WO2018049788A1 - 一种主pcba板 - Google Patents

一种主pcba板 Download PDF

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Publication number
WO2018049788A1
WO2018049788A1 PCT/CN2017/073981 CN2017073981W WO2018049788A1 WO 2018049788 A1 WO2018049788 A1 WO 2018049788A1 CN 2017073981 W CN2017073981 W CN 2017073981W WO 2018049788 A1 WO2018049788 A1 WO 2018049788A1
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WO
WIPO (PCT)
Prior art keywords
chip
heat
pcba board
main pcba
substrate
Prior art date
Application number
PCT/CN2017/073981
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English (en)
French (fr)
Inventor
黄文丰
符大富
Original Assignee
深圳市掌网科技股份有限公司
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Publication of WO2018049788A1 publication Critical patent/WO2018049788A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

Definitions

  • a main PCBA board A main PCBA board
  • the present invention relates to the field of electronic technology, and more particularly to a main PCBA board.
  • the present invention proposes a main PCBA board which can solve the problem that the temperature of the components around the chip is increased by the temperature of the chip.
  • a main PCBA board includes a substrate, a front surface of the substrate is provided with a chip, a shielding cover and a heat absorbing body including a phase change material, the shielding cover covers the chip, the chip and the shielding cover The heat absorbing body is filled between the heat absorbing body, and the heat sink is disposed on the back surface of the substrate.
  • the heat shield, the battery holder and the battery are arranged in order from the bottom to the top of the shield, and the battery bracket fixes the battery.
  • an LCD screen bracket and an LCD screen are sequentially disposed from the bottom to the top of the heat sink, and the LCD screen bracket fixes the LCD screen.
  • the heat absorbing body has a thickness of 1.5 mm or 2 mm.
  • the heat insulating sheet has a rectangular parallelepiped shape, and the lower surface of the heat insulating sheet has the same size as the upper surface of the shield, and the heat insulating sheet has a surface size of 60 mm*30 mm and a thickness of 200 ⁇ m or 500 ⁇ m.
  • the distance between the upper surface of the shield and the lower surface of the battery holder is 1.9 mm.
  • the distance between the upper surface of the heat sink and the lower surface of the LCD screen bracket is 1.75 mm
  • the present invention provides a main PCBA board, including a substrate, the front surface of the substrate is provided with a chip, a shielding cover and a heat absorbing body including a phase change material, the shielding cover covers the chip, the chip and the The heat absorbing body is filled between the shield covers, the heat absorbing body covers the chip, and a heat sink is disposed on a back surface of the substrate.
  • the main PCBA board of the invention is a main heat-generating component, and a heat absorbing body and a heat sink are arranged around the chip to absorb and dissipate most of the heat generated by the chip, thereby solving the temperature rise caused by the heat generated by the chip around the chip. The high temperature problem increases the life of the main PCBA board.
  • FIG. 1 is a schematic structural view of a main PCBA board of the present invention.
  • FIG. 2 is a schematic structural view of a front surface of a main PCBA board of the present invention.
  • FIG 3 is a schematic structural view of a back surface of a main PCBA board of the present invention.
  • a main PCBA board includes a substrate 1.
  • the front surface of the substrate 1 is provided with a chip 2, a shield 3 and a heat absorbing body 4 containing a phase change material.
  • the chip 2 is filled, the heat absorbing body 4 is filled between the chip 2 and the shield case 3, the heat absorbing body 4 covers the chip 2, and the heat sink 5 is disposed on the back surface of the substrate 1.
  • A represents the front side of the substrate 1
  • B represents the back side of the substrate 1.
  • the upper surface of all the components on the front side of the panel 1 refers to the side on which the substrate 1 is placed face up (face up) and the lower surface is the component facing downward; for the same reason, all components disposed on the back of the substrate 1
  • the upper surface refers to the substrate 1 reversed (back side up), the side of the component facing up, and the lower surface is the side of the component facing down
  • the shield 3 can protect the chip 2 from interference from other emissive devices or shield the chip 2 from interference with other devices.
  • the heat absorbing body 4 is mainly processed from a phase change material and is capable of absorbing heat generated by the chip.
  • the heat sink 4 is filled between the chip 2 and the shield 3, and the chip 2 is covered with the heat absorber 4, so that most of the heat radiated from the chip 2 can be absorbed, so that the shield is shielded.
  • the device above 3 is not affected by the heat generated by the chip 2, causing the temperature to rise, and the heat sink 5 is disposed on the other side (back side) of the substrate 1, so that the heat distribution on the back surface of the substrate 1 can be made uniform, instead of the heat concentrated on the chip 2 corresponding thereto.
  • the hot spots are formed in the place, and the temperature of the device distributed in the place corresponding to the chip 2 on the back surface of the substrate 1 is too high.
  • a heat insulating sheet 6, a battery holder 7 and a battery 8 are disposed in order from the bottom to the top of the shield cover 3, and the battery holder 7 fixes the battery 8;
  • the LCD panel holder 9 and the LCD panel 10 are disposed in order from the low to the top of the heat sink 5, and the LCD panel holder 9 fixes the LCD panel 10.
  • the heat absorbing body 4 absorbs most of the heat generated by the chip 2, and the heat insulating sheet 6 is disposed such that excess heat is isolated under the battery holder 7, preventing the battery 8 from being affected by the heat to cause an increase in temperature.
  • An LCD (Liquid Crystal Display) screen that is, a liquid crystal display, is disposed on the back surface of the substrate 1, and the heat sink 5 on the back surface of the substrate 1 causes the heat dissipated by the chip 2 to be uniformly dispersed to prevent the local temperature of the LCD panel 10 from being excessively high and damaged. .
  • the heat absorbing body 4 has a thickness of 1.5 mm or 2 mm.
  • the heat insulating sheet 6 has a rectangular parallelepiped shape
  • the lower surface of the heat insulating sheet 6 has the same size as the upper surface of the shield 3
  • the surface of the heat insulating sheet 6 has a surface size of 60 mm*30 mm and a thickness of 200 ⁇ m or 500 ⁇ m. .
  • the distance between the upper surface of the chip 2 and the upper surface of the shield 3 is 1.3 mm.
  • the distance between the upper surface of the shield case 3 and the lower surface of the battery holder 7 is 1.9 mm.
  • the main PCBA board provided by the embodiment of the invention is a main heat-generating component, and a heat absorbing body and a heat sink are arranged around the chip to absorb and dissipate most of the heat generated by the chip, thereby solving the components around the chip.
  • the problem of temperature rise caused by chip heating increases the life of the main PCBA board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Waveguide Aerials (AREA)

