FR2907634B1 - Boitier electrique a cartes electroniques comportant des caloducs - Google Patents

Boitier electrique a cartes electroniques comportant des caloducs

Info

Publication number
FR2907634B1
FR2907634B1 FR0609300A FR0609300A FR2907634B1 FR 2907634 B1 FR2907634 B1 FR 2907634B1 FR 0609300 A FR0609300 A FR 0609300A FR 0609300 A FR0609300 A FR 0609300A FR 2907634 B1 FR2907634 B1 FR 2907634B1
Authority
FR
France
Prior art keywords
caloducks
electrical box
electronic cards
cards
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0609300A
Other languages
English (en)
Other versions
FR2907634A1 (fr
Inventor
Pierre Bertrou
Catherine Lavergne
Stephane Poveda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Priority to FR0609300A priority Critical patent/FR2907634B1/fr
Priority to PCT/EP2007/061101 priority patent/WO2008049770A1/fr
Priority to US12/446,640 priority patent/US20100002395A1/en
Publication of FR2907634A1 publication Critical patent/FR2907634A1/fr
Application granted granted Critical
Publication of FR2907634B1 publication Critical patent/FR2907634B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR0609300A 2006-10-24 2006-10-24 Boitier electrique a cartes electroniques comportant des caloducs Expired - Fee Related FR2907634B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0609300A FR2907634B1 (fr) 2006-10-24 2006-10-24 Boitier electrique a cartes electroniques comportant des caloducs
PCT/EP2007/061101 WO2008049770A1 (fr) 2006-10-24 2007-10-17 Boitier electronique a cartes electroniques comportant des caloducs
US12/446,640 US20100002395A1 (en) 2006-10-24 2007-10-17 Electronic housing with electronic boards comprising heat pipes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0609300A FR2907634B1 (fr) 2006-10-24 2006-10-24 Boitier electrique a cartes electroniques comportant des caloducs

Publications (2)

Publication Number Publication Date
FR2907634A1 FR2907634A1 (fr) 2008-04-25
FR2907634B1 true FR2907634B1 (fr) 2016-08-19

Family

ID=38171653

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0609300A Expired - Fee Related FR2907634B1 (fr) 2006-10-24 2006-10-24 Boitier electrique a cartes electroniques comportant des caloducs

Country Status (3)

Country Link
US (1) US20100002395A1 (fr)
FR (1) FR2907634B1 (fr)
WO (1) WO2008049770A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201116983A (en) * 2009-11-06 2011-05-16 Nat Univ Tsing Hua Heat dissipation structure of electronic apparatus
FR2956280A1 (fr) 2010-02-09 2011-08-12 Kontron Modular Computers Sa Dispositif auxiliaire d'evacuation par conduction de la chaleur produite par une carte electronique
RU2474888C2 (ru) * 2011-04-29 2013-02-10 Общество с ограниченной ответственностью "Видео Интернет Технологии" (ООО "Видео Интернет Технологии") Охлаждающее устройство для электронных компонентов
US10928139B1 (en) * 2013-08-16 2021-02-23 Advanced Cooling Technologies, Inc. Assembly and process for heat transfer with three surfaces
US9578781B2 (en) 2014-05-09 2017-02-21 Advanced Cooling Technologies, Inc. Heat management for electronic enclosures
KR102186842B1 (ko) * 2014-05-26 2020-12-04 엘지전자 주식회사 이동 단말기
JP6392015B2 (ja) * 2014-07-18 2018-09-19 株式会社東芝 電子機器
FR3040821B1 (fr) * 2015-09-08 2018-06-15 Thales Dispositif perfectionne de refroidissement d'une carte electronique par conduction
CN106304744B (zh) * 2016-10-07 2022-03-22 南京艾科美热能科技有限公司 一种锁紧条
US10034403B1 (en) 2017-03-09 2018-07-24 Advanced Cooling Technologies, Inc. Card retainer device
US10320051B2 (en) * 2017-06-30 2019-06-11 Intel Corporation Heat sink for 5G massive antenna array and methods of assembling same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4909752A (en) * 1989-03-31 1990-03-20 Honeywell, Inc. Circuit card retainer
US4994937A (en) * 1989-12-22 1991-02-19 Lockheed Corporation Hydraulic thermal clamp for electronic modules
US5414592A (en) * 1993-03-26 1995-05-09 Honeywell Inc. Heat transforming arrangement for printed wiring boards
US6781846B1 (en) * 1996-01-17 2004-08-24 Fujitsu Limited IC card and IC card cooling tray
JP3637304B2 (ja) * 2001-11-29 2005-04-13 株式会社東芝 小型電子機器
US6873528B2 (en) * 2002-05-28 2005-03-29 Dy 4 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
DE10259191A1 (de) * 2002-12-17 2004-07-08 Richard Wöhr GmbH Massiver, lüfterloser Industriecomputer für Schaltschrankeinbau und/oder Tischversion
US6839235B2 (en) * 2002-12-19 2005-01-04 Dy 4 Systems Inc. Embedded heat pipe for a conduction cooled circuit card assembly
JP2006524846A (ja) * 2003-05-13 2006-11-02 ザルマン テック カンパニー リミテッド コンピュータ
US20050099776A1 (en) * 2003-11-12 2005-05-12 Xue Liang A. Passive thermal switch
US6958912B2 (en) * 2003-11-18 2005-10-25 Intel Corporation Enhanced heat exchanger
IL159399A0 (en) * 2003-12-16 2004-06-01 Rafael Armament Dev Authority Integrated-circuit cooling system
US7193850B2 (en) * 2004-08-31 2007-03-20 Hamilton Sundstrand Corporation Integrated heat removal and vibration damping for avionic equipment
US20060109631A1 (en) * 2004-11-02 2006-05-25 Data Device Corporation Method and apparatus for connecting circuit cards employing a cooling technique to achieve desired temperature thresholds and card alignment
US7515418B2 (en) * 2005-09-26 2009-04-07 Curtiss-Wright Controls, Inc. Adjustable height liquid cooler in liquid flow through plate
US20070253169A1 (en) * 2006-05-01 2007-11-01 Honeywell International Inc. Wedgelock device for increased thermal conductivity of a printed wiring wiring assembly
US7349221B2 (en) * 2006-07-20 2008-03-25 Honeywell International Inc. Device for increased thermal conductivity between a printed wiring assembly and a chassis

Also Published As

Publication number Publication date
US20100002395A1 (en) 2010-01-07
WO2008049770A1 (fr) 2008-05-02
FR2907634A1 (fr) 2008-04-25

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