JP6391863B2 - トレンチmos型半導体装置 - Google Patents
トレンチmos型半導体装置 Download PDFInfo
- Publication number
- JP6391863B2 JP6391863B2 JP2018004845A JP2018004845A JP6391863B2 JP 6391863 B2 JP6391863 B2 JP 6391863B2 JP 2018004845 A JP2018004845 A JP 2018004845A JP 2018004845 A JP2018004845 A JP 2018004845A JP 6391863 B2 JP6391863 B2 JP 6391863B2
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- semiconductor element
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- igbt
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/926—Multiple bond pads having different sizes
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- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018004845A JP6391863B2 (ja) | 2018-01-16 | 2018-01-16 | トレンチmos型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018004845A JP6391863B2 (ja) | 2018-01-16 | 2018-01-16 | トレンチmos型半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014055728A Division JP6320808B2 (ja) | 2014-03-19 | 2014-03-19 | トレンチmos型半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018082207A JP2018082207A (ja) | 2018-05-24 |
| JP2018082207A5 JP2018082207A5 (https=) | 2018-07-05 |
| JP6391863B2 true JP6391863B2 (ja) | 2018-09-19 |
Family
ID=62199106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018004845A Active JP6391863B2 (ja) | 2018-01-16 | 2018-01-16 | トレンチmos型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6391863B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7686589B2 (ja) * | 2022-02-25 | 2025-06-02 | 株式会社日立製作所 | 半導体装置 |
| CN116895690B (zh) * | 2023-05-31 | 2024-03-08 | 海信家电集团股份有限公司 | 半导体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3914328B2 (ja) * | 1997-03-25 | 2007-05-16 | 株式会社ルネサステクノロジ | 電流検出セル付トレンチゲート半導体装置および電力変換装置 |
| JP4706462B2 (ja) * | 2005-12-07 | 2011-06-22 | トヨタ自動車株式会社 | 電流検出機能を有する半導体装置 |
| WO2010109596A1 (ja) * | 2009-03-24 | 2010-09-30 | トヨタ自動車株式会社 | 半導体装置 |
| JP5526849B2 (ja) * | 2010-02-18 | 2014-06-18 | 富士電機株式会社 | 半導体装置 |
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2018
- 2018-01-16 JP JP2018004845A patent/JP6391863B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018082207A (ja) | 2018-05-24 |
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