Abstract

一种主PCBA板，包括基板（1），所述基板（1）的正面设置有芯片（2）、屏蔽罩（3）和包括相变材料的吸热体（4），所述屏蔽罩（3）罩住所述芯片（2），所述芯片（2）与所述屏蔽罩（3）之间填充所述吸热体（4），所述吸热体（4）覆盖所述芯片（2），所述基板（1）的背面设置有散热片（5）。

Description

一种主 PCBA板 技术领域
[0001] 本发明涉及电子技术领域， 更具体地说， 涉及一种主 PCBA板。
背景技术
[0002] 主 PCBA板上布置有各类电子元器件， 其中芯片发热的问题尤为严重， 芯片周 围布置有非常多的电子元器件或其他部件， 且分布的间隔一般非常小， 芯片发 出的热量会导致这些器件温度升高， 这不仅会影响主 PCBA板的正常工作， 还降 低整个主 PCBA板的寿命。
技术问题
[0003] 本发明提出一种主 PCBA板， 能解决芯片周围的部件受芯片发热导致的温度升 高温度的问题。
问题的解决方案
技术解决方案
[0004] 为此， 本发明提出以下技术方案：
[0005] 一种主 PCBA板， 包括基板， 所述基板的正面设置有芯片、 屏蔽罩和包括相变 材料的吸热体， 所述屏蔽罩罩住所述芯片， 所述芯片与所述屏蔽罩之间填充所 述吸热体， 所述吸热体覆盖所述芯片， 所述基板的背面设置有散热片。
[0006] 其中， 所述屏蔽罩的上方由低到高依次设置有隔热片、 电池支架和电池， 所述 电池支架固定所述电池。
[0007] 其中， 所述散热片的上方由低至高依次设置有 LCD屏支架和 LCD屏， 所述 LCD 屏支架固定所述 LCD屏。
[0008] 其中， 所述吸热体的厚度为 1.5mm或 2mm。
[0009] 其中， 所述隔热片为长方体形状， 隔热片的下表面尺寸与屏蔽罩上表面的尺寸 相同， 隔热片的表面尺寸为 60mm*30mm， 厚度为 200μηι或 500μηι。
[0010] 其中， 所述基板的背面贴付 2片所述散热片， 2片散热片重叠， 每片散热片的厚 度为 25μηΐο [0011] 其中， 所述芯片的上表面与所述屏蔽罩的上表面之间的距离为 1.3mm。
[0012] 其中， 所述屏蔽罩的上表面与所述电池支架的下表面之间的距离为 1.9mm。
[0013] 其中， 所述散热片的上表面与所述 LCD屏支架的下表面之间的距离为 1.75mm
发明的有益效果
有益效果
[0014] 本发明提供一种主 PCBA板， 包括基板， 所述基板的正面设置有芯片、 屏蔽罩 和包括相变材料的吸热体， 所述屏蔽罩罩住所述芯片， 所述芯片与所述屏蔽罩 之间填充所述吸热体， 所述吸热体覆盖所述芯片， 所述基板的背面设置有散热 片。 本发明的主 PCBA板， 芯片为主要的发热部件， 在芯片的周围布置吸热体和 散热片， 吸收和散除芯片发出的大部分热量， 解决了芯片周围的部件受芯片发 热导致的温度升高温度的问题， 提高了主 PCBA板的寿命。
对附图的简要说明
附图说明
[0015] 图 1是本发明的一种主 PCBA板的结构示意图。
[0016] 图 2是本发明的一种主 PCBA板正面的结构示意图。
[0017] 图 3是本发明的一种主 PCBA板背面的结构示意图。
本发明的实施方式
[0018] 为了使本发明的目的、 技术方案及优点更加清楚明白， 以下结合附图及实施例 ， 对本发明进行进一步详细说明。 应当理解， 此处所描述的具体实施例仅用以 解释本发明， 并不用于限定本发明。
