (en) * 2019-01-18 2020-07-23 United Arab Emirates University Heat sink with internal chamber for phase change material
CN110267499B (zh) * 2019-06-28 2020-12-15 Oppo广东移动通信有限公司 壳体组件及其制备方法以及电子设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6202739B1 (en) * 1998-11-25 2001-03-20 Motorola, Inc. Apparatus including a heat-dissipating apparatus, and method for forming same
FR2803166B1 (fr) * 1999-12-28 2002-05-31 Thomson Csf Sextant Module electronique a haut pouvoir de refroidissement
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
TW537436U (en) * 2002-05-31 2003-06-11 Quanta Comp Inc Three-phase variable heat conducting structure
TW540989U (en) * 2002-10-04 2003-07-01 Via Tech Inc Thin planar heat distributor
JP2004152895A (ja) * 2002-10-29 2004-05-27 Sony Corp 冷却装置および冷却装置を有する電子機器
TW200532422A (en) * 2004-03-16 2005-10-01 Ind Tech Res Inst Thermal module with heat reservoir and method of applying the same on electronic products
KR100659582B1 (ko) * 2004-12-10 2006-12-20 한국전자통신연구원 루프형 마이크로 열이송 장치
JPWO2007020697A1 (ja) * 2005-08-18 2009-02-19 日立プラズマディスプレイ株式会社 フラットディスプレイ装置
FR2907634B1 (fr) * 2006-10-24 2016-08-19 Thales Sa Boitier electrique a cartes electroniques comportant des caloducs
FR2977121B1 (fr) * 2011-06-22 2014-04-25 Commissariat Energie Atomique Systeme de gestion thermique a materiau a volume variable
JP5895444B2 (ja) * 2011-10-20 2016-03-30 セイコーエプソン株式会社 印刷装置
US9277676B2 (en) * 2012-08-23 2016-03-01 Kabushiki Kaisha Toshiba Electronic apparatus
JP2014041553A (ja) * 2012-08-23 2014-03-06 Toshiba Corp 電子機器
CN103796481B (zh) * 2012-10-31 2016-07-13 英业达科技有限公司 电子装置
JP2014109387A (ja) * 2012-11-30 2014-06-12 Toshiba Corp 冷却装置、およびこの冷却装置を備えた電子機器
JP6311222B2 (ja) * 2013-04-30 2018-04-18 日本電気株式会社 電子機器及び放熱方法

Also Published As

Publication number Publication date
JP2016024575A (ja) 2016-02-08
US20160021786A1 (en) 2016-01-21

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