[0019] 如图 1所示， 一种主 PCBA板， 包括基板 1， 所述基板 1的正面设置有芯片 2、 屏 蔽罩 3和包含相变材料的吸热体 4， 所述屏蔽罩 3罩住所述芯片 2， 所述芯片 2与所 述屏蔽罩 3之间填充所述吸热体 4， 所述吸热体 4覆盖所述芯片 2， 所述基板 1的背 面设置有散热片 5。
[0020] 其中， A表示基板 1的正面， B表示基板 1的背面。 另外， 文中提及的设置在基 板 1正面的所有部件的上表面指的当基板 1正放 （正面朝上） 吋部件朝上的那一 面， 下表面是部件朝下的那一面； 同理， 设置在基板 1背面的所有部件的上表面 指的基板 1反放 （背面朝上） 吋部件朝上的那一面， 下表面是部件朝下的那一面
[0021] 屏蔽罩 3可使芯片 2工作吋免受其他发射性器件的干扰， 或屏蔽芯片 2对其他器 件工作的干扰。
[0022] 吸热体 4主要由相变材料加工而成， 能够吸收芯片发出的热量。
[0023] 在基板 1的正面， 芯片 2与屏蔽罩 3之间填充吸热体 4， 用吸热体 4覆盖所述芯片 2 ， 可以吸收掉芯片 2向上散发的大部分热量， 使得在屏蔽罩 3上方的器件不受芯 片 2发热的影响而导致温度升高， 在基板 1的另一面 （背面） 布置散热片 5， 能够 使得基板 1背面的热量分布均匀， 而不是热量集中在芯片 2对应的地方形成热点 ， 导致基板 1背面的芯片 2对应的地方分布的器件温度过高。
[0024] 如图 2-3所示， 所述屏蔽罩 3的上方由低到高依次设置有隔热片 6、 电池支架 7和 电池 8， 所述电池支架 7固定所述电池 8; 所述散热片 5的上方由低至高依次设置 有 LCD屏支架 9和 LCD屏 10， 所述 LCD屏支架 9固定所述 LCD屏 10。
[0025] 吸热体 4吸收了芯片 2发出的大部分热量， 隔热片 6的设置使得多余的热量被隔 离在电池支架 7的下方， 避免电池 8受该热量的影响导致温度升高。
[0026] LCD (Liquid Crystal Display) 屏， 即液晶显示屏， 设置在基板 1的背面， 基板 1 背面的散热片 5使芯片 2散发的热量被均匀分散， 避免 LCD屏 10局部温度过高而 损坏。
[0027] 其中， 所述吸热体 4的厚度为 1.5mm或 2mm。
[0028] 其中， 所述隔热片 6为长方体形状， 隔热片 6的下表面尺寸与屏蔽罩 3上表面的 尺寸相同， 隔热片 6的表面尺寸为 60mm*30mm， 厚度为 200μηι或 500μηι。
[0029] 其中， 所述基板 1的背面贴付 2片所述散热片 5， 2片散热片重叠， 每片散热片 5 的厚度为 25μηι。
[0030] 其中， 所述芯片 2的上表面与所述屏蔽罩 3的上表面之间的距离为 1.3mm。
[0031] 其中， 所述屏蔽罩 3的上表面与所述电池支架 7的下表面之间的距离为 1.9mm。
[0032] 其中， 所述散热片 5的上表面与所述 LCD屏支架 9的下表面之间的距离为 1.75m [0033] 本发明实施例提供的主 PCBA板， 芯片为主要的发热部件， 在芯片的周围布置 吸热体和散热片， 吸收和散除芯片发出的大部分热量， 解决了芯片周围的部件 受芯片发热导致的温度升高温度的问题， 提高了主 PCBA板的寿命。
[0034] 以上所述， 仅为本发明较佳的具体实施方式， 但本发明的保护范围并不局限于 此， 任何熟悉本技术领域的技术人员在本发明揭露的技术范围内， 可轻易想到 的变化或替换， 都应涵盖在本发明的保护范围之内。 因此， 本发明的保护范围 应该以权利要求的保护范围为准。

Claims

权利要求书
一种主 PCBA板， 其特征在于， 包括基板， 所述基板的正面设置有芯 片、 屏蔽罩和包括相变材料的吸热体， 所述屏蔽罩罩住所述芯片， 所 述芯片与所述屏蔽罩之间填充所述吸热体， 所述吸热体覆盖所述芯片 ， 所述基板的背面设置有散热片。
如权利要求 1所述的主 PCBA板， 其特征在于， 所述屏蔽罩的上方由 低到高依次设置有隔热片、 电池支架和电池， 所述电池支架固定所述 电池。
如权利要求 1所述的主 PCBA板， 其特征在于， 所述散热片的上方由 低至高依次设置有 LCD屏支架和 LCD屏， 所述 LCD屏支架固定所述 L CD屏。
如权利要求 1所述的主 PCBA板， 其特征在于， 所述吸热体的厚度为 1. 5mm或 2mm。
如权利要求 2所述的主 PCBA板， 其特征在于， 所述隔热片为长方体 形状， 隔热片的下表面尺寸与屏蔽罩上表面的尺寸相同， 隔热片的下 表面尺寸为 60mm*30mm， 厚度为 200μηι或 500μηι。
如权利要求 1所述的主 PCBA板， 其特征在于， 所述基板的背面贴付 2 片所述散热片， 2片散热片重叠， 每片散热片的厚度为 25μηι。
如权利要求 1所述的主 PCBA板， 其特征在于， 所述芯片的上表面与 所述屏蔽罩的上表面之间的距离为 1.3mm。
如权利要求 2所述的主 PCBA板， 其特征在于， 所述屏蔽罩的上表面 与所述电池支架的下表面之间的距离为 1.9mm。
如权利要求 3所述的主 PCBA板， 其特征在于， 所述散热片的上表面 与所述 LCD屏支架的下表面之间的距离为 1.75mm。
PCT/CN2017/073981 2016-09-14 2017-02-17 一种主pcba板 WO2018049788A1 (zh)

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CN201610826719.XA CN107820359A (zh) 2016-09-14 2016-09-14 一种主pcba板
CN201610826719.X 2016-09-14

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CN112672560A (zh) * 2020-12-18 2021-04-16 北京无线电计量测试研究所 一种控温装置

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